Works matching IS 03615235 AND DT 2004 AND VI 33 AND IP 8


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    Germanium-on-Insulator Substrates by Wafer Bonding.

    Published in:
    Journal of Electronic Materials, 2004, v. 33, n. 8, p. 886, doi. 10.1007/s11664-004-0216-5
    By:
    • Tracy, Clarence J.;
    • Fejes, Peter;
    • Theodore, N. David;
    • Maniar, Papu;
    • Johnson, Eric;
    • Lamm, Albert J.;
    • Paler, Anthony M.;
    • Malik, Igor J.;
    • Ong, Philip
    Publication type:
    Article
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