Works matching IS 03615235 AND DT 2004 AND VI 33 AND IP 10

Results: 26

Effects of Excess Bi Concentration, Buffered Bi2O3 Layer, and Ta Doping on the Orientation and Ferroelectricity of Chemical-Solution-Deposited Bi3.25La0.75Ti3O12 Films.

Published in:

Journal of Electronic Materials, 2004, v. 33, n. 10, p. 1248, doi. 10.1007/s11664-004-0129-3

By:

Jian-Long Lin;
Tian-Lin Chang;
Wen-Tai Lin

Publication type:

Article

Capacitance-Voltage Characterization of Pulsed Plasma Polymerized Allylamine Dielectrics for Flexible Polymeric Field Effect Transistors.

Published in:

Journal of Electronic Materials, 2004, v. 33, n. 10, p. 1240, doi. 10.1007/s11664-004-0128-4

By:

Yifan Xu;
Berger, Paul R.;
Jai Cho;
Timmons, Richard B.

Publication type:

Article

Dielectric Properties of Low Loss Ba6-3xNd8+2xTi18O54 Thin Films Prepared by Pulsed Laser Deposition for Microwave Applications.

Published in:

Journal of Electronic Materials, 2004, v. 33, n. 10, p. 1236, doi. 10.1007/s11664-004-0127-5

By:

Xia, Y. D.;
Shi, G. H.;
Wu, D.;
Liu, Z. G.

Publication type:

Article

The Effect of Microstructural and Geometrical Features on the Reliability of Ultrafine Flip Chip Microsolder Joints.

Published in:

Journal of Electronic Materials, 2004, v. 33, n. 10, p. 1227, doi. 10.1007/s11664-004-0126-6

By:

Zhiheng Huang;
Conway, Paul P.;
Changqing Liu;
Thomson, Rachel C.

Publication type:

Article

Intermetallic Growth Studies on Sn-Ag-Cu Lead-Free Solder Joints.

Published in:

Journal of Electronic Materials, 2004, v. 33, n. 10, p. 1219, doi. 10.1007/s11664-004-0125-7

By:

Pang, John H. L.;
Luhua Xu;
Shi, X. Q.;
Zhou, W.;
Ngoh, S. L.

Publication type:

Article

Effects of Pd Addition on Au Stud Bumps/Al Pads Interfacial Reactions and Bond Reliability.

Published in:

Journal of Electronic Materials, 2004, v. 33, n. 10, p. 1210, doi. 10.1007/s11664-004-0124-8

By:

Hyoung-Joon Kim;
Jong-Soo Cho;
Yong-Jin Park;
Jin Lee;
Kyung-Wook Paik

Publication type:

Article

Influence of Cu Addition to Interface Microstructure between Sn-Ag Solder and Au/Ni-6P Plating.

Published in:

Journal of Electronic Materials, 2004, v. 33, n. 10, p. 1200, doi. 10.1007/s11664-004-0123-9

By:

Chi-Won Hwang;
Suganuma, Katsuaki;
Kiso, Masayuki;
Hashimoto, Shigeo

Publication type:

Article

Reliability Investigation and Interfacial Reaction of Ball-Grid-Array Packages Using the Lead-Free Sn-Cu Solder.

Published in:

Journal of Electronic Materials, 2004, v. 33, n. 10, p. 1190, doi. 10.1007/s11664-004-0122-x

By:

Jeong-Won Yoon;
Sang-Won Kim;
Ja-Myeong Koo;
Dae-Gon Kim;
Seung-Boo Jung

Publication type:

Article

Interfacial Reactions and Shear Strengths between Sn-Ag--based Pb-Free Solder Balls and Au/EN/Cu Metallization.

Published in:

Journal of Electronic Materials, 2004, v. 33, n. 10, p. 1182, doi. 10.1007/s11664-004-0121-y

By:

Sang-Won Kim;
Jeong-Won Yoon;
Seung-Boo Jung

Publication type:

Article

Crystallization and Failure Behavior of Ta-Ni Nanostructured/Amorphous Diffusion Barriers for Copper Metallization.

Published in:

Journal of Electronic Materials, 2004, v. 33, n. 10, p. 1176, doi. 10.1007/s11664-004-0120-z

By:

Fang, J. S.;
Hsu, T. P.;
Chen, G. S.

Publication type:

Article

Semiconductor-to-Metallic Phase Transition of VO2 by Laser Excitation.

Published in:

Journal of Electronic Materials, 2004, v. 33, n. 10, p. 1171, doi. 10.1007/s11664-004-0119-5

By:

Liu, H.;
Vasquez, O.;
Santiago, V. R.;
Diaz, L.;
Fernandez, F. E.

