Works matching IS 03615235 AND DT 2004 AND VI 33 AND IP 5


Results: 21
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    SiC Via Holes by Laser Drilling.

    Published in:
    Journal of Electronic Materials, 2004, v. 33, n. 5, p. 477, doi. 10.1007/s11664-004-0206-7
    By:
    • Kim, S.;
    • Bang, B. S.;
    • Ren, F.;
    • D'entremont, J.;
    • Blumenfeld, W.;
    • Cordock, T.;
    • Pearton, S. J.
    Publication type:
    Article
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