TaN-TiN Binary Alloys and Superlattices as Diffusion Barriers for Copper Interconnections.
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- 2004
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- Publication type:
- Correction Notice
Works matching IS 03615235 AND DT 2004 AND VI 33 AND IP 1
Results: 15
1
2
Indium- and Tungsten-Doped ZnGa<sub>2</sub>O<sub>4</sub> Phosphor.
- Published in:
- Journal of Electronic Materials, 2004, v. 33, n. 1, p. L1, doi. 10.1007/s11664-004-0299-z
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- Publication type:
- Article
3
Thermal Effects in Thin Copper Foil.
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- Journal of Electronic Materials, 2004, v. 33, n. 1, p. 83, doi. 10.1007/s11664-004-0298-0
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- Publication type:
- Article
4
Highly Reliable Flip-Chip-on-Flex Package Using Multilayered Anisotropic Conductive Film.
- Published in:
- Journal of Electronic Materials, 2004, v. 33, n. 1, p. 76, doi. 10.1007/s11664-004-0297-1
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- Publication type:
- Article
5
Microstructure and Strength of Bump Joints in Photodiode Packages.
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- Journal of Electronic Materials, 2004, v. 33, n. 1, p. 70, doi. 10.1007/s11664-004-0296-2
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- Publication type:
- Article
6
The Microstructure Characterization of Ultrasmall Eutectic Bi-Sn Solder Bumps on Au/Cu/Ti and Au/Ni/Ti Under-Bump Metallization.
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- Journal of Electronic Materials, 2004, v. 33, n. 1, p. 61, doi. 10.1007/s11664-004-0295-3
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- Publication type:
- Article
7
Effect of Process Conditions on Uniformity of Velocity and Wear Distance of Pad and Wafer during Chemical Mechanical Planarization.
- Published in:
- Journal of Electronic Materials, 2004, v. 33, n. 1, p. 53, doi. 10.1007/s11664-004-0294-4
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- Publication type:
- Article
8
Relationship between Grain Structures and Texture of Damascene Cu Lines.
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- Journal of Electronic Materials, 2004, v. 33, n. 1, p. 48, doi. 10.1007/s11664-004-0293-5
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- Publication type:
- Article
9
Fiber-Alignment Shifts in Butterfly Laser Packaging by Laser-Welding Technique Measurement and Finite-Element Method Analysis.
- Published in:
- Journal of Electronic Materials, 2004, v. 33, n. 1, p. 40, doi. 10.1007/s11664-004-0292-6
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- Publication type:
- Article
10
Reflow and Burn-in of a Sn-20ln-0.8Cu Ball Grid Array Package with a Au/Ni/Cu Pad.
- Published in:
- Journal of Electronic Materials, 2004, v. 33, n. 1, p. 34, doi. 10.1007/s11664-004-0291-7
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- Publication type:
- Article
11
Kinetics of the Au-Ni-Sn Ternary Intermetallic Layer Redeposition at the Solder/Under-Bump Metallurgy Interface during Aging Treatment.
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- Journal of Electronic Materials, 2004, v. 33, n. 1, p. 28, doi. 10.1007/s11664-004-0290-8
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- Publication type:
- Article
12
Mechanisms for Interfacial Reactions between Liquid Sn-3.5Ag Solders and Cu Substrates.
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- Journal of Electronic Materials, 2004, v. 33, n. 1, p. 22, doi. 10.1007/s11664-004-0289-1
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- Publication type:
- Article
13
A Continuous Contact Resistance Monitoring during the Temperature Ramp of Anisotropic Conductive Adhesive Film Joint.
- Published in:
- Journal of Electronic Materials, 2004, v. 33, n. 1, p. 14, doi. 10.1007/s11664-004-0288-2
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- Publication type:
- Article
14
The Interfacial Reaction between Sn-Zn-Ag-Ga-Al Solders and Metallized Cu Substrates.
- Published in:
- Journal of Electronic Materials, 2004, v. 33, n. 1, p. 7, doi. 10.1007/s11664-004-0287-3
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- Publication type:
- Article
15
Mechanical Strength of Sn-3.5Ag-Based Solders and Related Bondings.
- Published in:
- Journal of Electronic Materials, 2004, v. 33, n. 1, p. 1, doi. 10.1007/s11664-004-0286-4
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- Publication type:
- Article