Works matching Epoxy compounds

Results: 3769

Effects of Bonding Wires and Epoxy Molding Compound on Gold and Copper Ball Bonds Intermetallic Growth Kinetics in Electronic Packaging.

Published in:

Journal of Electronic Materials, 2014, v. 43, n. 4, p. 1017, doi. 10.1007/s11664-014-3011-y

By:

Gan, C.;
Classe, F.;
Chan, B.;
Hashim, U.

Publication type:

Article

Synthesis of a Novel Ferrocene-Based Epoxy Compound and Its Electrochemical Behavior.

Published in:

Designed Monomers & Polymers, 2008, v. 11, n. 4, p. 347, doi. 10.1163/156855508X332496

By:

Haojie Yu;
Li Wang;
Jia Huo;
Qiaohua Tan;
Jingmin Gao

Publication type:

Article

THE IMPACT OF HYDROGEN PEROXIDE OXIRANE OXYGEN NUMBER CONVERSION IN EPOXY COMPOUNDS DERIVED FROM PURPLE PASSION FRUIT SEEDS (Passiflora edulis var. sims edulis).

Published in:

Rasayan Journal of Chemistry, 2024, v. 17, n. 1, p. 275, doi. 10.31788/RJC.2024.1718733

By:

Sinaga, Mersi Suriani;
Tambun, Rondang;
Ndraha, Eduar Efrodo;
Ramadhan, Aravi Zalsa

Publication type:

Article

Process Optimization of the Morphological Properties of Epoxy Resin Molding Compounds Using Response Surface Design.

Published in:

Polymers (20734360), 2024, v. 16, n. 8, p. 1102, doi. 10.3390/polym16081102

By:

Vogelwaid, Julian;
Bayer, Martin;
Walz, Michael;
Kutuzova, Larysa;
Kandelbauer, Andreas;
Jacob, Timo

Publication type:

Article

Mechanical Properties of Epoxy Compounds Based on Bisphenol a Aged in Aqueous Environments.

Published in:

Polymers (20734360), 2021, v. 13, n. 6, p. 952, doi. 10.3390/polym13060952

By:

Rudawska, Anna;
Pizzi, Antonio

Publication type:

Article

The Impact of the Acidic Environment on the Mechanical Properties of Epoxy Compounds in Different Conditions.

Published in:

Polymers (20734360), 2020, v. 12, n. 12, p. 2957, doi. 10.3390/polym12122957

By:

Rudawska, Anna

Publication type:

Article

The Effect of the Salt Water Aging on the Mechanical Properties of Epoxy Adhesives Compounds.

Published in:

Polymers (20734360), 2020, v. 12, n. 4, p. 843, doi. 10.3390/polym12040843

By:

Rudawska, Anna

Publication type:

Article

The effects of temperature on mechanical properties of neat and montmorillonite reinforced epoxy compounds.

Published in:

Journal of Adhesion, 2025, v. 101, n. 1, p. 265, doi. 10.1080/00218464.2024.2317208

By:

Rudawska, Anna

Publication type:

Article

Comparative analysis of compressive strength of epoxy adhesive compounds containing fillers.

Published in:

Journal of Adhesion, 2025, v. 101, n. 1, p. 331, doi. 10.1080/00218464.2023.2286295

By:

Ogrodniczek, Jacek;
Rudawska, Anna;
Müller, Miroslav

Publication type:

Article

Mechanical Properties of Epoxy Compounds Based on Unmodified Epoxy Resin Modified with Boric Acid as an Antiseptic.

Published in:

Materials (1996-1944), 2024, v. 17, n. 1, p. 259, doi. 10.3390/ma17010259

By:

Rudawska, Anna

Publication type:

Article

Exploring the Influence of Material Properties of Epoxy Molding Compound on Wafer Warpage in Fan-Out Wafer-Level Packaging.

Published in:

Materials (1996-1944), 2023, v. 16, n. 9, p. 3482, doi. 10.3390/ma16093482

By:

Chuang, Wan-Chun;
Huang, Yi;
Chen, Po-En

Publication type:

Article

Experimental Study of Mechanical Properties of Epoxy Compounds Modified with Calcium Carbonate and Carbon after Hygrothermal Exposure.

