Works matching IS 00218995 AND DT 2002 AND VI 83 AND IP 12


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    Advanced underfill for high thermal reliability.

    Published in:
    Journal of Applied Polymer Science, 2002, v. 83, n. 12, p. 2617, doi. 10.1002/app.10224
    By:
    • Bae, Jong-Woo;
    • Kim, Wonho;
    • Park, Sang-Wook;
    • Ha, Chang-Sik;
    • Lee, Jin-Kook
    Publication type:
    Article
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