Works matching IS 03615235 AND DT 2004 AND VI 33 AND IP 2
Results: 11
Porous Organosilicates Low-Dielectric Films for High-Frequency Devices.
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- Journal of Electronic Materials, 2004, v. 33, n. 2, p. 135, doi. 10.1007/s11664-004-0283-7
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Chlorine-Doped CdS Thin Films from CdCl[sub2]-Mixed CdS Powder.
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- Journal of Electronic Materials, 2004, v. 33, n. 2, p. 128, doi. 10.1007/s11664-004-0282-8
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The Role of the AIGaAs Doping Level on the Optical Gain of Two-Dimensional Electron Gas Photodetectors.
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- Journal of Electronic Materials, 2004, v. 33, n. 2, p. 123, doi. 10.1007/s11664-004-0281-9
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Selectively Etched Tunnel Junction for Lateral Current and Optical Confinement in InP-Based Vertical Cavity Lasers.
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- Journal of Electronic Materials, 2004, v. 33, n. 2, p. 118, doi. 10.1007/s11664-004-0280-x
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Uniformity in HgCdTe Diode Arrays Fabricated by Reactive Ion Etching.
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- Journal of Electronic Materials, 2004, v. 33, n. 2, p. 141, doi. 10.1007/s11664-004-0284-6
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Process Windows for Low-Temperature Au Wire Bonding.
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- Journal of Electronic Materials, 2004, v. 33, n. 2, p. 146, doi. 10.1007/s11664-004-0285-5
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Magnetic and Magnetotransport Properties in the n-Type (Ga, Mn)N Thin Films.
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- Journal of Electronic Materials, 2004, v. 33, n. 2, p. 114, doi. 10.1007/s11664-004-0279-3
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A Novel Approach to Stabilize Contact Resistance of Electrically Conductive Adhesives on Lead-Free Alloy Surfaces.
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- Journal of Electronic Materials, 2004, v. 33, n. 2, p. 106, doi. 10.1007/s11664-004-0278-4
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Effect of Organic/Inorganic Coating on Moisture Diffusion in a Chip-on-Board Package with Globtop.
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- Journal of Electronic Materials, 2004, v. 33, n. 2, p. 101, doi. 10.1007/s11664-004-0277-5
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Recombination Parameters for Antimonide-Based Semiconductors Using the Radio Frequency Photoreflectance Technique.
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- Journal of Electronic Materials, 2004, v. 33, n. 2, p. 94, doi. 10.1007/s11664-004-0276-6
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High-Quality Schottky and Ohmic Contacts in Planar 4H-SiC Metal Semiconductor Field-Effect Transistors and Device Performance.
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- Journal of Electronic Materials, 2004, v. 33, n. 2, p. 89, doi. 10.1007/s11664-004-0275-7
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- Article