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AN OVERVIEW OF PLACEMENT AND ROUTING ALGORITHMS FOR MULTI-CHIP MODULES.
- Published in:
- International Journal of High Speed Electronics & Systems, 1995, v. 6, n. 3, p. 419, doi. 10.1142/S0129156495000122
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- Publication type:
- Article
EARLY FEASIBILITY AND COST ASSESSMENT FOR MULTICHIP MODULE TECHNOLOGIES.
- Published in:
- International Journal of High Speed Electronics & Systems, 1995, v. 6, n. 3, p. 441, doi. 10.1142/S0129156495000134
- By:
- Publication type:
- Article
LAYER ASSIGNMENT FOR HIGH-SPEED MCM PACKAGING.
- Published in:
- International Journal of High Speed Electronics & Systems, 1995, v. 6, n. 3, p. 477, doi. 10.1142/S0129156495000158
- By:
- Publication type:
- Article
63-LAYER TCM WIRING WITH THREE-DIMENSIONAL CROSSTALK CONSTRAINTS.
- Published in:
- International Journal of High Speed Electronics & Systems, 1995, v. 6, n. 3, p. 497, doi. 10.1142/S012915649500016X
- By:
- Publication type:
- Article
A NEW LAYOUT DESIGN SYSTEM FOR MULTICHIP MODULES.
- Published in:
- International Journal of High Speed Electronics & Systems, 1995, v. 6, n. 3, p. 509, doi. 10.1142/S0129156495000171
- By:
- Publication type:
- Article
INTRODUCTION.
- Published in:
- International Journal of High Speed Electronics & Systems, 1995, v. 6, n. 3, p. iii, doi. 10.1142/S0129156495000274
- Publication type:
- Article