Works matching IS 03615235 AND DT 2006 AND VI 35 AND IP 1

Results: 30

A Simple Constitutive Model for Ratcheting Evolution of 63Sn-37Pb Solder under Multiaxial Loading.

Published in:

2006

By:

Xu Chen;
De-Hua Yu

Publication type:

Letter

Correction to.

Published in:: 2006
Publication type:: Correction Notice

Morphology and Growth Kinetics of Intermetallic Compounds in Solid-State Interfacial Reaction of Electroless Ni-P with Sn-Based Lead-Free Solders.

Published in:

Journal of Electronic Materials, 2006, v. 35, n. 1, p. 181, doi. 10.1007/s11664-006-0202-1

By:

Huang, M. L.;
Loeher, T.;
Manessis, D.;
Boettcher, L.;
Ostmann, A.;
Reichl, H.

Publication type:

Article

Investigation of Microstructural Processes during Ultrasonic Wedge/Wedge Bonding of AlSi1 Wires.

Published in:

Journal of Electronic Materials, 2006, v. 35, n. 1, p. 173, doi. 10.1007/s11664-006-0201-2

By:

Geißler, Ute;
Schneider-Ramelow, Martin;
Lang, Klaus-Dieter;
Reichl, Herbert

Publication type:

Article

Ultrathin CdSe Nanowire Field-Effect Transistors.

Published in:

Journal of Electronic Materials, 2006, v. 35, n. 1, p. 170, doi. 10.1007/s11664-006-0200-3

By:

Khandelwal, Anubhav;
Jena, Debdeep;
Grebinski, James W.;
Hull, Katherine Leigh;
Kuno, Masaru K.

Publication type:

Article

Intermetallic Compounds Formed during the Interfacial Reactions between Liquid In-49Sn Solder and Ni Substrates.

Published in:

Journal of Electronic Materials, 2006, v. 35, n. 1, p. 165, doi. 10.1007/s11664-006-0199-5

By:

Wang, S. S.;
Tseng, Y. H.;
Chuang, T. H.

Publication type:

Article

Intermetallic Reactions in Reflowed and Aged Sn-9Zn Solder Ball Grid Array Packages with Au/Ni/Cu and Ag/Cu Pads.

Published in:

Journal of Electronic Materials, 2006, v. 35, n. 1, p. 154, doi. 10.1007/s11664-006-0198-6

By:

Hsiu-Jen Lin;
Tung-Han Chuang

Publication type:

Article

Intermetallic Reactions in Sn-8Zn-20In Solder Ball Grid Array Packages with Au/Ni/Cu and Ag/Cu Pads.

Published in:

Journal of Electronic Materials, 2006, v. 35, n. 1, p. 147, doi. 10.1007/s11664-006-0197-7

By:

Yu-Chih Liu;
Wei-Hong Lin;
Hsiu-Jen Lin;
Tung-Han Chuang

Publication type:

Article

The Electrical Behavior of Nitro Oligo(Phenylene Ethynylene)'s in Pure and Mixed Monolayers.

Published in:

Journal of Electronic Materials, 2006, v. 35, n. 1, p. 140, doi. 10.1007/s11664-006-0196-8

By:

Majumdar, Nabanita;
Gergel-Hackett, N.;
Bean, J. C.;
Harriott, L. R.;
Pattanaik, G.;
Zangari, G.;
Yao, Y.;
Tour, J. M.

Publication type:

Article

A Quantitative Evaluation of Time-Independent and Time-Dependent Deformations of Lead-Free and Lead-Containing Solder Alloys.

Published in:

Journal of Electronic Materials, 2006, v. 35, n. 1, p. 132, doi. 10.1007/s11664-006-0195-9

By:

Ohguchi, Ken-Ichi;
Sasaki, Katsuhiko;
Ishibashi, Masahiro

Publication type:

Article

Microwave Preheating of Anisotropic Conductive Adhesive Films for High-Speed Flip Chip on Flex Bonding.

Published in:

Journal of Electronic Materials, 2006, v. 35, n. 1, p. 123, doi. 10.1007/s11664-006-0194-x

By:

Islam, Rashed Adnan;
Chan, Y. C.

Publication type:

Article

Improving the Electrical and Mechanical Behavior of Electrically Conductive Paint by Partial Replacement of Silver by Carbon Black.

Published in:

Journal of Electronic Materials, 2006, v. 35, n. 1, p. 118, doi. 10.1007/s11664-006-0193-y

By:

Chia-Ken Leong;
Chung, D. D. L.

Publication type:

Article

The Effects of Hydrogen on Aluminum-Induced Crystallization of Sputtered Hydrogenated Amorphous Silicon.

Published in:

Journal of Electronic Materials, 2006, v. 35, n. 1, p. 113, doi. 10.1007/s11664-006-0192-z

By:

Hossain, Maruf;
Abu-Safe, Husam H.;
Naseem, Hameed;
Brown, William D.

Publication type:

Article

Effect of KOH Treatment on the Schottky Barrier Height and Reverse Leakage Current in Pt/n-GaN.

Published in:

Journal of Electronic Materials, 2006, v. 35, n. 1, p. 107, doi. 10.1007/s11664-006-0191-0

By:

Ho Gyoung Kim;
Sang Ho Kim;
Deb, Parijat;
Sands, Tim

Publication type:

Article

Suppression of Void Coalescence in Thermal Aging of Tin-Silver-Copper-X Solder Joints.

Published in:

Journal of Electronic Materials, 2006, v. 35, n. 1, p. 94, doi. 10.1007/s11664-006-0190-1

By:

Anderson, I. E.;
Harringa, J. L.

