Works matching IS 00218995 AND DT 2002 AND VI 83 AND IP 5


Results: 24
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    Thermal analysis of curing process of epoxy prepreg.

    Published in:
    Journal of Applied Polymer Science, 2002, v. 83, n. 5, p. 1074, doi. 10.1002/app.10053
    By:
    • Sun, Liangfeng;
    • Pang, Su-Seng;
    • Sterling, Arthur M.;
    • Negulescu, Ioan I.;
    • Stubblefield, Michael A.
    Publication type:
    Article
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