Works matching IS 03615235 AND DT 2004 AND VI 33 AND IP 12

Results: 23

The Effects of Electroplating Parameters on the Composition and Morphology of Sn-Ag Solder.

Published in:

Journal of Electronic Materials, 2004, v. 33, n. 12, p. 1459, doi. 10.1007/s11664-004-0087-9

By:

Kim, J. Y.;
Yu, J.;
Lee, J. H.;
Lee, T. Y.

Publication type:

Article

Effects of Cooling Rate on Creep Behavior of a Sn-3.5Ag Alloy.

Published in:

Journal of Electronic Materials, 2004, v. 33, n. 12, p. 1596, doi. 10.1007/s11664-004-0103-0

By:

Ochoa, F.;
Deng, X.;
Chawla, N.

Publication type:

Article

An Evaluation of the Lap-Shear Test for Sn-Rich Solder/Cu Couples: Experiments and Simulation.

Published in:

Journal of Electronic Materials, 2004, v. 33, n. 12, p. 1589, doi. 10.1007/s11664-004-0102-1

By:

Chawla, N.;
Shen, Y. -L.;
Deng, X.;
Ege, E. S.

Publication type:

Article

Mechanical Properties of Near-Eutectic Sn-Ag-Cu Alloy over a Wide Range of Temperatures and Strain Rates.

Published in:

Journal of Electronic Materials, 2004, v. 33, n. 12, p. 1581, doi. 10.1007/s11664-004-0101-2

By:

Korhonen, Tia-Marje K.;
Turpeinen, Pekka;
Lehman, Lawrence P.;
Bowman, Brian;
Thiel, George H.;
Parkes, Raymond C.;
Korhonen, Matt A.;
Henderson, Donald W.;
Puttlitz, Karl J.

Publication type:

Article

A Dynamic Model for the Assessment of the Replacement of Lead in Solders.

Published in:

Journal of Electronic Materials, 2004, v. 33, n. 12, p. 1567, doi. 10.1007/s11664-004-0100-3

By:

Reuter, Markus A.;
Verhoef, Ewoud V.

Publication type:

Article

The Effect of Isothermal Aging on the Thickness of Intermetallic Compound Layer Growth between Low Melting Point Solders and Ni-Plated Cu Substrate.

Published in:

Journal of Electronic Materials, 2004, v. 33, n. 12, p. 1561, doi. 10.1007/s11664-004-0099-5

By:

Dae-Gon Kim;
Seung-Boo Jung

Publication type:

Article

Intermetallic Compounds and Adhesion Strength between the Sn-9Zn-1.5Ag-0.5Bi Lead-Free Solder and Unfluxed Cu Substrate.

Published in:

Journal of Electronic Materials, 2004, v. 33, n. 12, p. 1557, doi. 10.1007/s11664-004-0098-6

By:

Chih-Yao Liu;
Moo-Chin Wang;
Min-Hsiung Hon

Publication type:

Article

Interfacial Reaction Study on a Solder Joint with Sn-4Ag-0.5Cu Solder Ball and Sn-7Zn-Al (30 ppm) Solder Paste in a Lead-Free Wafer Level Chip Scale Package.

Published in:

Journal of Electronic Materials, 2004, v. 33, n. 12, p. 1550, doi. 10.1007/s11664-004-0097-7

By:

Huann-Wu Chiang;
Jun-Yuan Chen;
Lee, Jeffrey C. B.;
Li, S. M.

Publication type:

Article

Quantitative Metallography of β-Sn Dendrites in Sn-3.8Ag-0.7Cu Ball Grid Array Solder Balls via Electron Backscatter Diffraction and Polarized Light Microscopy.

Published in:

Journal of Electronic Materials, 2004, v. 33, n. 12, p. 1545, doi. 10.1007/s11664-004-0096-8

By:

LaLonde, A.;
Emelander, D.;
Jeannette, J.;
Larson, C.;
Rietz, W.;
Swenson, D.;
Henderson, D. W.

Publication type:

Article

Effect of Cooling Rate on Growth of the Intermetallic Compound and Fracture Mode of Near-Eutectic Sn-Ag-Cu/Cu Pad: Before and After Aging.

Published in:

Journal of Electronic Materials, 2004, v. 33, n. 12, p. 1530, doi. 10.1007/s11664-004-0095-9

By:

Sang Won Jeong;
Jong Hoon Kim;
Hyuck Mo Lee

Publication type:

Article

Intermetallic Phase Detection in Lead-Free Solders Using Synchrotron X-Ray Diffraction.

Published in:

Journal of Electronic Materials, 2004, v. 33, n. 12, p. 1524, doi. 10.1007/s11664-004-0094-x

By:

Jackson, Gavin J.;
Lu, Hua;
Durairaj, Raj;
Hoo, Nick;
Bailey, Chris;
Ekere, Ndy N.;
Wright, Jon

Publication type:

Article

Ceramics Bonding Using Solder Glass Frit.

