Found: 19
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Characterization of Mg-Doped AlInN Annealed in Nitrogen and Oxygen Ambients.
- Published in:
- Journal of Electronic Materials, 2008, v. 37, n. 8, p. 1070, doi. 10.1007/s11664-008-0496-2
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- Article
Effect of Zn Addition on Interfacial Reactions Between Sn-4Ag Solder and Ag Substrates.
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- Journal of Electronic Materials, 2008, v. 37, n. 8, p. 1119, doi. 10.1007/s11664-008-0490-8
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- Article
Cleaved Mirrors for Nitride Semiconductor Lasers.
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- Journal of Electronic Materials, 2008, v. 37, n. 8, p. 1064, doi. 10.1007/s11664-008-0493-5
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- Article
Effect of Ionization Characteristics on Electrochemical Migration Lifetimes of Sn-3.0Ag-0.5Cu Solder in NaCl and Na<sub>2</sub>SO<sub>4</sub> Solutions.
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- Journal of Electronic Materials, 2008, v. 37, n. 8, p. 1111, doi. 10.1007/s11664-008-0491-7
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- Article
Ambient Temperature Ultrasonic Bonding of Si-Dice Using Sn-3.5wt.%Ag.
- Published in:
- 2008
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- Correction Notice
Study on the Effects of Copper Oxide Growth on the Peel Strength of Copper/Polyimide.
- Published in:
- Journal of Electronic Materials, 2008, v. 37, n. 8, p. 1102, doi. 10.1007/s11664-007-0317-z
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- Article
Optical Properties of Nanocrystalline GaN Films Prepared by Annealing Amorphous GaN in Ammonia.
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- Journal of Electronic Materials, 2008, v. 37, n. 8, p. 1049, doi. 10.1007/s11664-008-0492-6
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- Article
MOCVD Growth of InN on Si(111) with Various Buffer Layers.
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- Journal of Electronic Materials, 2008, v. 37, n. 8, p. 1054, doi. 10.1007/s11664-008-0475-7
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- Article
Field-Emission Performance of Wormhole-Like Mesoporous Tungsten Oxide Nanowires.
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- Journal of Electronic Materials, 2008, v. 37, n. 8, p. 1082, doi. 10.1007/s11664-008-0474-8
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- Article
Evaluation of Mn Uniformity in CdMnTe Crystal Grown by the Vertical Bridgman Method.
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- Journal of Electronic Materials, 2008, v. 37, n. 8, p. 1158, doi. 10.1007/s11664-008-0473-9
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- Article
Intermetallics Characterization of Lead-Free Solder Joints under Isothermal Aging.
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- Journal of Electronic Materials, 2008, v. 37, n. 8, p. 1130, doi. 10.1007/s11664-008-0466-8
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- Article
Study of the Au/In Reaction for Transient Liquid-Phase Bonding and 3D Chip Stacking.
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- Journal of Electronic Materials, 2008, v. 37, n. 8, p. 1095, doi. 10.1007/s11664-008-0487-3
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- Article
Combined Use of Magnetic and Electrically Conductive Fillers in a Polymer Matrix for Electromagnetic Interference Shielding.
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- Journal of Electronic Materials, 2008, v. 37, n. 8, p. 1088, doi. 10.1007/s11664-008-0486-4
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- Article
Polarity Analysis of Self-Seeded Aluminum Nitride Crystals Grown by Sublimation.
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- Journal of Electronic Materials, 2008, v. 37, n. 8, p. 1058, doi. 10.1007/s11664-008-0485-5
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- Article
Electrical Characteristics and Photoresponse of ZnO/ZnTe Heterojunction Diodes.
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- Journal of Electronic Materials, 2008, v. 37, n. 8, p. 1044, doi. 10.1007/s11664-008-0484-6
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- Article
Growth of GaN Nanowires on Epitaxial GaN.
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- Journal of Electronic Materials, 2008, v. 37, n. 8, p. 1076, doi. 10.1007/s11664-008-0483-7
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- Article
Characterization of Self-Formed Ti-Rich Interface Layers in Cu(Ti)/Low-k Samples.
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- Journal of Electronic Materials, 2008, v. 37, n. 8, p. 1148, doi. 10.1007/s11664-008-0482-8
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- Article
Three-Dimensional Finite Element Analysis of Multiple-Grained Lead-Free Solder Interconnects.
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- Journal of Electronic Materials, 2008, v. 37, n. 8, p. 1139, doi. 10.1007/s11664-008-0481-9
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- Article
Overshoot Graded Layers for Mismatched Heteroepitaxial Devices.
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- Journal of Electronic Materials, 2008, v. 37, n. 8, p. 1035, doi. 10.1007/s11664-008-0476-6
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- Article