Works matching IS 03615235 AND DT 2005 AND VI 34 AND IP 11
Results: 17
Radiation Hardness Improvement of Separation-by-Implantation-of-Oxygen/Silicon-on-Insulator Material by Nitrogen Ion Implantation.
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- Journal of Electronic Materials, 2005, v. 34, n. 11, p. L53, doi. 10.1007/s11664-005-0206-2
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- Article
Formulation and Characterization of Anisotropic Conductive Adhesive Paste for Microelectronics Packaging Applications.
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- Journal of Electronic Materials, 2005, v. 34, n. 11, p. 1420, doi. 10.1007/s11664-005-0200-8
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- Article
Effects of Thermoplastic Resin Content of Anisotropic Conductive Films on the Pressure Cooker Test Reliability of Anisotropic Conductive Film Flip-Chip Assembly.
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- Journal of Electronic Materials, 2005, v. 34, n. 11, p. 1455, doi. 10.1007/s11664-005-0205-3
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- Article
Etching of Mesa Structures in HgCdTe.
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- Journal of Electronic Materials, 2005, v. 34, n. 11, p. 1440, doi. 10.1007/s11664-005-0203-5
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- Article
Conductivity Enhancement of Nano Silver-Filled Conductive Adhesives by Particle Surface Functionalization.
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- Journal of Electronic Materials, 2005, v. 34, n. 11, p. 1432, doi. 10.1007/s11664-005-0202-6
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- Article
Optical Emission Characteristics of Ablation Plasma Plumes during the Laser-Etching Process of CdTe.
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- Journal of Electronic Materials, 2005, v. 34, n. 11, p. 1428, doi. 10.1007/s11664-005-0201-7
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- Article
Density Measurement of Sn-40Pb, Sn-57Bi, and Sn-9Zn by Indirect Archimedean Method.
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- Journal of Electronic Materials, 2005, v. 34, n. 11, p. 1414, doi. 10.1007/s11664-005-0199-x
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- Article
Contact Resistance and Shear Strength of the Solder Joints Formed Using Cu Bumps Capped with Sn or Ag/Sn Layer.
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- Journal of Electronic Materials, 2005, v. 34, n. 11, p. 1446, doi. 10.1007/s11664-005-0204-4
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- Article
Creep Resistance of Tin-Based Lead-Free Solder Alloys.
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- Journal of Electronic Materials, 2005, v. 34, n. 11, p. 1373, doi. 10.1007/s11664-005-0193-3
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- Article
Characterization of Sputtered Nano-Crystalline Zirconium Carbide as a Diffusion Barrier for Cu Metallization.
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- Journal of Electronic Materials, 2005, v. 34, n. 11, p. 1408, doi. 10.1007/s11664-005-0198-y
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- Article
Influence of Native Defects on the Infrared Transmission of Undoped Ga<sub>1-x</sub>In<sub>x</sub>Sb Bulk Crystals.
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- Journal of Electronic Materials, 2005, v. 34, n. 11, p. 1391, doi. 10.1007/s11664-005-0196-0
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- Article
Intermetallic Reactions in a Sn-20In-2.8Ag Solder Ball-Grid-Array Package with Au/Ni/Cu Pads.
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- Journal of Electronic Materials, 2005, v. 34, n. 11, p. 1385, doi. 10.1007/s11664-005-0195-1
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- Article
Refractive Indices Variation with Temperature and Humidity of Optical Adhesive.
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- Journal of Electronic Materials, 2005, v. 34, n. 11, p. 1378, doi. 10.1007/s11664-005-0194-2
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- Article
Development of Nano-Composite Lead-Free Electronic Solders.
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- Journal of Electronic Materials, 2005, v. 34, n. 11, p. 1399, doi. 10.1007/s11664-005-0197-z
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- Article
Cadmium Sulfide Passivation of InGaAs/InP Mesa p-i-n Photodiodes.
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- Journal of Electronic Materials, 2005, v. 34, n. 11, p. 1368, doi. 10.1007/s11664-005-0192-4
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- Article
Interfacial Segregation of Bi during Current Stressing of Sn-Bi/Cu Solder Interconnect.
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- Journal of Electronic Materials, 2005, v. 34, n. 11, p. 1363, doi. 10.1007/s11664-005-0191-5
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- Article
Processing and Creep Properties of Sn-Cu Composite Solders with Small Amounts of Nanosized Ag Reinforcement Additions.
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- Journal of Electronic Materials, 2005, v. 34, n. 11, p. 1357, doi. 10.1007/s11664-005-0190-6
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- Article