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Review of Capabilities of the ENEPIG Surface Finish.
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- Journal of Electronic Materials, 2014, v. 43, n. 11, p. 3885, doi. 10.1007/s11664-014-3322-z
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- Article
Fabrication of Relaxer-Based Piezoelectric Energy Harvesters Using a Sacrificial Poly-Si Seeding Layer.
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- Journal of Electronic Materials, 2014, v. 43, n. 11, p. 3898, doi. 10.1007/s11664-014-3308-x
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- Article
Achieving Both High d and High Q for the Pb(ZrSnTi)FeO Ternary System for Use in High-Power Ultrasonic Transducers.
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- Journal of Electronic Materials, 2014, v. 43, n. 11, p. 3905, doi. 10.1007/s11664-014-3311-2
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A Branched Beam-Based Vibration Energy Harvester.
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- Journal of Electronic Materials, 2014, v. 43, n. 11, p. 3912, doi. 10.1007/s11664-014-3398-5
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- Article
Sensor Performance of Nanostructured TiO-CrO Thin Films Derived by a Particulate Sol-Gel Route with Various Cr:Ti Molar Ratios.
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- Journal of Electronic Materials, 2014, v. 43, n. 11, p. 3922, doi. 10.1007/s11664-014-3301-4
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Study of Shallow Backside Junctions for Backside Illumination of CMOS Image Sensors.
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- Journal of Electronic Materials, 2014, v. 43, n. 11, p. 3933, doi. 10.1007/s11664-014-3336-6
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- Article
Preparation, Infrared Emissivity, and Dielectric and Microwave Absorption Properties of Fe-Doped ZnO Powder.
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- Journal of Electronic Materials, 2014, v. 43, n. 11, p. 3942, doi. 10.1007/s11664-014-3218-y
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Design of Polarization- and Incident Angle-Independent Perfect Metamaterial Absorber with Interference Theory.
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- Journal of Electronic Materials, 2014, v. 43, n. 11, p. 3949, doi. 10.1007/s11664-014-3316-x
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Effect of Excess Li Content on the Microwave Dielectric Properties of the M-Phase of LiO-NbO-TiO Ceramics.
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- Journal of Electronic Materials, 2014, v. 43, n. 11, p. 3954, doi. 10.1007/s11664-014-3317-9
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Effects of TaO/YO Codoping on the Microstructure and Microwave Dielectric Properties of Ba(CoZn)NbO Ceramics.
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- Journal of Electronic Materials, 2014, v. 43, n. 11, p. 3959, doi. 10.1007/s11664-014-3347-3
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- Article
Nanoscale Investigation of Grain Growth in RF-Sputtered Indium Tin Oxide Thin Films by Scanning Probe Microscopy.
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- Journal of Electronic Materials, 2014, v. 43, n. 11, p. 3965, doi. 10.1007/s11664-014-3212-4
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- Article
Effects of Rapid Thermal Annealing on Electrical Transport in Heavily Doped ZnO Thin Films Deposited at Different Substrate Temperatures.
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- Journal of Electronic Materials, 2014, v. 43, n. 11, p. 3973, doi. 10.1007/s11664-014-3254-7
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- Article
Characterization of CdS Nanowires Self-Assembled in a Nanoporous Alumina Template.
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- Journal of Electronic Materials, 2014, v. 43, n. 11, p. 3979, doi. 10.1007/s11664-014-3305-0
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Photoassisted Chemically Deposited Tin Sulfide Thin Films Based on Two Different Chemical Formulations.
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- Journal of Electronic Materials, 2014, v. 43, n. 11, p. 3984, doi. 10.1007/s11664-014-3325-9
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- Article
Impact of Tellurium Precipitates in CdZnTe Substrates on MBE HgCdTe Deposition.
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- Journal of Electronic Materials, 2014, v. 43, n. 11, p. 3993, doi. 10.1007/s11664-014-3338-4
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Hall Effect Studies of AlGaAs Grown by Liquid-Phase Epitaxy for Tandem Solar Cell Applications.
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- Journal of Electronic Materials, 2014, v. 43, n. 11, p. 3999, doi. 10.1007/s11664-014-3340-x
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- Article
Development of Polyaniline Using Electrochemical Technique for Plugging Pinholes in Cadmium Sulfide/Cadmium Telluride Solar Cells.
