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Intermetallic Reactions in Reflowed and Aged Sn-9Zn Solder Ball Grid Array Packages with Au/Ni/Cu and Ag/Cu Pads.
- Published in:
- Journal of Electronic Materials, 2006, v. 35, n. 1, p. 154, doi. 10.1007/s11664-006-0198-6
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- Publication type:
- Article
Intermetallic Compounds Formed during the Interfacial Reactions between Liquid In-49Sn Solder and Ni Substrates.
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- Journal of Electronic Materials, 2006, v. 35, n. 1, p. 165, doi. 10.1007/s11664-006-0199-5
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- Publication type:
- Article
Correction to.
- Published in:
- 2006
- Publication type:
- Correction notice
Investigation of Microstructural Processes during Ultrasonic Wedge/Wedge Bonding of AlSi1 Wires.
- Published in:
- Journal of Electronic Materials, 2006, v. 35, n. 1, p. 173, doi. 10.1007/s11664-006-0201-2
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- Article
Ultrathin CdSe Nanowire Field-Effect Transistors.
- Published in:
- Journal of Electronic Materials, 2006, v. 35, n. 1, p. 170, doi. 10.1007/s11664-006-0200-3
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- Article
A Simple Constitutive Model for Ratcheting Evolution of 63Sn-37Pb Solder under Multiaxial Loading.
- Published in:
- 2006
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- Publication type:
- Letter
Morphology and Growth Kinetics of Intermetallic Compounds in Solid-State Interfacial Reaction of Electroless Ni-P with Sn-Based Lead-Free Solders.
- Published in:
- Journal of Electronic Materials, 2006, v. 35, n. 1, p. 181, doi. 10.1007/s11664-006-0202-1
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- Publication type:
- Article
Intermetallic Reactions in Sn-8Zn-20In Solder Ball Grid Array Packages with Au/Ni/Cu and Ag/Cu Pads.
- Published in:
- Journal of Electronic Materials, 2006, v. 35, n. 1, p. 147, doi. 10.1007/s11664-006-0197-7
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- Publication type:
- Article
The Electrical Behavior of Nitro Oligo(Phenylene Ethynylene)'s in Pure and Mixed Monolayers.
- Published in:
- Journal of Electronic Materials, 2006, v. 35, n. 1, p. 140, doi. 10.1007/s11664-006-0196-8
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- Publication type:
- Article
A Quantitative Evaluation of Time-Independent and Time-Dependent Deformations of Lead-Free and Lead-Containing Solder Alloys.
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- Journal of Electronic Materials, 2006, v. 35, n. 1, p. 132, doi. 10.1007/s11664-006-0195-9
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- Publication type:
- Article
Microwave Preheating of Anisotropic Conductive Adhesive Films for High-Speed Flip Chip on Flex Bonding.
- Published in:
- Journal of Electronic Materials, 2006, v. 35, n. 1, p. 123, doi. 10.1007/s11664-006-0194-x
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- Publication type:
- Article
Improving the Electrical and Mechanical Behavior of Electrically Conductive Paint by Partial Replacement of Silver by Carbon Black.
- Published in:
- Journal of Electronic Materials, 2006, v. 35, n. 1, p. 118, doi. 10.1007/s11664-006-0193-y
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- Publication type:
- Article
The Effects of Hydrogen on Aluminum-Induced Crystallization of Sputtered Hydrogenated Amorphous Silicon.
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- Journal of Electronic Materials, 2006, v. 35, n. 1, p. 113, doi. 10.1007/s11664-006-0192-z
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- Publication type:
- Article
Effect of KOH Treatment on the Schottky Barrier Height and Reverse Leakage Current in Pt/n-GaN.
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- Journal of Electronic Materials, 2006, v. 35, n. 1, p. 107, doi. 10.1007/s11664-006-0191-0
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- Publication type:
- Article
Suppression of Void Coalescence in Thermal Aging of Tin-Silver-Copper-X Solder Joints.