Publication type:

Article

Phase Field Simulations of Intermetallic Compound Growth during Soldering Reactions.

Published in:

Journal of Electronic Materials, 2004, v. 33, n. 10, p. 1161, doi. 10.1007/s11664-004-0118-6

By:

Huh, J. Y.;
Hong, K. K.;
Kim, Y. B.;
Kim, K. T.

Publication type:

Article

Effect of Partial La Filling on High-Temperature Thermoelectric Properties of IrSb3-Based Skutterudite Compounds.

Published in:

Journal of Electronic Materials, 2004, v. 33, n. 10, p. 1156, doi. 10.1007/s11664-004-0117-7

By:

Kim, S. W.;
Kimura, Y.;
Mishima, Y.

Publication type:

Article

Under Bump Metallurgy Study on Copper/Low-k Dielectrics for Fine Pitch Flip Chip Packaging.

Published in:

Journal of Electronic Materials, 2004, v. 33, n. 10, p. 1144, doi. 10.1007/s11664-004-0116-8

By:

Seung Wook Yoon;
Kripesh, Vaidyanathan;
Su Yong Ji, Jeffery;
Iyer, Mahadevan K.

Publication type:

Article

Effect of Intermetallic Compound Formation on Electrical Properties of Cu/Sn Interface during Thermal Treatment.

Published in:

Journal of Electronic Materials, 2004, v. 33, n. 10, p. 1137, doi. 10.1007/s11664-004-0115-9

By:

Liao, C. N.;
Wei, C. T.

Publication type:

Article

Correlation between Interfacial Reactions and Mechanical Strengths of Sn(Cu)/Ni(P) Solder Bumps.

Published in:

Journal of Electronic Materials, 2004, v. 33, n. 10, p. 1130, doi. 10.1007/s11664-004-0114-x

By:

Wang, S. J.;
Kao, H. J.;
Liu, C. Y.

Publication type:

Article

Mechanism of Interfacial Reaction for the Sn-Pb Solder Bump with Ni/Cu Under-Bump Metallization in Flip-Chip Technology.

Published in:

Journal of Electronic Materials, 2004, v. 33, n. 10, p. 1118, doi. 10.1007/s11664-004-0113-y

By:

Guh-Yaw Jang;
Chien-Sheng Huang;
Li-Yin Hsiao;
Jenq-Gong Duh;
Takahashi, Hideyuki

Publication type:

Article

Bromine- and Chlorine-Induced Degradation of Gold-Aluminum Bonds.

Published in:

Journal of Electronic Materials, 2004, v. 33, n. 10, p. 1111, doi. 10.1007/s11664-004-0112-z

By:

Min-Hsien Lue;
Chen-Town Huang;
Sheng-Tzung Huang;
Ker-Chang Hsieh

Publication type:

Article

The Nanoindentation Characteristics of Cu6Sn5, Cu3Sn, and Ni3Sn4 Intermetallic Compounds in the Solder Bump.

Published in:

Journal of Electronic Materials, 2004, v. 33, n. 10, p. 1103, doi. 10.1007/s11664-004-0111-0

By:

Guh-Yaw Jang;
Jyh-Wei Lee;
Jenq-Gong Duh

Publication type:

Article

Microstructure and Thermal Expansion Properties of Invar-Type Cu-Zn-Al Shape Memory Alloys.

Published in:

Journal of Electronic Materials, 2004, v. 33, n. 10, p. 1098, doi. 10.1007/s11664-004-0110-1

By:

Wang, J. J.;
Omori, T.;
Sutou, Y.;
Kainuma, R.;
Ishida, K.

Publication type:

Article

Effects of the Gold Thickness of the Surface Finish on the Interfacial Reactions in Flip-Chip Solder Joints.

Published in:

Journal of Electronic Materials, 2004, v. 33, n. 10, p. 1092, doi. 10.1007/s11664-004-0109-7

By:

Lin, Y. L.;
Luo, W. C.;
Lin, Y. H.;
Ho, C. E.;
Kao, C. R.

Publication type:

Article

Interfacial Reaction between Multicomponent Lead-Free Solders and Ag, Cu, Ni, and Pd Substrates.

Published in:

Journal of Electronic Materials, 2004, v. 33, n. 10, p. 1080, doi. 10.1007/s11664-004-0108-8

By:

Ghosh, G.

Publication type:

Article

Phase Equilibria of the Sn-Ag-Cu-Ni Quaternary System at the Sn-Rich Corner.

Published in:

Journal of Electronic Materials, 2004, v. 33, n. 10, p. 1071, doi. 10.1007/s11664-004-0107-9

By:

Sinn-Wen Chen;
Cheng-An Chang

Publication type:

Article

Interface Reaction between Ni and Amorphous SiC.