Published in:

Materials (1996-1944), 2020, v. 13, n. 23, p. 5439, doi. 10.3390/ma13235439

By:

Rudawska, Anna

Publication type:

Article

Plasma polymerization coating of silica fillers for Epoxy Molding Compounds (EMCs).

Published in:

Journal of Adhesion Science & Technology, 2003, v. 17, n. 3, p. 383, doi. 10.1163/156856103762864688

By:

Lee, J. H.;
Roh, J. H.;
Yoon, T. H.

Publication type:

Article

A study on the curing kinetics of epoxy molding compounds with various latent catalysts using differential scanning calorimetry.

Published in:

Journal of Applied Polymer Science, 2017, v. 134, n. 35, p. n/a, doi. 10.1002/app.45252

By:

Lee, Da Eun;
Kim, Hyun Woo;
Kong, Byung‐Seon;
Choi, Hyung Ouk

Publication type:

Article

In-situ characterization of moisture absorption and hygroscopic swelling of an epoxy molding compound for electronic packaging.

Published in:

Journal of Thermal Analysis & Calorimetry, 2022, v. 147, n. 10, p. 5667, doi. 10.1007/s10973-021-10941-w

By:

He, Yi;
Kabiri, Mohammad

Publication type:

Article

Cure Kinetics Modeling of a High Glass Transition Temperature Epoxy Molding Compound (EMC) Based on Inline Dielectric Analysis.

Published in:

Polymers (20734360), 2021, v. 13, n. 11, p. 1734, doi. 10.3390/polym13111734

By:

Franieck, Erick;
Fleischmann, Martin;
Hölck, Ole;
Kutuzova, Larysa;
Kandelbauer, Andreas

Publication type:

Article

The Impact of the Seasoning Conditions on Mechanical Properties of Modified and Unmodified Epoxy Adhesive Compounds.

Published in:

Polymers (20734360), 2019, v. 11, n. 5, p. 804, doi. 10.3390/polym11050804

By:

Rudawska, Anna

Publication type:

Article

Effect of Organosilane Coupling Agents on Thermal, Rheological and Mechanical Properties of Silicate-Filled Epoxy Molding Compound.

Published in:

Materials (1996-1944), 2020, v. 13, n. 1, p. 177, doi. 10.3390/ma13010177

By:

Šinkovec, Rok;
Mušič, Branka

Publication type:

Article

The Effects of Silica-Based Fillers on the Properties of Epoxy Molding Compounds.

Published in:

Materials (1996-1944), 2019, v. 12, n. 11, p. 1811, doi. 10.3390/ma12111811

By:

Linec, Mitja;
Mušič, Branka

Publication type:

Article

Effects of High-Temperature Storage on the Elasticity Modulus of an Epoxy Molding Compound.

Published in:

Materials (1996-1944), 2019, v. 12, n. 4, p. 684, doi. 10.3390/ma12040684

By:

Li, Ruifeng;
Yang, Daoguo;
Zhang, Ping;
Niu, Fanfan;
Cai, Miao;
Zhang, Guoqi

Publication type:

Article

Optimizing Epoxy Molding Compound Processing: A Multi-Sensor Approach to Enhance Material Characterization and Process Reliability.

Published in:

Polymers (20734360), 2024, v. 16, n. 11, p. 1540, doi. 10.3390/polym16111540

By:

Vogelwaid, Julian;
Bayer, Martin;
Walz, Michael;
Hampel, Felix;
Kutuzova, Larysa;
Lorenz, Günter;
Kandelbauer, Andreas;
Jacob, Timo

Publication type:

Article

In Situ Monitoring of the Curing of Highly Filled Epoxy Molding Compounds: The Influence of Reaction Type and Silica Content on Cure Kinetic Models.

Published in:

Polymers (20734360), 2024, v. 16, n. 8, p. 1056, doi. 10.3390/polym16081056

By:

Vogelwaid, Julian;
Hampel, Felix;
Bayer, Martin;
Walz, Michael;
Kutuzova, Larysa;
Lorenz, Günter;
Kandelbauer, Andreas;
Jacob, Timo

Publication type:

Article

Reactions of alicyclic epoxy compounds with oxygen-centered nucleophiles.

Published in:

Russian Journal of Organic Chemistry, 2006, v. 42, n. 3, p. 307, doi. 10.1134/S1070428006030018

By:

Kas'yan, Liliya I.;
Kas'yan, Andrei O.;
Okovityi, Sergei I.