- Published in:
- Journal of Electronic Materials, 2006, v. 35, n. 1, p. 94, doi. 10.1007/s11664-006-0190-1
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- Publication type:
- Article
Microstructure, Solderability, and Growth of Intermetallic Compounds of Sn-Ag-Cu-RE Lead-Free Solder Alloys.
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- Journal of Electronic Materials, 2006, v. 35, n. 1, p. 89, doi. 10.1007/s11664-006-0189-7
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- Publication type:
- Article
Characterizing Metallurgical Reaction of Sn3.0Ag0.5Cu Composite Solder by Mechanical Alloying with Electroless Ni-P/Cu Under-Bump Metallization after Various Reflow Cycles.
- Published in:
- Journal of Electronic Materials, 2006, v. 35, n. 1, p. 81, doi. 10.1007/s11664-006-0188-8
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- Publication type:
- Article
Effects of Bi and Pb on Oxidation in Humidity for Low-Temperature Lead-Free Solder Systems.
- Published in:
- Journal of Electronic Materials, 2006, v. 35, n. 1, p. 41, doi. 10.1007/s11664-006-0182-1
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- Publication type:
- Article
Interfacial Reactions in the Pb-Free Composite Solders with Indium Layers.
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- Journal of Electronic Materials, 2006, v. 35, n. 1, p. 72, doi. 10.1007/s11664-006-0186-x
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- Publication type:
- Article
Microstructure Evolution of Gold-Tin Eutectic Solder on Cu and Ni Substrates.
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- Journal of Electronic Materials, 2006, v. 35, n. 1, p. 65, doi. 10.1007/s11664-006-0185-y
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- Publication type:
- Article
Phase Field Simulations of Morphological Evolution and Growth Kinetics of Solder Reaction Products.
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- Journal of Electronic Materials, 2006, v. 35, n. 1, p. 56, doi. 10.1007/s11664-006-0184-z
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- Publication type:
- Article
Solid-State Phase Formation between Pd Thin Films and GaSb.
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- Journal of Electronic Materials, 2006, v. 35, n. 1, p. 48, doi. 10.1007/s11664-006-0183-0
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- Publication type:
- Article
Thermal Performance of Sputtered Insoluble Cu(W) Films for Advanced Barrierless Metallization.
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- Journal of Electronic Materials, 2006, v. 35, n. 1, p. 76, doi. 10.1007/s11664-006-0187-9
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- Publication type:
- Article
Interfacial Reaction between 42Sn-58Bi Solder and Electroless Ni-P/Immersion Au Under Bump Metallurgy during Aging.
- Published in:
- Journal of Electronic Materials, 2006, v. 35, n. 1, p. 35, doi. 10.1007/s11664-006-0181-2
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- Publication type:
- Article
Study of Wetting Reaction between Eutectic AuSn and Au Foil.
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- Journal of Electronic Materials, 2006, v. 35, n. 1, p. 28, doi. 10.1007/s11664-006-0180-3
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- Publication type:
- Article
Interfacial Reactions and Phase Equilibria in the Al-Cu/Ta Systems.
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- Journal of Electronic Materials, 2006, v. 35, n. 1, p. 22, doi. 10.1007/s11664-006-0179-9
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- Publication type:
- Article
Crystallization and Failure Behavior of Ta-TM (TM = Fe, Co) Nanostructured/Amorphous Diffusion Barriers for Copper Metallization.
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- Journal of Electronic Materials, 2006, v. 35, n. 1, p. 15, doi. 10.1007/s11664-006-0178-x
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- Publication type:
- Article
Wettability of Electroplated Ni-P in Under Bump Metallurgy with Sn-Ag-Cu Solder.
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- Journal of Electronic Materials, 2006, v. 35, n. 1, p. 7, doi. 10.1007/s11664-006-0177-y
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- Publication type:
- Article
Formation of Au Nanoparticles on Si Bicrystals.
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- Journal of Electronic Materials, 2006, v. 35, n. 1, p. 2, doi. 10.1007/s11664-006-0176-z
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- Article
Foreword.
- Published in:
- Journal of Electronic Materials, 2006, v. 35, n. 1, p. 1, doi. 10.1007/s11664-006-0175-0
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- Publication type:
- Article