Works matching IS 03615235 AND DT 2004 AND VI 33 AND IP 11

Results: 26

Equilibrium Constants for Quasi-Chemical Defect Reactions.

Published in:

Journal of Electronic Materials, 2004, v. 33, n. 11, p. L24, doi. 10.1007/s11664-004-0173-z

By:

Brebrick, Robert F.

Publication type:

Article

Novel Micro-Bump Fabrication for Flip-Chip Bonding.

Published in:

Journal of Electronic Materials, 2004, v. 33, n. 11, p. L21, doi. 10.1007/s11664-004-0172-0

By:

Ishii, Takao;
Aoyama, Shinji

Publication type:

Article

Ohmic Contacts to n-Type GaSb and n-Type GalnAsSb.

Published in:

Journal of Electronic Materials, 2004, v. 33, n. 11, p. 1406, doi. 10.1007/s11664-004-0171-1

By:

Huang, Robin K.;
Wang, Christine A.;
Harris, Christopher T.;
Connors, Michael K.;
Shiau, Daniel A.

Publication type:

Article

Influence of GaN Material Characteristics on Device Performance for Blue and Ultraviolet Light-Emitting Diodes.

Published in:

Journal of Electronic Materials, 2004, v. 33, n. 11, p. 1401, doi. 10.1007/s11664-004-0170-2

By:

Merfeld, D. W.;
Cao, X. A.;
Leboeuf, S. F.;
Arthur, S. D.;
Kretchmer, J. W.;
D'Evelyn, M. P.

Publication type:

Article

Creep Behavior of the Ternary 95.5Sn-3.9Ag-0.6Cu Solder--Part I: As-Cast Condition.

Published in:

Journal of Electronic Materials, 2004, v. 33, n. 11, p. 1389, doi. 10.1007/s11664-004-0169-8

By:

Vianco, Paul T.;
Rejent, Jerome A.;
Kilgo, Alice C.

Publication type:

Article

Stabilizing Contact Resistance of Isotropically Conductive Adhesives on Various Metal Surfaces by Incorporating Sacrificial Anode Materials.

Published in:

Journal of Electronic Materials, 2004, v. 33, n. 11, p. 1381, doi. 10.1007/s11664-004-0168-9

By:

Kyong-Sik Moon;
Liong, Silvia;
Haiying Li;
Wong, C. P.

Publication type:

Article

Aging Study on Interfacial Microstructure and Solder-Ball Shear Strength of a Wafer-Level Chip-Size Package with Au/Ni Metallization on a Cu Pad.

Published in:

Journal of Electronic Materials, 2004, v. 33, n. 11, p. 1373, doi. 10.1007/s11664-004-0167-x

By:

Kuo-Chin Chang;
Kuo-Ning Chiang

Publication type:

Article

Microstructure and Texture of Free-Standing Cu-Line Patterns.

Published in:

Journal of Electronic Materials, 2004, v. 33, n. 11, p. 1363, doi. 10.1007/s11664-004-0166-y

By:

Pantleon, Karen;
Somers, Marcela A. J.

Publication type:

Article

Effect of Cooling Rate on Microstructure and Shear Strength of Pure Sn, Sn-0.TCu, Sn-3.5Ag, and Sn-37Pb Solders.

Published in:

Journal of Electronic Materials, 2004, v. 33, n. 11, p. 1355, doi. 10.1007/s11664-004-0165-z

By:

Maveety, J. G.;
Liu, P.;
Vijayen, J.;
Hua, F.;
Sanchez, E. A.

Publication type:

Article

Thermal Gradient in Solder Joints under Electrical-Current Stressing.

Published in:

Journal of Electronic Materials, 2004, v. 33, n. 11, p. 1350, doi. 10.1007/s11664-004-0164-0

By:

Shao, T. L.;
Chiu, S. H.;
Chih Chen;
Yao, D. J.;
Hsu, C. Y.

Publication type:

Article

Partitioned Viscoplastic-Constitutive Properties of the Pb-Free Sn3.9Ag0.6Cu Solder.

Published in:

Journal of Electronic Materials, 2004, v. 33, n. 11, p. 1338, doi. 10.1007/s11664-004-0163-1

By:

Qian Zhang;
Dasgupta, Abhijt;
Haswell, Peter

Publication type:

Article

Isotropic Conductive Adhesives with Fusible Filler Particles.

