Pulsed Laser Annealing of Self-Organized InAs/GaAs Quantum Dots.
- Published in:
- Journal of Electronic Materials, 2004, v. 33, n. 4, p. L5, doi. 10.1007/s11664-004-0147-1
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- Publication type:
- Article
Works matching IS 03615235 AND DT 2004 AND VI 33 AND IP 4
Results: 18
1
2
Mechanisms for the Intermetallic Formation during the Sn-20In-2.8Ag/Ni Soldering Reactions.
- Published in:
- Journal of Electronic Materials, 2004, v. 33, n. 4, p. 374, doi. 10.1007/s11664-004-0146-2
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- Publication type:
- Article
3
Electromigration in Sputtered Copper Film on Plasma-Treated Hydrogen Silsesquioxane Dielectric.
- Published in:
- Journal of Electronic Materials, 2004, v. 33, n. 4, p. 368, doi. 10.1007/s11664-004-0145-3
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- Publication type:
- Article
4
Thermal Desorption of Ge Native Oxides and the Loss of Ge from the Surface.
- Published in:
- Journal of Electronic Materials, 2004, v. 33, n. 4, p. 364, doi. 10.1007/s11664-004-0144-4
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- Publication type:
- Article
5
Etching of As- and P-Based III-V Semiconductors in a Planar Inductively Coupled BCl<sub>3</sub>/Ar Plasma.
- Published in:
- Journal of Electronic Materials, 2004, v. 33, n. 4, p. 358, doi. 10.1007/s11664-004-0143-5
- By:
- Publication type:
- Article
6
High Mobility Poly-Ge Thin-Film Transistors Fabricated on Flexible Plastic Substrates at Temperatures below 130°C.
- Published in:
- Journal of Electronic Materials, 2004, v. 33, n. 4, p. 353, doi. 10.1007/s11664-004-0142-6
- By:
- Publication type:
- Article
7
Phase Transformations in Thermally Exposed Au-Al Ball Bonds.
- Published in:
- Journal of Electronic Materials, 2004, v. 33, n. 4, p. 340, doi. 10.1007/s11664-004-0141-7
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- Publication type:
- Article
8
Experimental Investigation on Mechanisms of Silicon Chemical Mechanical Polishing.
- Published in:
- Journal of Electronic Materials, 2004, v. 33, n. 4, p. 334, doi. 10.1007/s11664-004-0140-8
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- Publication type:
- Article
9
Low-Cycle Fatigue Prediction Model for Pb-Free Solder 96.5Sn-3.5Ag.
- Published in:
- Journal of Electronic Materials, 2004, v. 33, n. 4, p. 329, doi. 10.1007/s11664-004-0139-1
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- Publication type:
- Article
10
Effect of Silver Content on the Shear Fatigue Properties of Sn-Ag-Cu Flip-Chip Interconnects.
- Published in:
- Journal of Electronic Materials, 2004, v. 33, n. 4, p. 321, doi. 10.1007/s11664-004-0138-2
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- Publication type:
- Article
11
Transparent Flexible Plastic Substrates for Organic Light-Emitting Devices.
- Published in:
- Journal of Electronic Materials, 2004, v. 33, n. 4, p. 312, doi. 10.1007/s11664-004-0137-3
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- Publication type:
- Article
12
Development of a Thermosonic Wire-Bonding Process for Gold Wire-Bonding to Copper Pads Using Argon Shielding.
- Published in:
- Journal of Electronic Materials, 2004, v. 33, n. 4, p. 300, doi. 10.1007/s11664-004-0136-4
- By:
- Publication type:
- Article
13
Thermosonic Bonding of Gold Wire onto a Copper Pad with Titanium Thin-Film Deposition.
- Published in:
- Journal of Electronic Materials, 2004, v. 33, n. 4, p. 290, doi. 10.1007/s11664-004-0135-5
- By:
- Publication type:
- Article
14
Soldering-Induced Cu Diffusion and Intermetallic Compound Formation between Ni/Cu Under Bump Metallization and SnPb Flip-Chip Solder Bumps.
- Published in:
- Journal of Electronic Materials, 2004, v. 33, n. 4, p. 283, doi. 10.1007/s11664-004-0134-6
- By:
- Publication type:
- Article
15
Reaction Characteristics of the In-15Pb-5Ag Solder with a Au/Ni/Cu Pad and Their Effects on Mechanical Properties.
- Published in:
- Journal of Electronic Materials, 2004, v. 33, n. 4, p. 277, doi. 10.1007/s11664-004-0133-7
- By:
- Publication type:
- Article
16
Characterization of Nonconductive Adhesives for Flip-Chip Interconnection.
- Published in:
- Journal of Electronic Materials, 2004, v. 33, n. 4, p. 271, doi. 10.1007/s11664-004-0132-8
- By:
- Publication type:
- Article
17
Development of a Novel Adaptive Lead-Free Solder Containing Reinforcements Displaying the Shape-Memory Effect.
- Published in:
- Journal of Electronic Materials, 2004, v. 33, n. 4, p. 258, doi. 10.1007/s11664-004-0131-9
- By:
- Publication type:
- Article
18
Low-Cycle Fatigue Characteristics of Sn-Based Solder Joints.
- Published in:
- Journal of Electronic Materials, 2004, v. 33, n. 4, p. 249, doi. 10.1007/s11664-004-0130-x
- By:
- Publication type:
- Article