Works matching IS 03615235 AND DT 2006 AND VI 35 AND IP 11

Results: 21

Elemental Redistribution and Interfacial Reaction Mechanism for the Flip Chip Sn-3.0Ag-(0.5 or 1.5)Cu Solder Bump with Al/Ni(V)/Cu Under-Bump Metallization During Aging.

Published in:

Journal of Electronic Materials, 2006, v. 35, n. 11, p. 2061, doi. 10.1007/s11664-006-0314-7

By:

Guh-Yaw Jang;
Jenq-Gong Duh

Publication type:

Article

Realization of Very Long Wavelength Infrared Photovoltaic Detector Arrays on Mercury Cadmium Telluride Epitaxial Layers Grown on Si Substrates.

Published in:

Journal of Electronic Materials, 2006, v. 35, n. 11, p. 2056, doi. 10.1007/s11664-006-0313-8

By:

Gupta, S.;
Gopal, V.;
Tandon, R. P.

Publication type:

Article

Effects of Cu and Pd Addition on Au Bonding Wire/Al Pad Interfacial Reactions and Bond Reliability.

Published in:

Journal of Electronic Materials, 2006, v. 35, n. 11, p. 2048, doi. 10.1007/s11664-006-0312-9

By:

Sang-Ah Gam;
Hyoung-Joon Kim;
Jong-Soo Cho;
Yong-Jin Park;
Jeong-Tak Moon;
Kyung-Wook Paik

Publication type:

Article

Effect of Glass Frit Chemistry on the Physical and Electrical Properties of Thick-Film Ag Contacts for Silicon Solar Cells.

Published in:

Journal of Electronic Materials, 2006, v. 35, n. 11, p. 2041, doi. 10.1007/s11664-006-0311-x

By:

Hilali, Mohamed M.;
Sridharan, Srinivasan;
Khadilkar, Chandra;
Shaikh, Aziz;
Rohatgi, Ajeet;
Kim, Steve

Publication type:

Article

Thermally Stable Ge/Cu/Ti Ohmic Contacts to n-type GaN.

Published in:

Journal of Electronic Materials, 2006, v. 35, n. 11, p. 2035, doi. 10.1007/s11664-006-0310-y

By:

Mahadik, Nadeemullah;
Rao, Mulpuri V.;
Davydov, Albert V.

Publication type:

Article

Effect of Settlement on Dense Slurry Flow in a Horizontal Channel.

Published in:

Journal of Electronic Materials, 2006, v. 35, n. 11, p. 2026, doi. 10.1007/s11664-006-0309-4

By:

Yang, R.;
Sun, D. C.;
Park, Seungbae

Publication type:

Article

Model of Shear Viscosity for Underfill Flows.

Published in:

Journal of Electronic Materials, 2006, v. 35, n. 11, p. 2016, doi. 10.1007/s11664-006-0308-5

By:

Yang, R.;
Sun, D. C.;
Park, Seungbae

Publication type:

Article

High Dielectric Constant Polymer-Ceramic (Epoxy Varnish-Barium Titanate) Nanocomposites at Moderate Filler Loadings for Embedded Capacitors.

Published in:

Journal of Electronic Materials, 2006, v. 35, n. 11, p. 2009, doi. 10.1007/s11664-006-0307-6

By:

Jianwen Xu;
Bhattacharya, Swapan;
Pramanik, Pranabes;
Wong, C. P.

Publication type:

Article

Development of a High-Strength High-Conductivity Cu-Ni-P Alloy. Part II: Processing by Severe Deformation.

Published in:

Journal of Electronic Materials, 2006, v. 35, n. 11, p. 2000, doi. 10.1007/s11664-006-0306-7

By:

Belyakov, A.;
Murayama, M.;
Sakai, Y.;
Tsuzaki, K.;
Okubo, M.;
Eto, M.;
Kimura, T.

Publication type:

Article

In-Situ Electromigration Study on Sn-Ag-Cu Solder Joint by Digital Image Speckle Analysis.

Published in:

Journal of Electronic Materials, 2006, v. 35, n. 11, p. 1993, doi. 10.1007/s11664-006-0305-8

By:

Luhua Xu;
Pang, John H. L.

