Works matching IS 03615235 AND DT 2004 AND VI 33 AND IP 12
Results: 23
Ceramics Bonding Using Solder Glass Frit.
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- Journal of Electronic Materials, 2004, v. 33, n. 12, p. 1516, doi. 10.1007/s11664-004-0093-y
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The Effects of Electroplating Parameters on the Composition and Morphology of Sn-Ag Solder.
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- Journal of Electronic Materials, 2004, v. 33, n. 12, p. 1459, doi. 10.1007/s11664-004-0087-9
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An Evaluation of the Lap-Shear Test for Sn-Rich Solder/Cu Couples: Experiments and Simulation.
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- Journal of Electronic Materials, 2004, v. 33, n. 12, p. 1589, doi. 10.1007/s11664-004-0102-1
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Mechanical Properties of Near-Eutectic Sn-Ag-Cu Alloy over a Wide Range of Temperatures and Strain Rates.
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- Journal of Electronic Materials, 2004, v. 33, n. 12, p. 1581, doi. 10.1007/s11664-004-0101-2
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Effect of Cooling Rate on Growth of the Intermetallic Compound and Fracture Mode of Near-Eutectic Sn-Ag-Cu/Cu Pad: Before and After Aging.
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- Journal of Electronic Materials, 2004, v. 33, n. 12, p. 1530, doi. 10.1007/s11664-004-0095-9
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Intermetallic Phase Detection in Lead-Free Solders Using Synchrotron X-Ray Diffraction.
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- Journal of Electronic Materials, 2004, v. 33, n. 12, p. 1524, doi. 10.1007/s11664-004-0094-x
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Effects of Cooling Rate on Creep Behavior of a Sn-3.5Ag Alloy.
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- Journal of Electronic Materials, 2004, v. 33, n. 12, p. 1596, doi. 10.1007/s11664-004-0103-0
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Interfacial Reaction Study on a Solder Joint with Sn-4Ag-0.5Cu Solder Ball and Sn-7Zn-Al (30 ppm) Solder Paste in a Lead-Free Wafer Level Chip Scale Package.
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- Journal of Electronic Materials, 2004, v. 33, n. 12, p. 1550, doi. 10.1007/s11664-004-0097-7
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Quantitative Metallography of β-Sn Dendrites in Sn-3.8Ag-0.7Cu Ball Grid Array Solder Balls via Electron Backscatter Diffraction and Polarized Light Microscopy.
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- Journal of Electronic Materials, 2004, v. 33, n. 12, p. 1545, doi. 10.1007/s11664-004-0096-8
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A Dynamic Model for the Assessment of the Replacement of Lead in Solders.
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- Journal of Electronic Materials, 2004, v. 33, n. 12, p. 1567, doi. 10.1007/s11664-004-0100-3
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The Effect of Isothermal Aging on the Thickness of Intermetallic Compound Layer Growth between Low Melting Point Solders and Ni-Plated Cu Substrate.
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- Journal of Electronic Materials, 2004, v. 33, n. 12, p. 1561, doi. 10.1007/s11664-004-0099-5
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Intermetallic Compounds and Adhesion Strength between the Sn-9Zn-1.5Ag-0.5Bi Lead-Free Solder and Unfluxed Cu Substrate.
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- Journal of Electronic Materials, 2004, v. 33, n. 12, p. 1557, doi. 10.1007/s11664-004-0098-6
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Effects of Load and Thermal Conditions on Pb-Free Solder Joint Reliability.
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- Journal of Electronic Materials, 2004, v. 33, n. 12, p. 1507, doi. 10.1007/s11664-004-0092-z
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Accelerated Thermal Fatigue of Lead-Free Solder Joints as a Function of Reflow Cooling Rate.
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- Journal of Electronic Materials, 2004, v. 33, n. 12, p. 1497, doi. 10.1007/s11664-004-0091-0
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Creep Behavior of the Ternary 95.5Sn-3.9Ag-0.6Cu Solder: Part II-Aged Condition.
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- Journal of Electronic Materials, 2004, v. 33, n. 12, p. 1473, doi. 10.1007/s11664-004-0089-7
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Elevated Temperature Aging of Solder Joints Based on Sn-Ag-Cu: Effects on Joint Microstructure and Shear Strength.
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- Journal of Electronic Materials, 2004, v. 33, n. 12, p. 1485, doi. 10.1007/s11664-004-0090-1
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Morphology and Kinetic Study of the Interfacial Reaction between the Sn-3.5Ag Solder and Electroless Ni-P Metallization.
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- Journal of Electronic Materials, 2004, v. 33, n. 12, p. 1465, doi. 10.1007/s11664-004-0088-8
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Contact Angle Measurements of Sn-Ag and Sn-Cu Lead-Free Solders on Copper Substrates.
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- Journal of Electronic Materials, 2004, v. 33, n. 12, p. 1452, doi. 10.1007/s11664-004-0086-x
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Effect of Cu Concentration on Morphology of Sn-Ag-Cu Solders by Mechanical Alloying.
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- Journal of Electronic Materials, 2004, v. 33, n. 12, p. 1445, doi. 10.1007/s11664-004-0085-y
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The Application of Lead-Free Solder to Optical Fiber Packaging.
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- Journal of Electronic Materials, 2004, v. 33, n. 12, p. 1440, doi. 10.1007/s11664-004-0084-z
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Cross-Interaction of Under-Bump Metallurgy and Surface Finish in Flip-Chip Solder Joints.
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- Journal of Electronic Materials, 2004, v. 33, n. 12, p. 1424, doi. 10.1007/s11664-004-0082-1
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Grain-Boundary Character and Grain Growth in Bulk Tin and Bulk Lead-Free Solder Alloys.
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- Journal of Electronic Materials, 2004, v. 33, n. 12, p. 1412, doi. 10.1007/s11664-004-0081-2
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Growth of Sn and Intermetallic Compounds in Sn-Ag-Cu Solder.
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- Journal of Electronic Materials, 2004, v. 33, n. 12, p. 1429, doi. 10.1007/s11664-004-0083-0
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