The Effect of Forming Gas Anneal on the Oxygen Content in Bonded Copper Layer.
- Published in:
- Journal of Electronic Materials, 2005, v. 34, n. 12, p. 1598, doi. 10.1007/s11664-005-0171-9
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- Publication type:
- Article
Works matching IS 03615235 AND DT 2005 AND VI 34 AND IP 12
Results: 21
1
2
Formation of Bulk Ag<sub>3</sub>Sn Intermetallic Compounds in Sn-Ag Lead-Free Solders in Solidification.
- Published in:
- Journal of Electronic Materials, 2005, v. 34, n. 12, p. 1591, doi. 10.1007/s11664-005-0170-x
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- Publication type:
- Article
3
Analytical Equations for Predicting the Thermal Properties of Isotropic Conductive Adhesives.
- Published in:
- Journal of Electronic Materials, 2005, v. 34, n. 12, p. 1586, doi. 10.1007/s11664-005-0169-3
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- Publication type:
- Article
4
Whisker Growth on Surface Treatment in the Pure Tin Plating.
- Published in:
- Journal of Electronic Materials, 2005, v. 34, n. 12, p. 1579, doi. 10.1007/s11664-005-0168-4
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- Publication type:
- Article
5
Monolayer-Protected Silver Nano-Particle-Based Anisotropic Conductive Adhesives: Enhancement of Electrical and Thermal Properties.
- Published in:
- Journal of Electronic Materials, 2005, v. 34, n. 12, p. 1573, doi. 10.1007/s11664-005-0167-5
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- Publication type:
- Article
6
Reliability of In-48Sn Solder/Au/Ni/Cu BGA Packages during Reflow Process.
- Published in:
- Journal of Electronic Materials, 2005, v. 34, n. 12, p. 1565, doi. 10.1007/s11664-005-0166-6
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- Publication type:
- Article
7
The Formation of Epitaxial Hexagonal Boron Nitride on Nickel Substrates.
- Published in:
- Journal of Electronic Materials, 2005, v. 34, n. 12, p. 1558, doi. 10.1007/s11664-005-0165-7
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- Publication type:
- Article
8
Evaluation of Solder Joint Reliability in Flip-Chip Packages during Accelerated Testing.
- Published in:
- Journal of Electronic Materials, 2005, v. 34, n. 12, p. 1550, doi. 10.1007/s11664-005-0164-8
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- Publication type:
- Article
9
Intermetallic Compound Formation and Morphology Evolution in the 95Pb5Sn Flip-Chip Solder Joint with Ti/Cu/Ni Under Bump Metallization during Reflow Soldering.
- Published in:
- Journal of Electronic Materials, 2005, v. 34, n. 12, p. 1543, doi. 10.1007/s11664-005-0163-9
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- Publication type:
- Article
10
Effects of Process Current Density and Temperature on Electrochemical Boriding of Steel in Molten Salts.
- Published in:
- Journal of Electronic Materials, 2005, v. 34, n. 12, p. 1538, doi. 10.1007/s11664-005-0162-x
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- Publication type:
- Article
11
Microstructure Evaluation and Mechanical Properties of Nanolayered Chromium Nitride/Tungsten Nitride Coating.
- Published in:
- Journal of Electronic Materials, 2005, v. 34, n. 12, p. 1533, doi. 10.1007/s11664-005-0161-y
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- Publication type:
- Article
12
Thermophysical Properties of Molten Refractory Metals Measured by an Electrostatic Levitator.
- Published in:
- Journal of Electronic Materials, 2005, v. 34, n. 12, p. 1526, doi. 10.1007/s11664-005-0160-z
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- Publication type:
- Article
13
Microstructural Development in Asymmetric Processing of Tantalum Plate.
- Published in:
- Journal of Electronic Materials, 2005, v. 34, n. 12, p. 1521, doi. 10.1007/s11664-005-0159-5
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- Publication type:
- Article
14
Influence of Substrate on High-Temperature Behavior of Copper Film Studied In Situ by Electron Backscatter Diffraction.
- Published in:
- Journal of Electronic Materials, 2005, v. 34, n. 12, p. 1509, doi. 10.1007/s11664-005-0158-6
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- Publication type:
- Article
15
Effect of Film Thickness on the Evolution of Annealing Texture in Sputtered Copper Films.
- Published in:
- Journal of Electronic Materials, 2005, v. 34, n. 12, p. 1500, doi. 10.1007/s11664-005-0157-7
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- Publication type:
- Article
16
Annealing Textures of Copper Damascene Interconnects for Ultra-Large-Scale Integration.
- Published in:
- Journal of Electronic Materials, 2005, v. 34, n. 12, p. 1493, doi. 10.1007/s11664-005-0156-8
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- Publication type:
- Article
17
The Effects of Substrate Bias, Substrate Temperature, and Pulse Frequency on the Microstructures of Chromium Nitride Coatings Deposited by Pulsed Direct Current Reactive Magnetron Sputtering.
- Published in:
- Journal of Electronic Materials, 2005, v. 34, n. 12, p. 1484, doi. 10.1007/s11664-005-0155-9
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- Publication type:
- Article
18
Structure and Soft Magnetic Properties of Fe-Co-Ni-Based Multicomponent Thin Films.
- Published in:
- Journal of Electronic Materials, 2005, v. 34, n. 12, p. 1480, doi. 10.1007/s11664-005-0154-x
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- Publication type:
- Article
19
Measurement of Angular Emission Trajectories for Magnetron-Sputtered Tantalum.
- Published in:
- Journal of Electronic Materials, 2005, v. 34, n. 12, p. 1474, doi. 10.1007/s11664-005-0153-y
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- Publication type:
- Article
20
Influence of Tungsten Sputtering Target Density on Physical Vapor Deposition Thin Film Properties.
- Published in:
- Journal of Electronic Materials, 2005, v. 34, n. 12, p. 1468, doi. 10.1007/s11664-005-0152-z
- By:
- Publication type:
- Article
21
Copper Bonded Layers Analysis and Effects of Copper Surface Conditions on Bonding Quality for Three-Dimensional Integration.
- Published in:
- Journal of Electronic Materials, 2005, v. 34, n. 12, p. 1464, doi. 10.1007/s11664-005-0151-0
- By:
- Publication type:
- Article