Publication type:

Article

Metal-Semiconductor Amorphous and Nanoscale Ge-Phase Composites Produced by Rapid Solidification and by Devitrification of an Amorphous Matrix.

Published in:

Journal of Electronic Materials, 2006, v. 35, n. 11, p. 1986, doi. 10.1007/s11664-006-0304-9

By:

Louzguine-Luzgin, D. V.;
Inoue, A.

Publication type:

Article

Lowering of Sn-Sb Alloy Melting Points Caused by Substrate Dissolution.

Published in:

Journal of Electronic Materials, 2006, v. 35, n. 11, p. 1982, doi. 10.1007/s11664-006-0303-x

By:

Sinn-Wen Chen;
Po-Yin Chen;
Chao-Hong Wang

Publication type:

Article

Comparison of Sn2.8Ag20In and Sn10Bi10In Solders for Intermediate-Step Soldering.

Published in:

Journal of Electronic Materials, 2006, v. 35, n. 11, p. 1975, doi. 10.1007/s11664-006-0302-y

By:

Sun-Kyoung Seo;
Moon Gi Cho;
Hyuck Mo Lee;
Won Kyoung Choi

Publication type:

Article

Numerical Prediction of Fraction of Eutectic Phase in Sn-Ag-Cu Soldering Using the Phase-Field Method.

Published in:

Journal of Electronic Materials, 2006, v. 35, n. 11, p. 1969, doi. 10.1007/s11664-006-0301-z

By:

Ode, Machiko;
Ueshima, Minoru;
Abe, Taichi;
Murakami, Hideyuki;
Onodera, Hidehiro

Publication type:

Article

Electromigration Effects on Intermetallic Growth at Wire-Bond Interfaces.

Published in:

Journal of Electronic Materials, 2006, v. 35, n. 11, p. 1961, doi. 10.1007/s11664-006-0300-0

By:

Orchard, H. T.;
Greer, A. L.

Publication type:

Article

Kinetic Analysis of the Interfacial Reactions in Ni/Sn/Cu Sandwich Structures.

Published in:

Journal of Electronic Materials, 2006, v. 35, n. 11, p. 1955, doi. 10.1007/s11664-006-0299-2

By:

Wang, S. J.;
Liu, C. Y.

Publication type:

Article

Kinetics of AuSn<sub>4</sub> Migration in Lead-Free Solders.

Published in:

Journal of Electronic Materials, 2006, v. 35, n. 11, p. 1948, doi. 10.1007/s11664-006-0298-3

By:

Chang, C. W.;
Ho, C. E.;
Yang, S. C.;
Kao, C. R.

Publication type:

Article

Interfacial Reactions and Mechanical Properties of Ball-Grid-Array Solder Joints Using Cu-Cored Solder Balls.

Published in:

Journal of Electronic Materials, 2006, v. 35, n. 11, p. 1937, doi. 10.1007/s11664-006-0297-4

By:

Chih-Ming Chen;
Huei-Chuan Lin

Publication type:

Article

Thermal Stability of Cu(W) and Cu(Mo) Films for Advanced Barrierless Cu Metallization: Effects of Annealing Time.

Published in:

Journal of Electronic Materials, 2006, v. 35, n. 11, p. 1933, doi. 10.1007/s11664-006-0296-5

By:

Chu, J. P.;
Lin, C. H.

Publication type:

Article

Development of Bi-Base High-Temperature Pb-Free Solders with Second-Phase Dispersion: Thermodynamic Calculation, Microstructure, and Interfacial Reaction.

Published in:

Journal of Electronic Materials, 2006, v. 35, n. 11, p. 1926, doi. 10.1007/s11664-006-0295-6

By:

Takaku, Yoshikazu;
Ohnuma, Ikuo;
Kainuma, Ryosuke;
Yamada, Yasushi;
Yagi, Yuji;
Nishibe, Yuji;
Ishida, Kiyohito

Publication type:

Article

Suppression of Tin Whisker Formation on Fine Pitch Connectors by Surface Roughening.

Published in:

Journal of Electronic Materials, 2006, v. 35, n. 11, p. 1918, doi. 10.1007/s11664-006-0294-7

By:

Takeuchi, Makoto;
Kamiyama, Kouichi;
Suganuma, Katsuaki

Publication type:

Article