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- Journal of Electronic Materials, 2014, v. 43, n. 11, p. 4003, doi. 10.1007/s11664-014-3361-5
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- Article
Effects of Substrate Temperature on the Microstructure and Morphology of CdZnTe Thin Films.
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- Journal of Electronic Materials, 2014, v. 43, n. 11, p. 4011, doi. 10.1007/s11664-014-3371-3
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- Article
Synthesis and Characterization of the 25GaS-(75 − x) GeS- xCsCl System for Engineering a Chemically Stable, Mid-IR Transparent Glass.
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- Journal of Electronic Materials, 2014, v. 43, n. 11, p. 4018, doi. 10.1007/s11664-014-3329-5
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Density, Electrical and Optical Properties of Yttrium-Containing Tellurium Bismuth Borate Glasses.
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- Journal of Electronic Materials, 2014, v. 43, n. 11, p. 4023, doi. 10.1007/s11664-014-3331-y
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- Article
Effect of Sprayed Solution Flow Rate on the Physical Properties of Anatase TiO Thin Films.
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- Journal of Electronic Materials, 2014, v. 43, n. 11, p. 4033, doi. 10.1007/s11664-014-3341-9
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Electron Paramagnetic Resonance and Photoluminescence Studies of LaMgAlO:Mn Green Phosphors.
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- Journal of Electronic Materials, 2014, v. 43, n. 11, p. 4041, doi. 10.1007/s11664-014-3351-7
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Synthesis and Thermoelectric Properties of Yb-doped CaYbLaMnO Ceramics.
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- Journal of Electronic Materials, 2014, v. 43, n. 11, p. 4048, doi. 10.1007/s11664-014-3326-8
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- Article
Properties of p- and n-Type PbTe Microwires for Thermoelectric Devices.
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- Journal of Electronic Materials, 2014, v. 43, n. 11, p. 4056, doi. 10.1007/s11664-014-3327-7
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Interfacial Reaction Between Nb Foil and n-Type PbTe Thermoelectric Materials During Thermoelectric Contact Fabrication.
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- Journal of Electronic Materials, 2014, v. 43, n. 11, p. 4064, doi. 10.1007/s11664-014-3350-8
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Design, Modeling, Fabrication, and Evaluation of Thermoelectric Generators with Hot-Wire Chemical Vapor Deposited Polysilicon as Thermoelement Material.
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- Journal of Electronic Materials, 2014, v. 43, n. 11, p. 4070, doi. 10.1007/s11664-014-3352-6
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- Article
Thermodynamic Re-modeling of the Sb-Te System Using Associate and Ionic Models.
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- Journal of Electronic Materials, 2014, v. 43, n. 11, p. 4082, doi. 10.1007/s11664-014-3299-7
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- Article
The Reliability of Microalloyed Sn-Ag-Cu Solder Interconnections Under Cyclic Thermal and Mechanical Shock Loading.
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- Journal of Electronic Materials, 2014, v. 43, n. 11, p. 4090, doi. 10.1007/s11664-014-3298-8
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Interface Reaction Between Electroless Ni-Sn-P Metallization and Lead-Free Sn-3.5Ag Solder with Suppressed NiP Formation.
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- Journal of Electronic Materials, 2014, v. 43, n. 11, p. 4103, doi. 10.1007/s11664-014-3306-z
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- Article
Phase Equilibria of the Sn-Ni-V System at 800°C.
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- Journal of Electronic Materials, 2014, v. 43, n. 11, p. 4111, doi. 10.1007/s11664-014-3307-y
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- Article
IMC Growth at the Interface of Sn-2.0Ag-2.5Zn Solder Joints with Cu, Ni, and Ni-W Substrates.
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- Journal of Electronic Materials, 2014, v. 43, n. 11, p. 4119, doi. 10.1007/s11664-014-3313-0
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Effect of Isothermal Aging on the Long-Term Reliability of Fine-Pitch Sn-Ag-Cu and Sn-Ag Solder Interconnects With and Without Board-Side Ni Surface Finish.
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- Journal of Electronic Materials, 2014, v. 43, n. 11, p. 4126, doi. 10.1007/s11664-014-3315-y
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Investigation of the Growth of Intermetallic Compounds Between Cu Pillars and Solder Caps.