Published in:

Journal of Electronic Materials, 2004, v. 33, n. 11, p. 1331, doi. 10.1007/s11664-004-0162-2

By:

Jong-Min Kim;
Yasuda, Kiyokazu;
Fujimoto, Kozo

Publication type:

Article

Molecular Dynamics Study on the Coalescence of Cu Nanoparticles and Their Deposition on the Cu Substrate.

Published in:

Journal of Electronic Materials, 2004, v. 33, n. 11, p. 1326, doi. 10.1007/s11664-004-0161-3

By:

Hai Dong;
Kyoung-Sik Moon;
Wong, C. P.

Publication type:

Article

Burnout of the Organic Vehicle in an Electrically Conductive Thick-Film Paste.

Published in:

Journal of Electronic Materials, 2004, v. 33, n. 11, p. 1316, doi. 10.1007/s11664-004-0160-4

By:

Zongrong Liu;
Chung, D. D. L.

Publication type:

Article

The Solid Solubility of Ag and Cu in the Sn Phase of Eutectic and Near-Eutectic Sn-Ag-Cu Solder Alloys.

Published in:

Journal of Electronic Materials, 2004, v. 33, n. 11, p. 1313, doi. 10.1007/s11664-004-0159-x

By:

Snugovsky, L.;
Cermignani, C.;
Perovic, D. D.;
Rutter, J. W.

Publication type:

Article

Etching of 4H-SiC Using a NF3 Inductively Coupled Plasma.

Published in:

Journal of Electronic Materials, 2004, v. 33, n. 11, p. 1308, doi. 10.1007/s11664-004-0158-y

By:

Byungwhan Kim;
Byung-Teak Lee

Publication type:

Article

Destruction Of an Orbitally Ordered and Spin-Polarized State: Colossal Magnetoresistance in Ca3Ru207.

Published in:

Journal of Electronic Materials, 2004, v. 33, n. 11, p. 1303, doi. 10.1007/s11664-004-0157-z

By:

Cao, G.;
Balicas, L.;
Lin, X. N.;
Chikara, S.;
Elhami, E.;
Duairaj, V.;
Brill, J. W.;
Rai, R. C.;
Crow, J. E.

Publication type:

Article

Origin of Room-Temperature Ferromagnetism in Cobalt-Doped ZnO.

Published in:

Journal of Electronic Materials, 2004, v. 33, n. 11, p. 1298, doi. 10.1007/s11664-004-0156-0

By:

Ramachandran, S.;
Tiwari, Ashutosh;
Narayan, J.

Publication type:

Article

Mechanical Alloying of FeCo Nanocrystalline Magnetic Powders.

Published in:

Journal of Electronic Materials, 2004, v. 33, n. 11, p. 1289, doi. 10.1007/s11664-004-0155-1

By:

Li, H. F.;
Ramanujan, R. V.

Publication type:

Article

Electrical and Magnetoresistance Properties of Composites Consisting of Iron Nanoparticles within the Hexaferrites.

Published in:

Journal of Electronic Materials, 2004, v. 33, n. 11, p. 1280, doi. 10.1007/s11664-004-0154-2

By:

Sudakar, C.;
Kutty, T. R. N.

Publication type:

Article

Probing Tunnel Barrier Shape and Its Effects on Inversed Tunneling Magnetoresistance at High Bias.

Published in:

Journal of Electronic Materials, 2004, v. 33, n. 11, p. 1274, doi. 10.1007/s11664-004-0153-3

By:

Wen-Ting Sheng;
Wang, W. G.;
Xiang, X. H.;
Shen, F.;
Fei-Fei Li;
Zhu, T.;
Zhang, Z.;
Zheng-Zhong Li;
Jun Du;
An Hu;
Xiao, John Q.

Publication type:

Article

A Novel Magnetic Random Access Memory Design Using Square Ring Elements for the Hard Layer.

Published in:

Journal of Electronic Materials, 2004, v. 33, n. 11, p. 1269, doi. 10.1007/s11664-004-0152-4

By:

Geerpuram, Dwarakanath N.;
Mani, Anand S.;
Baskaran, Vidhya Shankar

Publication type:

Article

Enhancement of Ferromagnetism in the Colossal-Magnetoresistance Layered Manganite La1.2Ba1.8Mn2-xRux07 (x = O, 0.1,0.5, and 1).