Published in:

Journal of Electronic Materials, 2004, v. 33, n. 12, p. 1516, doi. 10.1007/s11664-004-0093-y

By:

Sun, Z.;
Pan, D.;
Wei, J.;
Wong, C. K.

Publication type:

Article

Effects of Load and Thermal Conditions on Pb-Free Solder Joint Reliability.

Published in:

Journal of Electronic Materials, 2004, v. 33, n. 12, p. 1507, doi. 10.1007/s11664-004-0092-z

By:

Liang, J.;
Downes, S.;
Dariavach, N.;
Shangguan, D.;
Heinrich, S. M.

Publication type:

Article

Accelerated Thermal Fatigue of Lead-Free Solder Joints as a Function of Reflow Cooling Rate.

Published in:

Journal of Electronic Materials, 2004, v. 33, n. 12, p. 1497, doi. 10.1007/s11664-004-0091-0

By:

Qi, Y.;
Zbrzezny, A. R.;
Agia, M.;
Lam, R.;
Snugovsky, P.;
Perovic, D. D.;
Spelt, J. K.;
Ghorbani, H. R.

Publication type:

Article

Elevated Temperature Aging of Solder Joints Based on Sn-Ag-Cu: Effects on Joint Microstructure and Shear Strength.

Published in:

Journal of Electronic Materials, 2004, v. 33, n. 12, p. 1485, doi. 10.1007/s11664-004-0090-1

By:

Anderson, I. E.;
Harringa, J. L.

Publication type:

Article

Creep Behavior of the Ternary 95.5Sn-3.9Ag-0.6Cu Solder: Part II-Aged Condition.

Published in:

Journal of Electronic Materials, 2004, v. 33, n. 12, p. 1473, doi. 10.1007/s11664-004-0089-7

By:

Vianco, Paul T.;
Rejent, Jerome A.;
Kilgo, Alice C.

Publication type:

Article

Morphology and Kinetic Study of the Interfacial Reaction between the Sn-3.5Ag Solder and Electroless Ni-P Metallization.

Published in:

Journal of Electronic Materials, 2004, v. 33, n. 12, p. 1465, doi. 10.1007/s11664-004-0088-8

By:

Chen, Zhong;
He, Min;
Qi, Guojun

Publication type:

Article

Contact Angle Measurements of Sn-Ag and Sn-Cu Lead-Free Solders on Copper Substrates.

Published in:

Journal of Electronic Materials, 2004, v. 33, n. 12, p. 1452, doi. 10.1007/s11664-004-0086-x

By:

Arenas, Mario F.;
Acoff, Viola L.

Publication type:

Article

Effect of Cu Concentration on Morphology of Sn-Ag-Cu Solders by Mechanical Alloying.

Published in:

Journal of Electronic Materials, 2004, v. 33, n. 12, p. 1445, doi. 10.1007/s11664-004-0085-y

By:

Szu-Tsung Kao;
Jenq-Gong Duh

Publication type:

Article

The Application of Lead-Free Solder to Optical Fiber Packaging.

Published in:

Journal of Electronic Materials, 2004, v. 33, n. 12, p. 1440, doi. 10.1007/s11664-004-0084-z

By:

Ou, Shengquan;
Xu, Gu;
Xu, Yuhuan;
Tu, K. N.

Publication type:

Article

Growth of Sn and Intermetallic Compounds in Sn-Ag-Cu Solder.

Published in:

Journal of Electronic Materials, 2004, v. 33, n. 12, p. 1429, doi. 10.1007/s11664-004-0083-0

By:

Lehman, L. P.;
Athavale, S. N.;
Fullem, T. Z.;
Giamis, A. C.;
Kinyanjui, R. K.;
Lowenstein, M.;
Mather, K.;
Patel, R.;
Rae, D.;
Wang, J.;
Xing, Y.;
Zavalij, L.;
Borgesen, P.;
Cotts, E. J.

Publication type:

Article

Cross-Interaction of Under-Bump Metallurgy and Surface Finish in Flip-Chip Solder Joints.

Published in:

Journal of Electronic Materials, 2004, v. 33, n. 12, p. 1424, doi. 10.1007/s11664-004-0082-1

By:

Tsai, C. M.;
Luo, Sw. C.;
Chang, C. W.;
Shieh, Y. C.;
Kao, C. R.

Publication type:

Article

Grain-Boundary Character and Grain Growth in Bulk Tin and Bulk Lead-Free Solder Alloys.

Published in:

Journal of Electronic Materials, 2004, v. 33, n. 12, p. 1412, doi. 10.1007/s11664-004-0081-2

By:

Telang, A. U.;
Bieler, T. R.;
Lucas, J. P.;
Subramanian, K. N.;
Lehman, L. P.;
Xing, Y.;
Cotts, E. J.

Publication type:

Article