Works matching IS 03615235 AND DT 2005 AND VI 34 AND IP 5
Results: 32
Nanostructured Thermoelectric Materials.
- Published in:
- Journal of Electronic Materials, 2005, v. 34, n. 5, p. L19, doi. 10.1007/s11664-005-0083-8
- By:
- Publication type:
- Article
Experimental Investigation and Thermodynamic Calculation of Phase Equilibria in the Sn-Au-Ni System.
- Published in:
- Journal of Electronic Materials, 2005, v. 34, n. 5, p. 670, doi. 10.1007/s11664-005-0082-9
- By:
- Publication type:
- Article
Interfacial Reactions of Cu-Containing Lead-Free Solders with Au/NiP Metallization.
- Published in:
- Journal of Electronic Materials, 2005, v. 34, n. 5, p. 662
- By:
- Publication type:
- Article
The Anomalous Microstructural, Tensile, and Aging Response of Thin-Cast Sn3.9Ag0.6Cu Lead-Free Solder.
- Published in:
- Journal of Electronic Materials, 2005, v. 34, n. 5, p. 617, doi. 10.1007/s11664-005-0074-9
- By:
- Publication type:
- Article
Molecular Beam Epitaxial Growth and Characterization of Cd-Based II-VI Wide-Bandgap Compounds on Si Substrates.
- Published in:
- Journal of Electronic Materials, 2005, v. 34, n. 5, p. 655, doi. 10.1007/s11664-005-0080-y
- By:
- Publication type:
- Article
The Effects of Boron in the Cu(B)/Ti/SiO<sub>2</sub> System on the Cu-Ti Reaction, Resistivity, and Diffusion Barrier Properties.
- Published in:
- Journal of Electronic Materials, 2005, v. 34, n. 5, p. 643, doi. 10.1007/s11664-005-0078-5
- By:
- Publication type:
- Article
Oxidation Study of Pure Tin and Its Alloys via Electrochemical Reduction Analysis.
- Published in:
- Journal of Electronic Materials, 2005, v. 34, n. 5, p. 635, doi. 10.1007/s11664-005-0077-6
- By:
- Publication type:
- Article
Fluxless Fabrications of Sn-Au Solder Microbumps by a Hydrogen Plasma Reflow Technique.
- Published in:
- Journal of Electronic Materials, 2005, v. 34, n. 5, p. 630, doi. 10.1007/s11664-005-0076-7
- By:
- Publication type:
- Article
Thermal and Mechanical Stability of Electrically Conductive Adhesive Joints.
- Published in:
- Journal of Electronic Materials, 2005, v. 34, n. 5, p. 625, doi. 10.1007/s11664-005-0075-8
- By:
- Publication type:
- Article
Encapsulation of Lead-Free Sn/Zn/Bi Solder Alloy Particles by Coating with Wax Powder for Improving Oxidation Resistance.
- Published in:
- Journal of Electronic Materials, 2005, v. 34, n. 5, p. 647, doi. 10.1007/s11664-005-0079-4
- By:
- Publication type:
- Article
Study of Threading Dislocations in the Plan-View Sample of SiGe/Si(001) Superlattices by Transmission Electron Microscopy.
- Published in:
- Journal of Electronic Materials, 2005, v. 34, n. 5, p. 612, doi. 10.1007/s11664-005-0073-x
- By:
- Publication type:
- Article
Investigation of Microstructure and V-Defect Formation in In<sub>x</sub>Ga<sub>1-x</sub>N/GaN MQW Grown Using Temperature-Gradient Metalorganic Chemical Vapor Deposition.
- Published in:
- Journal of Electronic Materials, 2005, v. 34, n. 5, p. 605, doi. 10.1007/s11664-005-0072-y
- By:
- Publication type:
- Article
Novel Interconnection Method Using Electrically Conductive Paste with Fusible Filler.
- Published in:
- Journal of Electronic Materials, 2005, v. 34, n. 5, p. 600, doi. 10.1007/s11664-005-0071-z
- By:
- Publication type:
- Article
Formation of Ti Diffusion Barrier Layers in Thin Cu(Ti) Alloy Films.
- Published in:
- Journal of Electronic Materials, 2005, v. 34, n. 5, p. 592, doi. 10.1007/s11664-005-0070-0
- By:
- Publication type:
- Article
Characterization of Environmental Stability of Pulsed Laser Deposited Oxide Ceramic Coatings.
- Published in:
- Journal of Electronic Materials, 2005, v. 34, n. 5, p. 551, doi. 10.1007/s11664-005-0064-y
- By:
- Publication type:
- Article
Fabrication of Potential NiMoP Diffusion Barrier/Seed Layers for Cu Interconnects via Electroless Deposition.