Published in:

Journal of Electronic Materials, 2004, v. 33, n. 11, p. 1264, doi. 10.1007/s11664-004-0151-5

By:

Sudhakar, Nori;
Rajeev, K. P.;
Nigam, A. K.

Publication type:

Article

Magnetoresistance and Magnetization Studies of the Layered Manganite System La1.2Ca1.8Mn2-xRux07(0≤x≤1).

Published in:

Journal of Electronic Materials, 2004, v. 33, n. 11, p. 1259, doi. 10.1007/s11664-004-0150-6

By:

Sudhakar, Nori;
Rajeev, K. P.

Publication type:

Article

Magnetics and Magnetoresistance in Epitaxial Magnetite Heterostructures.

Published in:

Journal of Electronic Materials, 2004, v. 33, n. 11, p. 1254, doi. 10.1007/s11664-004-0149-z

By:

Chopdekar, R. V.;
Hu, G.;
Ford, A. C.;
Suzuki, Y.

Publication type:

Article

Foreword.

Published in:

Journal of Electronic Materials, 2004, v. 33, n. 11, p. 1253, doi. 10.1007/s11664-004-0148-0

By:

Tiwari, Ashutosh

Publication type:

Article

Works matching IS 03615235 AND DT 2004 AND VI 33 AND IP 11

Equilibrium Constants for Quasi-Chemical Defect Reactions.

Novel Micro-Bump Fabrication for Flip-Chip Bonding.

Ohmic Contacts to n-Type GaSb and n-Type GalnAsSb.

Influence of GaN Material Characteristics on Device Performance for Blue and Ultraviolet Light-Emitting Diodes.

Creep Behavior of the Ternary 95.5Sn-3.9Ag-0.6Cu Solder--Part I: As-Cast Condition.

Stabilizing Contact Resistance of Isotropically Conductive Adhesives on Various Metal Surfaces by Incorporating Sacrificial Anode Materials.

Aging Study on Interfacial Microstructure and Solder-Ball Shear Strength of a Wafer-Level Chip-Size Package with Au/Ni Metallization on a Cu Pad.

Microstructure and Texture of Free-Standing Cu-Line Patterns.

Effect of Cooling Rate on Microstructure and Shear Strength of Pure Sn, Sn-0.TCu, Sn-3.5Ag, and Sn-37Pb Solders.

Thermal Gradient in Solder Joints under Electrical-Current Stressing.

Partitioned Viscoplastic-Constitutive Properties of the Pb-Free Sn3.9Ag0.6Cu Solder.

Isotropic Conductive Adhesives with Fusible Filler Particles.

Molecular Dynamics Study on the Coalescence of Cu Nanoparticles and Their Deposition on the Cu Substrate.

Burnout of the Organic Vehicle in an Electrically Conductive Thick-Film Paste.

The Solid Solubility of Ag and Cu in the Sn Phase of Eutectic and Near-Eutectic Sn-Ag-Cu Solder Alloys.

Etching of 4H-SiC Using a NF<sub>3</sub> Inductively Coupled Plasma.

Destruction Of an Orbitally Ordered and Spin-Polarized State: Colossal Magnetoresistance in Ca<sub>3</sub>Ru<sub>2</sub>0<sub>7</sub>.

Origin of Room-Temperature Ferromagnetism in Cobalt-Doped ZnO.

Mechanical Alloying of FeCo Nanocrystalline Magnetic Powders.

Electrical and Magnetoresistance Properties of Composites Consisting of Iron Nanoparticles within the Hexaferrites.

Probing Tunnel Barrier Shape and Its Effects on Inversed Tunneling Magnetoresistance at High Bias.

A Novel Magnetic Random Access Memory Design Using Square Ring Elements for the Hard Layer.

Enhancement of Ferromagnetism in the Colossal-Magnetoresistance Layered Manganite La<sub>1.2</sub>Ba<sub>1.8</sub>Mn<sub>2-x</sub>Ru<sub>x</sub>0<sub>7</sub> (x = O, 0.1,0.5, and 1).

Magnetoresistance and Magnetization Studies of the Layered Manganite System La<sub>1.2</sub>Ca<sub>1.8</sub>Mn<sub>2-x</sub>Ru<sub>x</sub>0<sub>7</sub>(0≤x≤1).

Magnetics and Magnetoresistance in Epitaxial Magnetite Heterostructures.

Foreword.