Publication type:

Article

Microstructure, Solderability, and Growth of Intermetallic Compounds of Sn-Ag-Cu-RE Lead-Free Solder Alloys.

Published in:

Journal of Electronic Materials, 2006, v. 35, n. 1, p. 89, doi. 10.1007/s11664-006-0189-7

By:

Law, C. M. T.;
Wu, C. M. L.;
Yu, D. Q.;
Wang, L.;
Lai, J. K. L.

Publication type:

Article

Characterizing Metallurgical Reaction of Sn3.0Ag0.5Cu Composite Solder by Mechanical Alloying with Electroless Ni-P/Cu Under-Bump Metallization after Various Reflow Cycles.

Published in:

Journal of Electronic Materials, 2006, v. 35, n. 1, p. 81, doi. 10.1007/s11664-006-0188-8

By:

Li-Yin Hsiao;
Szu-Tsung Kao;
Jenq-Gong Duh

Publication type:

Article

Thermal Performance of Sputtered Insoluble Cu(W) Films for Advanced Barrierless Metallization.

Published in:

Journal of Electronic Materials, 2006, v. 35, n. 1, p. 76, doi. 10.1007/s11664-006-0187-9

By:

Chu, J. P.;
Lin, C. H.;
Hsieh, Y. Y.

Publication type:

Article

Interfacial Reactions in the Pb-Free Composite Solders with Indium Layers.

Published in:

Journal of Electronic Materials, 2006, v. 35, n. 1, p. 72, doi. 10.1007/s11664-006-0186-x

By:

Sinn-Wen Chen;
Shih-Kang Lin;
Ching-Feng Yang

Publication type:

Article

Microstructure Evolution of Gold-Tin Eutectic Solder on Cu and Ni Substrates.

Published in:

Journal of Electronic Materials, 2006, v. 35, n. 1, p. 65, doi. 10.1007/s11664-006-0185-y

By:

Tsai, J. Y.;
Chang, C. W.;
Ho, C. E.;
Lin, Y. L.;
Kao, C. R.

Publication type:

Article

Phase Field Simulations of Morphological Evolution and Growth Kinetics of Solder Reaction Products.

Published in:

Journal of Electronic Materials, 2006, v. 35, n. 1, p. 56, doi. 10.1007/s11664-006-0184-z

By:

Hong, K. K.;
Huh, J. Y.

Publication type:

Article

Solid-State Phase Formation between Pd Thin Films and GaSb.

Published in:

Journal of Electronic Materials, 2006, v. 35, n. 1, p. 48, doi. 10.1007/s11664-006-0183-0

By:

Robinson, J. A.;
Mohney, S. E.

Publication type:

Article

Effects of Bi and Pb on Oxidation in Humidity for Low-Temperature Lead-Free Solder Systems.

Published in:

Journal of Electronic Materials, 2006, v. 35, n. 1, p. 41, doi. 10.1007/s11664-006-0182-1

By:

Keun-Soo Kim;
Matsuura, Toshinori;
Suganuma, Katsuaki

Publication type:

Article

Interfacial Reaction between 42Sn-58Bi Solder and Electroless Ni-P/Immersion Au Under Bump Metallurgy during Aging.

Published in:

Journal of Electronic Materials, 2006, v. 35, n. 1, p. 35, doi. 10.1007/s11664-006-0181-2

By:

Moon Gi Cho;
Kyung Wook Paik;
Hyuck Mo Lee;
Seong Woon Booh;
Tae-Gyu Kim

Publication type:

Article

Study of Wetting Reaction between Eutectic AuSn and Au Foil.

Published in:

Journal of Electronic Materials, 2006, v. 35, n. 1, p. 28, doi. 10.1007/s11664-006-0180-3

By:

Lai, Y. T.;
Liu, C. Y.

Publication type:

Article

Interfacial Reactions and Phase Equilibria in the Al-Cu/Ta Systems.

Published in:

Journal of Electronic Materials, 2006, v. 35, n. 1, p. 22, doi. 10.1007/s11664-006-0179-9

By:

Chin-Yi Chou;
Sinn-Wen Chen

Publication type:

Article

Crystallization and Failure Behavior of Ta-TM (TM = Fe, Co) Nanostructured/Amorphous Diffusion Barriers for Copper Metallization.

Published in:

Journal of Electronic Materials, 2006, v. 35, n. 1, p. 15, doi. 10.1007/s11664-006-0178-x

By:

Fang, J. S.;
Hsu, T. P.;
Chen, G. S.

Publication type:

Article

Wettability of Electroplated Ni-P in Under Bump Metallurgy with Sn-Ag-Cu Solder.

Published in:

Journal of Electronic Materials, 2006, v. 35, n. 1, p. 7, doi. 10.1007/s11664-006-0177-y

By:

Yung-Chi Lin;
Jenq-Gong Duh;
Bi-Shiou Chiou

Publication type:

Article

Formation of Au Nanoparticles on Si Bicrystals.

Published in:

Journal of Electronic Materials, 2006, v. 35, n. 1, p. 2, doi. 10.1007/s11664-006-0176-z

By:

Liu, C. H.;
Wu, W. W.;
Chen, L. J.

Publication type:

Article

Foreword.

Published in:

Journal of Electronic Materials, 2006, v. 35, n. 1, p. 1, doi. 10.1007/s11664-006-0175-0

By:

Sinn-Wen Chen;
Kao, C. Robert;
Hyuck Mo Lee;
Mohney, Suzanne;
Suganuma, Katsuaki;
Swenson, Douglas J.;
Chada, Srinivas

Publication type:

Article