Effect of Adding Sb on Microstructure and Adhesive Strength of Sn-Ag Solder Joints.
- Published in:
- Journal of Electronic Materials, 2004, v. 33, n. 9, p. 1048, doi. 10.1007/s11664-004-0034-9
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- Publication type:
- Article
Works matching IS 03615235 AND DT 2004 AND VI 33 AND IP 9
Results: 17
1
2
Characterization and Modeling of Static and Cyclic Relaxation in Nonconductive Adhesives.
- Published in:
- Journal of Electronic Materials, 2004, v. 33, n. 9, p. 1041, doi. 10.1007/s11664-004-0033-x
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- Publication type:
- Article
3
Study of Schottky Barrier Heights of Indium-Tin-Oxide on p-GaN Using X-ray Photoelectron Spectroscopy and Current-Voltage Measurements.
- Published in:
- Journal of Electronic Materials, 2004, v. 33, n. 9, p. 1036, doi. 10.1007/s11664-004-0032-y
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- Publication type:
- Article
4
Study of Immersion Silver and Tin Printed-Circuit-Board Surface Finishes in Lead-Free Solder Applications.
- Published in:
- Journal of Electronic Materials, 2004, v. 33, n. 9, p. 977, doi. 10.1007/s11664-004-0025-x
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- Publication type:
- Article
5
Mesa-Size Dependence Characteristics of Vertical Surface-Emitting Lasers.
- Published in:
- Journal of Electronic Materials, 2004, v. 33, n. 9, p. 972, doi. 10.1007/s11664-004-0024-y
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- Publication type:
- Article
6
Effect of Bump Characteristics and Temperature Variation on the Online Contact Resistance of Anisotropic Conductive Joints.
- Published in:
- Journal of Electronic Materials, 2004, v. 33, n. 9, p. 1028, doi. 10.1007/s11664-004-0031-z
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- Publication type:
- Article
7
High-Resistivity GaSb Bulk Crystals Grown by the Vertical Bridgman Method.
- Published in:
- Journal of Electronic Materials, 2004, v. 33, n. 9, p. 1012, doi. 10.1007/s11664-004-0028-7
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- Publication type:
- Article
8
In-Situ Cleaning and Passivation of Oxidized Cu Surfaces by Alkanethiols and Its Application to Wire Bonding.
- Published in:
- Journal of Electronic Materials, 2004, v. 33, n. 9, p. 1005, doi. 10.1007/s11664-004-0027-8
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- Publication type:
- Article
9
Solid-State Intermetallic Compound Layer Growth Between Copper and 95.5Sn-3.9Ag-0.6Cu Solder.
- Published in:
- Journal of Electronic Materials, 2004, v. 33, n. 9, p. 991, doi. 10.1007/s11664-004-0026-9
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- Publication type:
- Article
10
Impact of Carbon Concentration on the Interface Density of States of Metal-Oxide Si<sub>1--x--y</sub> Ge<sub>x</sub>C<sub>y</sub> (Strained) Capacitators.
- Published in:
- Journal of Electronic Materials, 2004, v. 33, n. 9, p. 1022, doi. 10.1007/s11664-004-0030-0
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- Publication type:
- Article
11
The Electrical Properties and Stability of the Hafnium Silicate/Si<sub>0.8</sub>Ge<sub>0.2</sub>(100) Interface.
- Published in:
- Journal of Electronic Materials, 2004, v. 33, n. 9, p. 1016, doi. 10.1007/s11664-004-0029-6
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- Publication type:
- Article
12
Constitutive Relations on Creep for SnAgCuRE Lead-Free Solder Joints.
- Published in:
- Journal of Electronic Materials, 2004, v. 33, n. 9, p. 964
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- Publication type:
- Article
13
Development of Creep-Resistant, Nanosized Ag Particle-Reinforced Sn-Pb Composite Solders.
- Published in:
- Journal of Electronic Materials, 2004, v. 33, n. 9, p. 958, doi. 10.1007/s11664-004-0022-0
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- Publication type:
- Article
14
Residual Stress and Interfacial Reaction of the Electroplated Ni-Cu Alloy Under Bump Metallurgy in the Flip-Chip Solder Joint.
- Published in:
- Journal of Electronic Materials, 2004, v. 33, n. 9, p. 948, doi. 10.1007/s11664-004-0021-1
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- Publication type:
- Article
15
Selective Formation of Intermetallic Compounds in Sn-20ln-0.8Cu Ball Grid Array Solder Joints with Au/Ni Surface Finishes.
- Published in:
- Journal of Electronic Materials, 2004, v. 33, n. 9, p. 940, doi. 10.1007/s11664-004-0020-2
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- Publication type:
- Article
16
Thermodynamic Assessment of the Sn-Co Lead-Free Solder System.
- Published in:
- Journal of Electronic Materials, 2004, v. 33, n. 9, p. 935, doi. 10.1007/s11664-004-0019-8
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- Publication type:
- Article
17
Microstructure and Mechanical Properties of Annealed AI-1%Si Bonding Wire.
- Published in:
- Journal of Electronic Materials, 2004, v. 33, n. 9, p. 929, doi. 10.1007/s11664-004-0018-9
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- Publication type:
- Article