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- Journal of Electronic Materials, 2014, v. 43, n. 11, p. 4134, doi. 10.1007/s11664-014-3318-8
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Mechanical Deformation Behavior of Sn-Ag-Cu Solders with Minor Addition of 0.05 wt.% Ni.
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- Journal of Electronic Materials, 2014, v. 43, n. 11, p. 4146, doi. 10.1007/s11664-014-3323-y
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Effects of In and Ni Addition on Microstructure of Sn-58Bi Solder Joint.
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- Journal of Electronic Materials, 2014, v. 43, n. 11, p. 4158, doi. 10.1007/s11664-014-3359-z
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- Article
Mechanical Properties of Lead-Free Solder Joints Under High-Speed Shear Impact Loading.
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- Journal of Electronic Materials, 2014, v. 43, n. 11, p. 4171, doi. 10.1007/s11664-014-3394-9
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Electromigration Behaviors and Effects of Addition Elements on the Formation of a Bi-rich Layer in Sn58Bi-Based Solders.
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- Journal of Electronic Materials, 2014, v. 43, n. 11, p. 4179, doi. 10.1007/s11664-014-3400-2
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- Article
Abrasive-Free Chemical Mechanical Polishing of Hard Disk Substrate with Cumene Hydroperoxide-HO Slurry.
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- Journal of Electronic Materials, 2014, v. 43, n. 11, p. 4186, doi. 10.1007/s11664-014-3303-2
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Impact of Ni Concentration on the Performance of Ni Silicide/HfO/TiN Resistive RAM (RRAM) Cells.
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- Journal of Electronic Materials, 2014, v. 43, n. 11, p. 4193, doi. 10.1007/s11664-014-3309-9
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Elemental Compositions of Over 80 Cell Phones.
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- Journal of Electronic Materials, 2014, v. 43, n. 11, p. 4199, doi. 10.1007/s11664-014-3310-3
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Analysis of 3D TSV Vertical Interconnection Using Pre-applied Nonconductive Films.
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- Journal of Electronic Materials, 2014, v. 43, n. 11, p. 4214, doi. 10.1007/s11664-014-3319-7
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Carbon-Incorporated Amorphous Indium Zinc Oxide Thin-Film Transistors.
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- Journal of Electronic Materials, 2014, v. 43, n. 11, p. 4224, doi. 10.1007/s11664-014-3333-9
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- Article
An RDL UBM Structural Design for Solving Ultralow- K Delamination Problem of Cu Pillar Bump Flip Chip BGA Packaging.
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- Journal of Electronic Materials, 2014, v. 43, n. 11, p. 4229, doi. 10.1007/s11664-014-3332-x
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- Article
Zinc Oxide Thin-Film Transistors Fabricated at Low Temperature by Chemical Spray Pyrolysis.
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- Journal of Electronic Materials, 2014, v. 43, n. 11, p. 4241, doi. 10.1007/s11664-014-3342-8
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Curing Behaviors of UV-Curable Temporary Adhesives for a 3D Multichip Package Process.
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- Journal of Electronic Materials, 2014, v. 43, n. 11, p. 4246, doi. 10.1007/s11664-014-3354-4
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Electromigration Induced Break-up Phenomena in Liquid Metal Printed Thin Films.
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- Journal of Electronic Materials, 2014, v. 43, n. 11, p. 4255, doi. 10.1007/s11664-014-3366-0
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Inhibition of Gold Embrittlement in Micro-joints for Three-Dimensional Integrated Circuits.
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- Journal of Electronic Materials, 2014, v. 43, n. 11, p. 4262, doi. 10.1007/s11664-014-3360-6
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- Article
Statistical Parameters Effects on Photocatalytic Degradation of Rhodamine 6G Dye with Hexagonal Zinc Oxide Nanorods Synthesized via Solution Process.
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- Journal of Electronic Materials, 2014, v. 43, n. 11, p. 4266, doi. 10.1007/s11664-014-3397-6
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Formation of a Metastable Phase at the Interface Between Sn and Ag-Pd Substrates During Liquid-State Reaction.
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- Journal of Electronic Materials, 2014, v. 43, n. 11, p. 4275, doi. 10.1007/s11664-014-3393-x
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Investigating the Exchange-Coupling Interaction in Nanostructure Composite Particles of SrFeO and ZnFeO.
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- Journal of Electronic Materials, 2014, v. 43, n. 11, p. 4282, doi. 10.1007/s11664-014-3363-3
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