Enhanced Gettering of Iron Impurities in Bulk Silicon by Using External Direct Current Electric Field.
- Published in:
- Journal of Electronic Materials, 2005, v. 34, n. 7, p. L25, doi. 10.1007/s11664-005-0101-x
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- Publication type:
- Article
Works matching IS 03615235 AND DT 2005 AND VI 34 AND IP 7
Results: 18
1
2
Fabrication and Thermal Evaluation of Silicon on Diamond Wafers.
- Published in:
- Journal of Electronic Materials, 2005, v. 34, n. 7, p. 1089, doi. 10.1007/s11664-005-0100-y
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- Publication type:
- Article
3
Lead-Free Interconnect Technique by Using Variable Frequency Microwave.
- Published in:
- Journal of Electronic Materials, 2005, v. 34, n. 7, p. 1081, doi. 10.1007/s11664-005-0099-0
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- Publication type:
- Article
4
Structure and Dielectric Properties of Ba<sub>1-x</sub>Sr<sub>x</sub>ZnTi<sub>7</sub>O<sub>16</sub> Hollandite Ceramics.
- Published in:
- Journal of Electronic Materials, 2005, v. 34, n. 7, p. 1076, doi. 10.1007/s11664-005-0098-1
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- Publication type:
- Article
5
Anomalously High Tensile Creep Rates from Thin Cast Sn3.9Ag0.6Cu Lead-Free Solder.
- Published in:
- Journal of Electronic Materials, 2005, v. 34, n. 7, p. 1065, doi. 10.1007/s11664-005-0097-2
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- Publication type:
- Article
6
Electron Beam--Induced Current Investigation of GaN Schottky Diode.
- Published in:
- Journal of Electronic Materials, 2005, v. 34, n. 7, p. 1059, doi. 10.1007/s11664-005-0096-3
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- Publication type:
- Article
7
Ion Bombardment-Induced High Orientation of Al/Ti Films for Surface Acoustic Wave Device Applications.
- Published in:
- Journal of Electronic Materials, 2005, v. 34, n. 7, p. 1053, doi. 10.1007/s11664-005-0095-4
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- Publication type:
- Article
8
Hemisphere-Shaped Silicon Crystal Wafers Obtained by Plastic Deformation and Preparation of Their Solar Cells.
- Published in:
- Journal of Electronic Materials, 2005, v. 34, n. 7, p. 1047, doi. 10.1007/s11664-005-0094-5
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- Publication type:
- Article
9
Impression Creep Characterization of 90Pb-10Sn Microelectronic Solder Balls at Subsolvus and Supersolvus Temperatures.
- Published in:
- Journal of Electronic Materials, 2005, v. 34, n. 7, p. 1040, doi. 10.1007/s11664-005-0093-6
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- Publication type:
- Article
10
High Electric-Field-Induced Strain Behavior of Single-Crystal Pb(Mg<sub>1/3</sub>Nb<sub>2/3</sub>)O<sub>3</sub>-xPbTiO<sub>3</sub> Multilayer Piezoelectric Actuators.
- Published in:
- Journal of Electronic Materials, 2005, v. 34, n. 7, p. 1035, doi. 10.1007/s11664-005-0092-7
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- Publication type:
- Article
11
Low-Base-Resistance InP/InGaAs Heterojunction Bipolar Transistors with a Compositionally Graded-Base Structure.
- Published in:
- Journal of Electronic Materials, 2005, v. 34, n. 7, p. 1030, doi. 10.1007/s11664-005-0091-8
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- Publication type:
- Article
12
Scanning Electron Microscopy Study of the Cross Section of Intermetallic Compound in the Solder Ball on the Plastic Ball Grid Array Package Following Reliability Tests.
- Published in:
- Journal of Electronic Materials, 2005, v. 34, n. 7, p. 1026, doi. 10.1007/s11664-005-0090-9
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- Publication type:
- Article
13
High-Temperature Variable Melting Point Sn-Sb Lead-Free Solder Pastes Using Transient Liquid-Phase Powder Processing.
- Published in:
- Journal of Electronic Materials, 2005, v. 34, n. 7, p. 1016, doi. 10.1007/s11664-005-0089-2
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- Publication type:
- Article
14
Changes in Interfacial Bonding Energies in the Chemical Activation of GaAs Surfaces.
- Published in:
- Journal of Electronic Materials, 2005, v. 34, n. 7, p. 1010, doi. 10.1007/s11664-005-0088-3
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- Publication type:
- Article
15
Room-Temperature Indentation Creep of Lead-Free Sn-5%Sb Solder Alloy.
- Published in:
- Journal of Electronic Materials, 2005, v. 34, n. 7, p. 1002, doi. 10.1007/s11664-005-0087-4
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- Publication type:
- Article
16
Influence of Flux on Wetting Behavior of Lead-Free Solder Balls during the Infrared-Reflow Process.
- Published in:
- Journal of Electronic Materials, 2005, v. 34, n. 7, p. 994, doi. 10.1007/s11664-005-0086-5
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- Publication type:
- Article
17
Advanced HiCTE Flip Chip Packaging of 90-nm Cu/Low-K Chips: Underfill, Novel Terminal Pad Structures, and Processing Optimization.
- Published in:
- Journal of Electronic Materials, 2005, v. 34, n. 7, p. 977, doi. 10.1007/s11664-005-0085-6
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- Publication type:
- Article
18
Failure Mechanisms of Lead-Free Chip Scale Package Interconnections under Fast Mechanical Loading.
- Published in:
- Journal of Electronic Materials, 2005, v. 34, n. 7, p. 969, doi. 10.1007/s11664-005-0084-7
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- Publication type:
- Article