Role of Shape-memory Alloy Reinforcements on Strain Evolution in Lead-free Solder Joints.
- Published in:
- Journal of Electronic Materials, 2006, v. 35, n. 10, p. 1902, doi. 10.1007/s11664-006-0174-1
- By:
- Publication type:
- Article
Works matching IS 03615235 AND DT 2006 AND VI 35 AND IP 10
Results: 19
1
2
Effects of Solder Alloy Constitutive Relationships on Impact Force Responses of Package-level Solder Joints Under Ball Impact Test.
- Published in:
- Journal of Electronic Materials, 2006, v. 35, n. 10, p. 1892, doi. 10.1007/s11664-006-0173-2
- By:
- Publication type:
- Article
3
Effect of Cu Additives on Sn Whisker Formation of Sn(Cu) Finishes.
- Published in:
- Journal of Electronic Materials, 2006, v. 35, n. 10, p. 1885, doi. 10.1007/s11664-006-0172-3
- By:
- Publication type:
- Article
4
Intergrowth Mechanism of Silicon Nanowires and Silver Dendrites.
- Published in:
- Journal of Electronic Materials, 2006, v. 35, n. 10, p. 1879, doi. 10.1007/s11664-006-0171-4
- By:
- Publication type:
- Article
5
Effect of Thermal Cycling on the Growth of Intermetallic Compounds at the Sn-Zn-Bi-In-P Lead-Free Solder/Cu Interface.
- Published in:
- Journal of Electronic Materials, 2006, v. 35, n. 10, p. 1873, doi. 10.1007/s11664-006-0170-5
- By:
- Publication type:
- Article
6
Insulator-to-Metal Phase Transformation of VO<sub>2</sub> Films upon Femtosecond Laser Excitation.
- Published in:
- Journal of Electronic Materials, 2006, v. 35, n. 10, p. 1866, doi. 10.1007/s11664-006-0169-y
- By:
- Publication type:
- Article
7
Metallurgical Reactions in Composite 90Pb10Sn/Lead-Free Solder Joints and Their Effect on Reliability of LTCC/PWB Assembly.
- Published in:
- Journal of Electronic Materials, 2006, v. 35, n. 10, p. 1857
- By:
- Publication type:
- Article
8
Microstrip Antenna on a High Dielectric Constant Substrate: BaTiO<sub>3</sub> (BTO)-CaCu<sub>3</sub>Ti<sub>4</sub>O<sub>12</sub>(CCTO) Composite Screen-Printed Thick Films.
- Published in:
- Journal of Electronic Materials, 2006, v. 35, n. 10, p. 1848, doi. 10.1007/s11664-006-0167-0
- By:
- Publication type:
- Article
9
Interfacial Reaction between Sn-Bi Alloy and Ni Substrate.
- Published in:
- Journal of Electronic Materials, 2006, v. 35, n. 10, p. 1842, doi. 10.1007/s11664-006-0166-1
- By:
- Publication type:
- Article
10
Poly- and Single-Crystalline h-GaN Grown on SiCN/Si(100) and SiCN/Si(111) Substrates by MOCVD.
- Published in:
- Journal of Electronic Materials, 2006, v. 35, n. 10, p. 1837, doi. 10.1007/s11664-006-0165-2
- By:
- Publication type:
- Article
11
Electroless Nickel Plating Process Model for Plated-Through-Hole Board Manufacturing.
- Published in:
- Journal of Electronic Materials, 2006, v. 35, n. 10, p. 1825, doi. 10.1007/s11664-006-0164-3
- By:
- Publication type:
- Article
12
Depressing Effect of 0.2wt.%Zn Addition into Sn-3.0Ag-0.5Cu Solder Alloy on the Intermetallic Growth with Cu Substrate during Isothermal Aging.
- Published in:
- Journal of Electronic Materials, 2006, v. 35, n. 10, p. 1818, doi. 10.1007/s11664-006-0163-4
- By:
- Publication type:
- Article
13
Effect of Reaction Time on Mechanical Strength of the Interface Formed between the Sn-Zn(-Bi) Solder and the Au/Ni/Cu Bond Pad.
- Published in:
- Journal of Electronic Materials, 2006, v. 35, n. 10, p. 1812, doi. 10.1007/s11664-006-0162-5
- By:
- Publication type:
- Article
14
Epitaxial Growth of GaN Layers on Metallic TiN Buffer Layers.
- Published in:
- Journal of Electronic Materials, 2006, v. 35, n. 10, p. 1806, doi. 10.1007/s11664-006-0161-6
- By:
- Publication type:
- Article
15
Atomic Bonding and Properties of Al-Cu Alloy with θ(Al<sub>2</sub>Cu).
- Published in:
- Journal of Electronic Materials, 2006, v. 35, n. 10, p. 1801, doi. 10.1007/s11664-006-0160-7
- By:
- Publication type:
- Article
16
Compositionally Graded Interface for Passivation of HgCdTe Photodiodes.
- Published in:
- Journal of Electronic Materials, 2006, v. 35, n. 10, p. 1793, doi. 10.1007/s11664-006-0159-0
- By:
- Publication type:
- Article
17
Development of a High-Strength High-Conductivity Cu-Ni-P Alloy. Part I: Characterization of Precipitation Products.
- Published in:
- Journal of Electronic Materials, 2006, v. 35, n. 10, p. 1787, doi. 10.1007/s11664-006-0158-1
- By:
- Publication type:
- Article
18
In-Situ Observation of Material Migration in Flip-Chip Solder Joints under Current Stressing.
- Published in:
- Journal of Electronic Materials, 2006, v. 35, n. 10, p. 1781, doi. 10.1007/s11664-006-0157-2
- By:
- Publication type:
- Article
19
Electrical Characteristics for Sn-Ag-Cu Solder Bump with Ti/Ni/Cu Under-Bump Metallization after Temperature Cycling Tests.
- Published in:
- Journal of Electronic Materials, 2006, v. 35, n. 10, p. 1773, doi. 10.1007/s11664-006-0156-3
- By:
- Publication type:
- Article