Works matching IS 03615235 AND DT 2005 AND VI 34 AND IP 2
Results: 13
Effect of Rapid Solidification and Small Additions of Zn and Bi on the Structure and Properties of Sn-Cu Eutectic Alloy.
- Published in:
- Journal of Electronic Materials, 2005, v. 34, n. 2, p. 212, doi. 10.1007/s11664-005-0234-y
- By:
- Publication type:
- Article
Tensile Creep and Microstructural Characterization of Bulk Sn3.9Ag0.6Cu Lead-Free Solder.
- Published in:
- Journal of Electronic Materials, 2005, v. 34, n. 2, p. 196, doi. 10.1007/s11664-005-0233-z
- By:
- Publication type:
- Article
Creep Deformation of Sn-3.5Ag-xCu and Sn-3.5Ag-xBi Solder Joints.
- Published in:
- Journal of Electronic Materials, 2005, v. 34, n. 2, p. 188, doi. 10.1007/s11664-005-0232-0
- By:
- Publication type:
- Article
Controlling the Microstructures from the Gold-Tin Reaction.
- Published in:
- Journal of Electronic Materials, 2005, v. 34, n. 2, p. 182, doi. 10.1007/s11664-005-0231-1
- By:
- Publication type:
- Article
Nitrogen-Doped Ge<sub>2</sub>Sb<sub>2</sub>Te<sub>5</sub> Films for Nonvolatile Memory.
- Published in:
- Journal of Electronic Materials, 2005, v. 34, n. 2, p. 176, doi. 10.1007/s11664-005-0230-2
- By:
- Publication type:
- Article
Thermal Behavior of Silver Nanoparticles for Low-Temperature Interconnect Applications.
- Published in:
- Journal of Electronic Materials, 2005, v. 34, n. 2, p. 168, doi. 10.1007/s11664-005-0229-8
- By:
- Publication type:
- Article
Influence of Interfacial Reaction Layer on Reliability of Chip-Scale Package Joint from Using Sn-37Pb and Sn-8Zn-3Bi Solder.
- Published in:
- Journal of Electronic Materials, 2005, v. 34, n. 2, p. 161, doi. 10.1007/s11664-005-0228-9
- By:
- Publication type:
- Article
Growth and Optimization of Extremely High-Pulse-Power Graded-Index Separate Confinement Heterostructure Quantum Well AlGaAs/InGaAs Diode Lasers with Broadened Waveguides.
- Published in:
- Journal of Electronic Materials, 2005, v. 34, n. 2, p. 156, doi. 10.1007/s11664-005-0227-x
- By:
- Publication type:
- Article
Spray Deposition and Characterization of Zirconium-Oxide Thin Films.
- Published in:
- Journal of Electronic Materials, 2005, v. 34, n. 2, p. 150, doi. 10.1007/s11664-005-0226-y
- By:
- Publication type:
- Article
Effect of Volume in Interfacial Reaction between Eutectic Sn-3.5% Ag-0.5% Cu Solder and Cu Metallization in Microelectronic Packaging.
- Published in:
- Journal of Electronic Materials, 2005, v. 34, n. 2, p. 143, doi. 10.1007/s11664-005-0225-z
- By:
- Publication type:
- Article
Surface Modification of Silicon by Laser Surface Treatment: Improvement of Adhesion and Copper Deposition.
- Published in:
- Journal of Electronic Materials, 2005, v. 34, n. 2, p. 132, doi. 10.1007/s11664-005-0223-1
- By:
- Publication type:
- Article
Microstructural Development of Sn-Ag-Cu Solder Joints.
- Published in:
- Journal of Electronic Materials, 2005, v. 34, n. 2, p. 137, doi. 10.1007/s11664-005-0224-0
- By:
- Publication type:
- Article
Study of Intermetallic Crystal Growth between Nb and Molten 52ln-48Sn Solder.
- Published in:
- Journal of Electronic Materials, 2005, v. 34, n. 2, p. 125, doi. 10.1007/s11664-005-0222-2
- By:
- Publication type:
- Article