Works matching IS 0038111X AND DT 2001 AND VI 44 AND IP 6

Results: 21

We need better communication behind subwavelength mask manufacturing.

Published in:

Solid State Technology, 2001, v. 44, n. 6, p. 216

By:

Weed, J. Tracy

Publication type:

Article

Low-temperature annealing system for 300mm thermal processing.

Published in:

Solid State Technology, 2001, v. 44, n. 6, p. 152

By:

Yoo, Woo Sik;
Yamazaki, Taro;
Uchino, Toshiyuki

Publication type:

Article

Laser etching for flip-chip de-bug and inverse stereolithography for MEMS.

Published in:

Solid State Technology, 2001, v. 44, n. 6, p. 145

By:

Ehrlich, Daniel;
Silverman, Scott;
Aucoin, Richard;
Burns, Michael

Publication type:

Article

Optimizing plasma etch for MEMS devices.

Published in:

Solid State Technology, 2001, v. 44, n. 6, p. 135

By:

Werbaneth, Paul

Publication type:

Article

Modeling the characteristics of gas system dry-down.

Published in:

Solid State Technology, 2001, v. 44, n. 6, p. 125

By:

Dheandhanoo, Seksan;
Yang, James H.;
Wagner, Michael D.

Publication type:

Article

Ccd-controlled in situ interferometry for dry etch process monitoring.

Published in:

Solid State Technology, 2001, v. 44, n. 6, p. 117

By:

John, Wilfred;
Weixelbaum, Leonhard;
Witrich, Harald;
Wurfl, Joachim

Publication type:

Article

post-ash residue removal.

Published in:

Solid State Technology, 2001, v. 44, n. 6, p. 68

By:

Loper, Steve;
Ma, Weiping C.;
Chang, Luke;
Lee, KangHeon;
Peter-Kini, Dyana

Publication type:

Article

Empirical-based modeling for control of CMP removal uniformity.

Published in:

Solid State Technology, 2001, v. 44, n. 6, p. 101

By:

Jensen, Alan;
Renteln, Peter;
Jew, Stephen;
Raeder, Chris;
Cheung, Patrick

Publication type:

Article

New tools and fabs demand 300mm automation optimization.

Published in:

Solid State Technology, 2001, v. 44, n. 6, p. 87

By:

Bonora, Tony;
Feindel, David

Publication type:

Article

Japanese companies design multifunction minifab tools.

Published in:

Solid State Technology, 2001, v. 44, n. 6, p. 83

By:

Okumura, Katsuya;
Mikata, Yu-ichi;
Suguro, Kyoichi;
Tsunashima, Yoshitaka;
Shimazaki, Ayako

Publication type:

Article

Defect reduction and improved gettering in CZ single-crystal silicon.

Published in:

Solid State Technology, 2001, v. 44, n. 6, p. 109

By:

Furuya, Hisashi;
Harada, Kazuhiro;
Park, Jea-Gun

Publication type:

Article

Conventional beamline implantation of decaborane.

Published in:

Solid State Technology, 2001, v. 44, n. 6, p. 77

By:

Vella, Michael C.

Publication type:

Article

France in the downturn: diversity in the face of adversity.

Published in:

Solid State Technology, 2001, v. 44, n. 6, p. 56

By:

Tyrka, Katherine

Publication type:

Article

Epitaxial wafer market.

Published in:

Solid State Technology, 2001, v. 44, n. 6, p. 60

By:

Royalty, Robert

Publication type:

Article

NEC reorganizes DRAM, LCD production.

Published in:: Solid State Technology, 2001, v. 44, n. 6, p. 52
Publication type:: Article

Japanese firms band together for green standards.

Published in:: Solid State Technology, 2001, v. 44, n. 6, p. 50
Publication type:: Article

SOI market with yet another technology.

Published in:: Solid State Technology, 2001, v. 44, n. 6, p. 50
Publication type:: Article

MRS Spring Meeting: More science, less art.

Published in:: Solid State Technology, 2001, v. 44, n. 6, p. 42
Publication type:: Article

Floating 3-D display seemingly out of sci-fi.

Published in:: Solid State Technology, 2001, v. 44, n. 6, p. 28
Publication type:: Article

WORLD NEWS.

Published in:: Solid State Technology, 2001, v. 44, n. 6, p. 18
Publication type:: Article

Adapting to the economics of SOC.

Published in:

Solid State Technology, 2001, v. 44, n. 6, p. 14

By:

Haavind, Robert

Publication type:

Article