Works matching IS 03615235 AND DT 2004 AND VI 33 AND IP 11
Results: 26
Novel Micro-Bump Fabrication for Flip-Chip Bonding.
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- Journal of Electronic Materials, 2004, v. 33, n. 11, p. L21, doi. 10.1007/s11664-004-0172-0
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Equilibrium Constants for Quasi-Chemical Defect Reactions.
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- Journal of Electronic Materials, 2004, v. 33, n. 11, p. L24, doi. 10.1007/s11664-004-0173-z
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Ohmic Contacts to n-Type GaSb and n-Type GalnAsSb.
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- Journal of Electronic Materials, 2004, v. 33, n. 11, p. 1406, doi. 10.1007/s11664-004-0171-1
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Influence of GaN Material Characteristics on Device Performance for Blue and Ultraviolet Light-Emitting Diodes.
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- Journal of Electronic Materials, 2004, v. 33, n. 11, p. 1401, doi. 10.1007/s11664-004-0170-2
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Creep Behavior of the Ternary 95.5Sn-3.9Ag-0.6Cu Solder--Part I: As-Cast Condition.
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- Journal of Electronic Materials, 2004, v. 33, n. 11, p. 1389, doi. 10.1007/s11664-004-0169-8
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Stabilizing Contact Resistance of Isotropically Conductive Adhesives on Various Metal Surfaces by Incorporating Sacrificial Anode Materials.
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- Journal of Electronic Materials, 2004, v. 33, n. 11, p. 1381, doi. 10.1007/s11664-004-0168-9
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Aging Study on Interfacial Microstructure and Solder-Ball Shear Strength of a Wafer-Level Chip-Size Package with Au/Ni Metallization on a Cu Pad.
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- Journal of Electronic Materials, 2004, v. 33, n. 11, p. 1373, doi. 10.1007/s11664-004-0167-x
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Microstructure and Texture of Free-Standing Cu-Line Patterns.
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- Journal of Electronic Materials, 2004, v. 33, n. 11, p. 1363, doi. 10.1007/s11664-004-0166-y
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Effect of Cooling Rate on Microstructure and Shear Strength of Pure Sn, Sn-0.TCu, Sn-3.5Ag, and Sn-37Pb Solders.
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- Journal of Electronic Materials, 2004, v. 33, n. 11, p. 1355, doi. 10.1007/s11664-004-0165-z
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Origin of Room-Temperature Ferromagnetism in Cobalt-Doped ZnO.
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- Journal of Electronic Materials, 2004, v. 33, n. 11, p. 1298, doi. 10.1007/s11664-004-0156-0
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Thermal Gradient in Solder Joints under Electrical-Current Stressing.
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- Journal of Electronic Materials, 2004, v. 33, n. 11, p. 1350, doi. 10.1007/s11664-004-0164-0
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Partitioned Viscoplastic-Constitutive Properties of the Pb-Free Sn3.9Ag0.6Cu Solder.
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- Journal of Electronic Materials, 2004, v. 33, n. 11, p. 1338, doi. 10.1007/s11664-004-0163-1
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Molecular Dynamics Study on the Coalescence of Cu Nanoparticles and Their Deposition on the Cu Substrate.
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- Journal of Electronic Materials, 2004, v. 33, n. 11, p. 1326, doi. 10.1007/s11664-004-0161-3
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Burnout of the Organic Vehicle in an Electrically Conductive Thick-Film Paste.
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- Journal of Electronic Materials, 2004, v. 33, n. 11, p. 1316, doi. 10.1007/s11664-004-0160-4
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The Solid Solubility of Ag and Cu in the Sn Phase of Eutectic and Near-Eutectic Sn-Ag-Cu Solder Alloys.
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- Journal of Electronic Materials, 2004, v. 33, n. 11, p. 1313, doi. 10.1007/s11664-004-0159-x
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A Novel Magnetic Random Access Memory Design Using Square Ring Elements for the Hard Layer.
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- Journal of Electronic Materials, 2004, v. 33, n. 11, p. 1269, doi. 10.1007/s11664-004-0152-4
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Isotropic Conductive Adhesives with Fusible Filler Particles.
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- Journal of Electronic Materials, 2004, v. 33, n. 11, p. 1331, doi. 10.1007/s11664-004-0162-2
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Enhancement of Ferromagnetism in the Colossal-Magnetoresistance Layered Manganite La<sub>1.2</sub>Ba<sub>1.8</sub>Mn<sub>2-x</sub>Ru<sub>x</sub>0<sub>7</sub> (x = O, 0.1,0.5, and 1).
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- Journal of Electronic Materials, 2004, v. 33, n. 11, p. 1264, doi. 10.1007/s11664-004-0151-5
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Magnetics and Magnetoresistance in Epitaxial Magnetite Heterostructures.
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- Journal of Electronic Materials, 2004, v. 33, n. 11, p. 1254, doi. 10.1007/s11664-004-0149-z
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Etching of 4H-SiC Using a NF<sub>3</sub> Inductively Coupled Plasma.
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- Journal of Electronic Materials, 2004, v. 33, n. 11, p. 1308, doi. 10.1007/s11664-004-0158-y
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Magnetoresistance and Magnetization Studies of the Layered Manganite System La<sub>1.2</sub>Ca<sub>1.8</sub>Mn<sub>2-x</sub>Ru<sub>x</sub>0<sub>7</sub>(0≤x≤1).
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- Journal of Electronic Materials, 2004, v. 33, n. 11, p. 1259, doi. 10.1007/s11664-004-0150-6
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Destruction Of an Orbitally Ordered and Spin-Polarized State: Colossal Magnetoresistance in Ca<sub>3</sub>Ru<sub>2</sub>0<sub>7</sub>.
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- Journal of Electronic Materials, 2004, v. 33, n. 11, p. 1303, doi. 10.1007/s11664-004-0157-z
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Foreword.
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- Journal of Electronic Materials, 2004, v. 33, n. 11, p. 1253, doi. 10.1007/s11664-004-0148-0
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Mechanical Alloying of FeCo Nanocrystalline Magnetic Powders.
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- Journal of Electronic Materials, 2004, v. 33, n. 11, p. 1289, doi. 10.1007/s11664-004-0155-1
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Electrical and Magnetoresistance Properties of Composites Consisting of Iron Nanoparticles within the Hexaferrites.
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- Journal of Electronic Materials, 2004, v. 33, n. 11, p. 1280, doi. 10.1007/s11664-004-0154-2
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Probing Tunnel Barrier Shape and Its Effects on Inversed Tunneling Magnetoresistance at High Bias.
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- Journal of Electronic Materials, 2004, v. 33, n. 11, p. 1274, doi. 10.1007/s11664-004-0153-3
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