Multiaxial Low-Cycle Fatigue of 63Sn-37Pb Solder.
- Published in:
- Journal of Electronic Materials, 2005, v. 34, n. 1, p. L1, doi. 10.1007/s11664-005-0189-z
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- Publication type:
- Article
Works matching IS 03615235 AND DT 2005 AND VI 34 AND IP 1
Results: 18
1
2
Effect of Bismuth Addition on Sintering Behavior and Microwave Dielectric Properties of Zinc Titanate Ceramics.
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- Journal of Electronic Materials, 2005, v. 34, n. 1, p. 119, doi. 10.1007/s11664-005-0188-0
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- Article
3
Correlation of In-Situ Reflectance Spectra and Resistivity of GaN/Al<sub>2</sub>O<sub>3</sub> Interfacial Layer in Metalorganic Chemical Vapor Deposition.
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- Journal of Electronic Materials, 2005, v. 34, n. 1, p. 112, doi. 10.1007/s11664-005-0187-1
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- Article
4
Analysis of the Redeposition of AuSn<sub>4</sub> on Ni/Au Contact Pads when Using SnPbAg, SnAg, and SnAgCu Solders.
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- Journal of Electronic Materials, 2005, v. 34, n. 1, p. 103, doi. 10.1007/s11664-005-0186-2
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- Publication type:
- Article
5
Thermosonic Bonding of Lead-Free Solder with Metal Bump for Flip-Chip Bonding.
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- Journal of Electronic Materials, 2005, v. 34, n. 1, p. 96, doi. 10.1007/s11664-005-0185-3
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- Publication type:
- Article
6
Effect of Off-Orientation of Seed Crystal on Silicon Carbide (SIC) Single-crystal Growth on the (1120) Surface.
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- Journal of Electronic Materials, 2005, v. 34, n. 1, p. 91, doi. 10.1007/s11664-005-0184-4
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- Article
7
Effects of Cu Contents in Pb-Free Solder Alloys on Interfacial Reactions and Bump Reliability of Pb-Free Solder Bumps on Electroless Ni-P Under-Bump Metallurgy.
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- Journal of Electronic Materials, 2005, v. 34, n. 1, p. 80, doi. 10.1007/s11664-005-0183-5
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- Article
8
The Effect of Intermetallic Compound Morphology on Cu Diffusion in Sn-Ag and Sn-Pb Solder Bump on the Ni/Cu Under-Bump Metallization.
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- Journal of Electronic Materials, 2005, v. 34, n. 1, p. 68, doi. 10.1007/s11664-005-0182-6
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- Article
9
Cyclic Softening of the Sn-3.8Ag-0.7Cu Lead-Free Solder Alloy with Equiaxed Grain Structure.
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- Journal of Electronic Materials, 2005, v. 34, n. 1, p. 62, doi. 10.1007/s11664-005-0181-7
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- Article
10
Texture Investigation of Copper Interconnects with a Different Line Width.
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- Journal of Electronic Materials, 2005, v. 34, n. 1, p. 53, doi. 10.1007/s11664-005-0180-8
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- Article
11
Comparative Study of Interfacial Reactions of Sn-Ag-Cu and Sn-Ag Solders on Cu Pads during Reflow Soldering.
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- Journal of Electronic Materials, 2005, v. 34, n. 1, p. 46, doi. 10.1007/s11664-005-0179-1
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- Publication type:
- Article
12
Molecular Dynamics Study of Nanosilver Particles for Low-Temperature Lead-Free Interconnect Applications.
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- Journal of Electronic Materials, 2005, v. 34, n. 1, p. 40, doi. 10.1007/s11664-005-0178-2
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- Article
13
The Effects of Oxygen, Nitrogen, and Hydrogen Annealing on Mg Acceptors in GaN as Monitored by Electron Paramagnetic Resonance Spectroscopy.
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- Journal of Electronic Materials, 2005, v. 34, n. 1, p. 34, doi. 10.1007/s11664-005-0177-3
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- Article
14
Electromigration-lnduced Failure in Flip-Chip Solder Joints.
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- Journal of Electronic Materials, 2005, v. 34, n. 1, p. 27, doi. 10.1007/s11664-005-0176-4
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- Publication type:
- Article
15
A GeSi-Buffer Structure for Growth of High-Quality GaAs Epitaxial Layers on a Si Substrate.
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- Journal of Electronic Materials, 2005, v. 34, n. 1, p. 23, doi. 10.1007/s11664-005-0175-5
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- Publication type:
- Article
16
Uniform Cr<sup>2+</sup> Doping of Physical Vapor Transport Grown CdS<sub>x</sub>Se<sub>1-x</sub> Crystals.
- Published in:
- Journal of Electronic Materials, 2005, v. 34, n. 1, p. 19, doi. 10.1007/s11664-005-0174-6
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- Publication type:
- Article
17
The Effects of Bath Composition on the Morphologies of Electroless Nickel Under-Bump Metallurgy on AI Input/ Output Pad.
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- Journal of Electronic Materials, 2005, v. 34, n. 1, p. 12, doi. 10.1007/s11664-005-0173-7
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- Publication type:
- Article
18
Self-Assembly of Metal Nanocrystals on Ultrathin Oxide for Nonvolatile Memory Applications.
- Published in:
- Journal of Electronic Materials, 2005, v. 34, n. 1, p. 1, doi. 10.1007/s11664-005-0172-8
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- Publication type:
- Article