World center for embedded systems.
- Published in:
- Solid State Technology, 2001, v. 44, n. 10, p. S30
- Publication type:
- Article
Works matching IS 0038111X AND DT 2001 AND VI 44 AND IP 10
Results: 36
1
2
A relative newcomer, but statistics put New Mexico 10th in chipmaking.
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- Solid State Technology, 2001, v. 44, n. 10, p. S34
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- Article
3
Not like its neighbors, but Colorado is still 11th in chipmaking.
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- Solid State Technology, 2001, v. 44, n. 10, p. S42
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- Publication type:
- Article
4
From Motorola's historic lab to today: Arizona ranks 3rd in chipmaking.
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- Solid State Technology, 2001, v. 44, n. 10, p. S29
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- Publication type:
- Article
5
Utah's wafer fabs.
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- Solid State Technology, 2001, v. 44, n. 10, p. S26
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- Publication type:
- Article
6
Recent Texas economic outlook.
- Published in:
- Solid State Technology, 2001, v. 44, n. 10, p. S20
- Publication type:
- Article
7
Fabs are good neighbors, too.
- Published in:
- Solid State Technology, 2001, v. 44, n. 10, p. S16
- Publication type:
- Article
8
AMD, the global climate, and Austin, TX.
- Published in:
- Solid State Technology, 2001, v. 44, n. 10, p. S11
- Publication type:
- Article
9
Growing from Kilby's invention to today: Texas is 2nd in chipmaking.
- Published in:
- Solid State Technology, 2001, v. 44, n. 10, p. S11
- By:
- Publication type:
- Article
10
Regional concentration of fabs totals approximately 10% of industry's capacity.
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- Solid State Technology, 2001, v. 44, n. 10, p. S7
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- Publication type:
- Article
11
Stress-free polishing advances copper integration with ultralow-k dielectrics.
- Published in:
- Solid State Technology, 2001, v. 44, n. 10, p. 101
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- Publication type:
- Article
12
Challenge for the new millennium: Managing mask costs.
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- Solid State Technology, 2001, v. 44, n. 10, p. 154
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- Publication type:
- Article
13
Tough competition ahead from new Japanese wafer fabs.
- Published in:
- Solid State Technology, 2001, v. 44, n. 10, p. 36
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- Publication type:
- Article
14
Don't 'go copper' without barrier knowledge.
- Published in:
- Solid State Technology, 2001, v. 44, n. 10, p. 22
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- Publication type:
- Article
15
300mm fabs and the role of bulk specialty gas supply.
- Published in:
- Solid State Technology, 2001, v. 44, n. 10, p. 109
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- Publication type:
- Article
16
APC for plasma etch.
- Published in:
- Solid State Technology, 2001, v. 44, n. 10, p. 71
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- Publication type:
- Article
17
Controlling maintenance on aluminum etch system exhaust.
- Published in:
- Solid State Technology, 2001, v. 44, n. 10, p. 95
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- Publication type:
- Article
18
Devices dictate control of implant-beam incident angle.
- Published in:
- Solid State Technology, 2001, v. 44, n. 10, p. 79
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- Publication type:
- Article
19
Using wet chemistry for etching under-bump metal.
- Published in:
- Solid State Technology, 2001, v. 44, n. 10, p. 89
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- Publication type:
- Article
20
Developments at IMEC.
- Published in:
- Solid State Technology, 2001, v. 44, n. 10, p. 32
- Publication type:
- Article
21
Tech Briefs.
- Published in:
- Solid State Technology, 2001, v. 44, n. 10, p. 26
- Publication type:
- Article
22
Developments in materials for 157nm photoresists.
- Published in:
- Solid State Technology, 2001, v. 44, n. 10, p. 63
- Publication type:
- Article
23
300mm fab automation can meet advanced defect detection needs.
- Published in:
- Solid State Technology, 2001, v. 44, n. 10, p. 54
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- Publication type:
- Article
24
A new paradigm for evaluating IC yield loss.
- Published in:
- Solid State Technology, 2001, v. 44, n. 10, p. 47
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- Publication type:
- Article
25
The race is on: CVD and spin-on vie for the low-k dielectric market.
- Published in:
- Solid State Technology, 2001, v. 44, n. 10, p. 40
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- Publication type:
- Article
26
Overcoming stiction in MEMS.
- Published in:
- Solid State Technology, 2001, v. 44, n. 10, p. 24
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- Publication type:
- Article
27
Brittlestar eyes: Key to future microlenses?
- Published in:
- Solid State Technology, 2001, v. 44, n. 10, p. 28
- Publication type:
- Article
28
Higher-density packaging innovations continue.
- Published in:
- Solid State Technology, 2001, v. 44, n. 10, p. 28
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- Publication type:
- Article
29
OLED displays gain on LCDs.
- Published in:
- Solid State Technology, 2001, v. 44, n. 10, p. 22
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- Publication type:
- Article
30
ASIA PACIFIC.
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- Solid State Technology, 2001, v. 44, n. 10, p. 20
- Publication type:
- Article
31
EUROPE.
- Published in:
- Solid State Technology, 2001, v. 44, n. 10, p. 20
- Publication type:
- Article
32
JAPAN.
- Published in:
- Solid State Technology, 2001, v. 44, n. 10, p. 18
- Publication type:
- Article
33
USA.
- Published in:
- Solid State Technology, 2001, v. 44, n. 10, p. 16
- Publication type:
- Article
34
Semi reports drop in silicon shipments.
- Published in:
- Solid State Technology, 2001, v. 44, n. 10, p. 16
- Publication type:
- Article
35
Chip sales down for July; N.A. tool orders up third month in a row.
- Published in:
- Solid State Technology, 2001, v. 44, n. 10, p. 16
- Publication type:
- Article
36
The coming world of nano- and pico-technology.
- Published in:
- 2001
- By:
- Publication type:
- Editorial