Published in:

Journal of Electronic Materials, 2004, v. 33, n. 10, p. 1064, doi. 10.1007/s11664-004-0106-x

By:

Sungtae Kim;
Perepezko, J. H.;
Dong, Z.;
Edelstein, A. S.

Publication type:

Article

Self-Assembled Au Nanoparticle Superlattice via a Displacement Reaction.

Published in:

Journal of Electronic Materials, 2004, v. 33, n. 10, p. 1058, doi. 10.1007/s11664-004-0105-y

By:

Hu, J. C.;
Su, P. Y.;
Lapeyronie, V.;
Cheng, S. L.;
Lin, M. Y.;
Chen, L. J.

Publication type:

Article

Foreword.

Published in:

Journal of Electronic Materials, 2004, v. 33, n. 10, p. 1057, doi. 10.1007/s11664-004-0104-z

By:

Kao, C. R.;
Chen, S.-W.;
Lee, H. M.;
Mohney, S. E.;
Notis, M. R.;
Swenson, D. J.

Publication type:

Article

Works matching IS 03615235 AND DT 2004 AND VI 33 AND IP 10

Effects of Excess Bi Concentration, Buffered Bi<sub>2</sub>O<sub>3</sub> Layer, and Ta Doping on the Orientation and Ferroelectricity of Chemical-Solution-Deposited Bi<sub>3.25</sub>La<sub>0.75</sub>Ti<sub>3</sub>O<sub>12</sub> Films.

Capacitance-Voltage Characterization of Pulsed Plasma Polymerized Allylamine Dielectrics for Flexible Polymeric Field Effect Transistors.

Dielectric Properties of Low Loss Ba<sub>6-3x</sub>Nd<sub>8+2x</sub>Ti<sub>18</sub>O<sub>54</sub> Thin Films Prepared by Pulsed Laser Deposition for Microwave Applications.

The Effect of Microstructural and Geometrical Features on the Reliability of Ultrafine Flip Chip Microsolder Joints.

Intermetallic Growth Studies on Sn-Ag-Cu Lead-Free Solder Joints.

Effects of Pd Addition on Au Stud Bumps/Al Pads Interfacial Reactions and Bond Reliability.

Influence of Cu Addition to Interface Microstructure between Sn-Ag Solder and Au/Ni-6P Plating.

Reliability Investigation and Interfacial Reaction of Ball-Grid-Array Packages Using the Lead-Free Sn-Cu Solder.

Interfacial Reactions and Shear Strengths between Sn-Ag--based Pb-Free Solder Balls and Au/EN/Cu Metallization.

Crystallization and Failure Behavior of Ta-Ni Nanostructured/Amorphous Diffusion Barriers for Copper Metallization.

Semiconductor-to-Metallic Phase Transition of VO<sub>2</sub> by Laser Excitation.

Phase Field Simulations of Intermetallic Compound Growth during Soldering Reactions.

Effect of Partial La Filling on High-Temperature Thermoelectric Properties of IrSb<sub>3</sub>-Based Skutterudite Compounds.

Under Bump Metallurgy Study on Copper/Low-k Dielectrics for Fine Pitch Flip Chip Packaging.

Effect of Intermetallic Compound Formation on Electrical Properties of Cu/Sn Interface during Thermal Treatment.

Correlation between Interfacial Reactions and Mechanical Strengths of Sn(Cu)/Ni(P) Solder Bumps.

Mechanism of Interfacial Reaction for the Sn-Pb Solder Bump with Ni/Cu Under-Bump Metallization in Flip-Chip Technology.

Bromine- and Chlorine-Induced Degradation of Gold-Aluminum Bonds.

The Nanoindentation Characteristics of Cu<sub>6</sub>Sn<sub>5</sub>, Cu<sub>3</sub>Sn, and Ni<sub>3</sub>Sn<sub>4</sub> Intermetallic Compounds in the Solder Bump.

Microstructure and Thermal Expansion Properties of Invar-Type Cu-Zn-Al Shape Memory Alloys.

Effects of the Gold Thickness of the Surface Finish on the Interfacial Reactions in Flip-Chip Solder Joints.

Interfacial Reaction between Multicomponent Lead-Free Solders and Ag, Cu, Ni, and Pd Substrates.

Phase Equilibria of the Sn-Ag-Cu-Ni Quaternary System at the Sn-Rich Corner.

Interface Reaction between Ni and Amorphous SiC.

Self-Assembled Au Nanoparticle Superlattice via a Displacement Reaction.

Foreword.