Works matching IS 03615235 AND DT 2006 AND VI 35 AND IP 11
Results: 21
Effects of Cu and Pd Addition on Au Bonding Wire/Al Pad Interfacial Reactions and Bond Reliability.
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- Journal of Electronic Materials, 2006, v. 35, n. 11, p. 2048, doi. 10.1007/s11664-006-0312-9
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Elemental Redistribution and Interfacial Reaction Mechanism for the Flip Chip Sn-3.0Ag-(0.5 or 1.5)Cu Solder Bump with Al/Ni(V)/Cu Under-Bump Metallization During Aging.
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- Journal of Electronic Materials, 2006, v. 35, n. 11, p. 2061, doi. 10.1007/s11664-006-0314-7
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Model of Shear Viscosity for Underfill Flows.
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- Journal of Electronic Materials, 2006, v. 35, n. 11, p. 2016, doi. 10.1007/s11664-006-0308-5
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Effect of Glass Frit Chemistry on the Physical and Electrical Properties of Thick-Film Ag Contacts for Silicon Solar Cells.
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- Journal of Electronic Materials, 2006, v. 35, n. 11, p. 2041, doi. 10.1007/s11664-006-0311-x
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Thermally Stable Ge/Cu/Ti Ohmic Contacts to n-type GaN.
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- Journal of Electronic Materials, 2006, v. 35, n. 11, p. 2035, doi. 10.1007/s11664-006-0310-y
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- Article
Effect of Settlement on Dense Slurry Flow in a Horizontal Channel.
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- Journal of Electronic Materials, 2006, v. 35, n. 11, p. 2026, doi. 10.1007/s11664-006-0309-4
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- Article
Realization of Very Long Wavelength Infrared Photovoltaic Detector Arrays on Mercury Cadmium Telluride Epitaxial Layers Grown on Si Substrates.
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- Journal of Electronic Materials, 2006, v. 35, n. 11, p. 2056, doi. 10.1007/s11664-006-0313-8
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- Article
High Dielectric Constant Polymer-Ceramic (Epoxy Varnish-Barium Titanate) Nanocomposites at Moderate Filler Loadings for Embedded Capacitors.
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- Journal of Electronic Materials, 2006, v. 35, n. 11, p. 2009, doi. 10.1007/s11664-006-0307-6
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- Article
Numerical Prediction of Fraction of Eutectic Phase in Sn-Ag-Cu Soldering Using the Phase-Field Method.
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- Journal of Electronic Materials, 2006, v. 35, n. 11, p. 1969, doi. 10.1007/s11664-006-0301-z
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Development of a High-Strength High-Conductivity Cu-Ni-P Alloy. Part II: Processing by Severe Deformation.
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- Journal of Electronic Materials, 2006, v. 35, n. 11, p. 2000, doi. 10.1007/s11664-006-0306-7
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Metal-Semiconductor Amorphous and Nanoscale Ge-Phase Composites Produced by Rapid Solidification and by Devitrification of an Amorphous Matrix.
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- Journal of Electronic Materials, 2006, v. 35, n. 11, p. 1986, doi. 10.1007/s11664-006-0304-9
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- Article
Lowering of Sn-Sb Alloy Melting Points Caused by Substrate Dissolution.
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- Journal of Electronic Materials, 2006, v. 35, n. 11, p. 1982, doi. 10.1007/s11664-006-0303-x
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- Article
Comparison of Sn2.8Ag20In and Sn10Bi10In Solders for Intermediate-Step Soldering.
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- Journal of Electronic Materials, 2006, v. 35, n. 11, p. 1975, doi. 10.1007/s11664-006-0302-y
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- Article
In-Situ Electromigration Study on Sn-Ag-Cu Solder Joint by Digital Image Speckle Analysis.
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- Journal of Electronic Materials, 2006, v. 35, n. 11, p. 1993, doi. 10.1007/s11664-006-0305-8
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- Article
Electromigration Effects on Intermetallic Growth at Wire-Bond Interfaces.
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- Journal of Electronic Materials, 2006, v. 35, n. 11, p. 1961, doi. 10.1007/s11664-006-0300-0
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- Article
Kinetics of AuSn<sub>4</sub> Migration in Lead-Free Solders.
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- Journal of Electronic Materials, 2006, v. 35, n. 11, p. 1948, doi. 10.1007/s11664-006-0298-3
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- Article
Kinetic Analysis of the Interfacial Reactions in Ni/Sn/Cu Sandwich Structures.
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- Journal of Electronic Materials, 2006, v. 35, n. 11, p. 1955, doi. 10.1007/s11664-006-0299-2
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- Article
Interfacial Reactions and Mechanical Properties of Ball-Grid-Array Solder Joints Using Cu-Cored Solder Balls.
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- Journal of Electronic Materials, 2006, v. 35, n. 11, p. 1937, doi. 10.1007/s11664-006-0297-4
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- Article
Development of Bi-Base High-Temperature Pb-Free Solders with Second-Phase Dispersion: Thermodynamic Calculation, Microstructure, and Interfacial Reaction.
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- Journal of Electronic Materials, 2006, v. 35, n. 11, p. 1926, doi. 10.1007/s11664-006-0295-6
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Thermal Stability of Cu(W) and Cu(Mo) Films for Advanced Barrierless Cu Metallization: Effects of Annealing Time.
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- Journal of Electronic Materials, 2006, v. 35, n. 11, p. 1933, doi. 10.1007/s11664-006-0296-5
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Suppression of Tin Whisker Formation on Fine Pitch Connectors by Surface Roughening.
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- Journal of Electronic Materials, 2006, v. 35, n. 11, p. 1918, doi. 10.1007/s11664-006-0294-7
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- Article