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EARLY ASSESSMENT OF DESIGN, PACKAGING AND TECHNOLOGY TRADEOFFS.
- Published in:
- International Journal of High Speed Electronics & Systems, 1991, v. 2, n. 4, p. 209, doi. 10.1142/S0129156491000107
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- Publication type:
- Article
THE VAX 9000 MULTICHIP PACKAGING AND ITS EVOLUTION TO FUTURE HIGH END COMPUTER APPLICATIONS.
- Published in:
- International Journal of High Speed Electronics & Systems, 1991, v. 2, n. 4, p. 235, doi. 10.1142/S0129156491000119
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- Publication type:
- Article
SI-ON-SI MCM TECHNOLOGY AND ITS APPLICATIONS.
- Published in:
- International Journal of High Speed Electronics & Systems, 1991, v. 2, n. 4, p. 251, doi. 10.1142/S0129156491000120
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- Publication type:
- Article
DESIGN AUTOMATION FOR MULTICHIP MODULE - ISSUES AND STATUS.
- Published in:
- International Journal of High Speed Electronics & Systems, 1991, v. 2, n. 4, p. 263, doi. 10.1142/S0129156491000132
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- Publication type:
- Article
PERFORMANCE DRIVEN LAYOUT FOR THIN-FILM MULTICHIP MODULES.
- Published in:
- International Journal of High Speed Electronics & Systems, 1991, v. 2, n. 4, p. 287, doi. 10.1142/S0129156491000144
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- Publication type:
- Article
TRANSIENT SIMULATION OF LOSSY COUPLED TRANSMISSION LINES CHARACTERIZED WITH FREQUENCY-DEPENDENT PARAMETERS.
- Published in:
- International Journal of High Speed Electronics & Systems, 1991, v. 2, n. 4, p. 319, doi. 10.1142/S0129156491000156
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- Publication type:
- Article
AUTHOR INDEX Volume 2 (1991).
- Published in:
- International Journal of High Speed Electronics & Systems, 1991, v. 2, n. 4, p. 355, doi. 10.1142/S0129156491000181
- Publication type:
- Article
INTRODUCTION.
- Published in:
- International Journal of High Speed Electronics & Systems, 1991, v. 2, n. 4, p. iii, doi. 10.1142/S012915649100017X
- Publication type:
- Article