- Published in:
- Journal of Electronic Materials, 2005, v. 34, n. 5, p. 541, doi. 10.1007/s11664-005-0063-z
- By:
- Publication type:
- Article
Progress in Crystalline Multijunction and Thin-Film Photovoltaics.
- Published in:
- Journal of Electronic Materials, 2005, v. 34, n. 5, p. 571, doi. 10.1007/s11664-005-0067-8
- By:
- Publication type:
- Article
Dielectric Films for Si Solar Cell Applications.
- Published in:
- Journal of Electronic Materials, 2005, v. 34, n. 5, p. 564, doi. 10.1007/s11664-005-0066-9
- By:
- Publication type:
- Article
Three-Dimensional Simulation of Microstructure Evolution in Damascene Interconnects: Effect of Overburden Thickness.
- Published in:
- Journal of Electronic Materials, 2005, v. 34, n. 5, p. 559, doi. 10.1007/s11664-005-0065-x
- By:
- Publication type:
- Article
Numerical Simulation of Thermal Wave Propagation during Laser Processing of Thin Films.
- Published in:
- Journal of Electronic Materials, 2005, v. 34, n. 5, p. 583, doi. 10.1007/s11664-005-0069-6
- By:
- Publication type:
- Article
Surface Modification of Ferrous Alloys with Boron.
- Published in:
- Journal of Electronic Materials, 2005, v. 34, n. 5, p. 575, doi. 10.1007/s11664-005-0068-7
- By:
- Publication type:
- Article
Toward a Better Understanding of Synthesis and Processing of Ceramic/Self-Assembled Monolayer Bilayer Coatings.
- Published in:
- Journal of Electronic Materials, 2005, v. 34, n. 5, p. 534, doi. 10.1007/s11664-005-0062-0
- By:
- Publication type:
- Article
Microstructure and Mechanical Properties of Ceramic/ Self-Assembled Monolayer Bilayer Coatings.
- Published in:
- Journal of Electronic Materials, 2005, v. 34, n. 5, p. 528, doi. 10.1007/s11664-005-0061-1
- By:
- Publication type:
- Article
Modeling and Experiments on Epitaxially Grown Multilayers with Implications to Critical Thickness.
- Published in:
- Journal of Electronic Materials, 2005, v. 34, n. 5, p. 522, doi. 10.1007/s11664-005-0060-2
- By:
- Publication type:
- Article
Some Silicon-Based Heterostructures for Optical Applications.
- Published in:
- Journal of Electronic Materials, 2005, v. 34, n. 5, p. 515, doi. 10.1007/s11664-005-0059-8
- By:
- Publication type:
- Article
Analysis of Thermal Stresses in Copper Interconnect/Low-k Dielectric Structures.
- Published in:
- Journal of Electronic Materials, 2005, v. 34, n. 5, p. 497, doi. 10.1007/s11664-005-0057-x
- By:
- Publication type:
- Article
Textural and Microstructural Transformation of Cu Damascene Interconnects after Annealing.
- Published in:
- Journal of Electronic Materials, 2005, v. 34, n. 5, p. 506, doi. 10.1007/s11664-005-0058-9
- By:
- Publication type:
- Article
Novel Pulsed-Laser-Deposition--VO<sub>2</sub> Thin Films for Ultrafast Applications.
- Published in:
- Journal of Electronic Materials, 2005, v. 34, n. 5, p. 491, doi. 10.1007/s11664-005-0056-y
- By:
- Publication type:
- Article
Silicon-Integrated Uncooled Infrared Detectors: Perspectives on Thin Films and Microstructures.
- Published in:
- Journal of Electronic Materials, 2005, v. 34, n. 5, p. 484, doi. 10.1007/s11664-005-0055-z
- By:
- Publication type:
- Article
Fluxon Pinning in the Nodeless Pairing State of Superconducting YBa<sub>2</sub>Cu<sub>3</sub>O<sub>7</sub>.
- Published in:
- Journal of Electronic Materials, 2005, v. 34, n. 5, p. 474, doi. 10.1007/s11664-005-0054-0
- By:
- Publication type:
- Article
Ion Beam Mixing of Silicon-Germanium Thin Films.
- Published in:
- Journal of Electronic Materials, 2005, v. 34, n. 5, p. 468, doi. 10.1007/s11664-005-0053-1
- By:
- Publication type:
- Article
Foreword.
- Published in:
- Journal of Electronic Materials, 2005, v. 34, n. 5, p. 467, doi. 10.1007/s11664-005-0052-2
- By:
- Publication type:
- Article