Works matching IS 00098574 AND DT 2023 AND VI 27 AND IP 3/4
1
- Clay Science, 2023, v. 27, n. 3/4, p. 55, doi. 10.11362/jcssjclayscience.MS-23-4
- SHIRO TAKADA;
- YOJIRO IENAGA;
- AI TAKADA;
- Shin-Ichiro Wada
- Article
2
- Clay Science, 2023, v. 27, n. 3/4, p. 49, doi. 10.11362/jcssjclayscience.MS-23-8
- REIRA KINOSHITA;
- SHIN'ICHI ISHIMARU
- Article
3
- Clay Science, 2023, v. 27, n. 3/4, p. 41, doi. 10.11362/jcssjclayscience.MS-23-1
- TERUHISA HONGO;
- SHUNKI FUKUDA
- Article
4
- Clay Science, 2023, v. 27, n. 3/4, p. 25, doi. 10.11362/jcssjclayscience.MS-23-6
- Article
5
- Clay Science, 2023, v. 27, n. 3/4, p. 33, doi. 10.11362/jcssjclayscience.MS-23-5
- SUMIO AISAWA;
- MASATOSHI TAKAHASHI;
- TOORU ABE;
- CHIKA CHIDA;
- HIDETOSHI HIRAHARA;
- EIICHI NARITA
- Article