Publication type:

Article

Preparation and Characterization of a Novel Epoxy Molding Compound with Low Storage Modulus at High Temperature and Low Glass-Transition Temperature.

Published in:

Journal of Electronic Materials, 2012, v. 41, n. 9, p. 2599, doi. 10.1007/s11664-012-2105-7

By:

Cui, Hui-wang;
Li, Dong-sheng;
Fan, Qiong

Publication type:

Article

Evolution of epoxy molding compounds and future carbon materials for thermal and mechanical stress management in memory device packaging: a critical review.

Published in:

Journal of Materials Science: Materials in Electronics, 2023, v. 34, n. 30, p. 1, doi. 10.1007/s10854-023-11388-5

By:

Gan, Chong Leong;
Chung, Min-Hua;
Lin, Lu-Fu;
Huang, Chen-Yu;
Takiar, Hem

Publication type:

Article

Characterization of patients with occupational allergy to two new epoxy hardener compounds.

Published in:

Contact Dermatitis (01051873), 2022, v. 87, n. 1, p. 81, doi. 10.1111/cod.14109

By:

Suomela, Sari;
Pesonen, Maria;
Ylinen, Katriina;
Aalto‐Korte, Kristiina;
Suuronen, Katri

Publication type:

Article

Synthesis and polymerization of novel epoxy compounds having an adamantane ring and evaluation of their heat resistance and transparency.

Published in:

Journal of Applied Polymer Science, 2009, v. 112, n. 1, p. 496, doi. 10.1002/app.29320

By:

Maehara, Takayuki;
Takenaka, Junji;
Tanaka, Kenji;
Yamaguchi, Masao;
Yamamoto, Hiromasa;
Ohshita, Joji

Publication type:

Article

Biological Effects and Toxicity of Compounds Based on Cured Epoxy Resins.

Published in:

Polymers (20734360), 2022, v. 14, n. 22, p. 4915, doi. 10.3390/polym14224915

By:

Rudawska, Anna;
Sarna-Boś, Katarzyna;
Rudawska, Adrianna;
Olewnik-Kruszkowska, Ewa;
Frigione, Mariaenrica

Publication type:

Article

Effect of Diluents on Mechanical Characteristics of Epoxy Compounds.

Published in:

Polymers (20734360), 2022, v. 14, n. 11, p. 2277, doi. 10.3390/polym14112277

By:

Rudawska, Anna;
Frigione, Mariaenrica

Publication type:

Article

Calcium Borate Flame Retardation System for Epoxy Molding Compounds.

Published in:

Polymer Engineering & Science, 2006, v. 46, n. 6, p. 799, doi. 10.1002/pen.20424

By:

Ishii, Toshiaki;
Kokaku, Hiroyoshi;
Nagai, Akira;
Nishita, Takafumi;
Kakimoto, Masasaki

Publication type:

Article

Synthesis of network polymers by ring-opening addition reaction of multi-functional epoxy and dithiol compounds.

Published in:

Journal of Polymer Research, 2023, v. 30, n. 1, p. 1, doi. 10.1007/s10965-022-03429-0

By:

Naga, Naofumi;
Hosoi, Yuto;
Nakano, Tamaki

Publication type:

Article

Kinetic study of the atmospheric oxidation of a series of epoxy compounds by OH radicals.

Published in:

Atmospheric Chemistry & Physics, 2022, v. 22, n. 10, p. 6989, doi. 10.5194/acp-22-6989-2022

By:

Tovar, Carmen Maria;
Barnes, Ian;
Bejan, Iustinian Gabriel;
Wiesen, Peter

Publication type:

Article

Observation of two α-relaxation peaks in a nanoclay-filled epoxy compound.

Published in:

2008

By:

Marouf, Bahereh;
Bagheri, Reza;
Pearson, Raymond

Publication type:

Letter

Influence of curing agent ratio, asphalt content and crosslinking degree on the compatibility and component distribution of epoxy asphalt in compound curing agent system.

Published in:

International Journal of Pavement Engineering, 2023, v. 24, n. 2, p. 1, doi. 10.1080/10298436.2022.2136375

By:

Li, Mingyue;
Min, Zhaohui;
Wang, Qichang;
Huang, Wei;
Shi, Zhiyong

Publication type:

Article

Methods and mechanisms of epoxy compounds reduction.

Published in:

Russian Journal of Organic Chemistry, 2008, v. 44, n. 2, p. 153, doi. 10.1134/S1070428008020012

By:

Kas'yan, L. I.;
Kas'yan, A. O.;
Golodaeva, E. A.

Publication type:

Article

Alkylation of pyridinecarbaldehyde oximes with epoxy compounds.

Published in:

Russian Journal of Organic Chemistry, 2007, v. 43, n. 3, p. 449, doi. 10.1134/S1070428007030220

By:

Şen, N.;
Kar, Y.;
Kurbanov, S.

Publication type:

Article

Reactions of Alicyclic Epoxy Compounds with Nitrogen-Containing Nucleophiles.

Published in:

Russian Journal of Organic Chemistry, 2004, v. 40, n. 1, p. 1, doi. 10.1023/B:RUJO.0000034906.46654.ff

By:

Kas'yan, L. I.;
Okovityi, S. I.;
Kas'yan, A. O.

Publication type:

Article

Epoxy compounds as a cause of occupational skin disease. An analysis of 5 years (1984-88) of statistics from the Institute of Occupational Health in Finland.

Published in:

Contact Dermatitis (01051873), 1990, v. 23, n. 4, p. 243, doi. 10.1111/j.1600-0536.1990.tb05026.x

By:

Jolanki, Ritta;
Estlander, Tuula;
Kanerva, Lasse

Publication type:

Article

Pull-out behavior of oxidized copper leadframes from epoxy molding compounds.

Published in:

Journal of Adhesion Science & Technology, 2002, v. 16, n. 6, p. 621, doi. 10.1163/156856102760099852

By:

Lee, Ho-Young;
Kim, Sung-Ryong

Publication type:

Article

Kinetic Study of the Atmospheric Oxidation of a Series of Epoxy Compounds by OH Radicals.

Published in:

Atmospheric Chemistry & Physics Discussions, 2021, p. 1, doi. 10.5194/acp-2021-962

By:

Tovar, Carmen Maria;
Barnes, Ian;
Bejan, Iustinian Gabriel;
Wiesen, Peter

Publication type:

Article

A corrosion study of Ag-Al intermetallic compounds in chlorine-containing epoxy molding compounds.

Published in:

Journal of Materials Science: Materials in Electronics, 2017, v. 28, n. 20, p. 15739, doi. 10.1007/s10854-017-7467-4

By:

Fu, Shao-Wei;
Lee, Chin

Publication type:

Article

Epoxy Contact Dermatitis due to Pacemaker Compounds.

Published in:

Cardiology, 2003, v. 99, n. 2, p. 112, doi. 10.1159/000069721

By:

Skoet, Rikke;
Tollund, Carsten;
Bloch-Thomsen, Poul Erik

Publication type:

Article

Preparation and chemical reactions of rigid cross-linked poly(vinyl chloride) foams modified by epoxy compounds.

Published in:

Journal of Applied Polymer Science, 2014, v. 131, n. 15, p. n/a, doi. 10.1002/app.40567

By:

Jiang, Zhiwei;
Yao, Kun;
Du, Zhonghui;
Xue, Jian;
Tang, Tao;
Liu, Wenbin

Publication type:

Article

Photocuring and thermal post-curing of a cycloaliphatic epoxide resin with a trithiol and a vinyl epoxy compound.

Published in:

Journal of Thermal Analysis & Calorimetry, 2015, v. 121, n. 1, p. 389, doi. 10.1007/s10973-015-4535-y

By:

Morancho, J.;
Fernández-Francos, X.;
Ramis, X.;
Salla, J.;
Serra, À.

Publication type:

Article

Study of long‐term skid and wear resistance of waterborne epoxy resin‐SBR compound modified emulsified asphalt microsurfacing.

Published in:

Journal of Applied Polymer Science, 2024, v. 141, n. 7, p. 1, doi. 10.1002/app.54937

By:

Lu, Chuan;
Zheng, Mulian;
Gao, Yuan;
Ding, Xiaoyan;
Zhang, Wenwu;
Chen, Wang

Publication type:

Article

Synthesis and characterization of novel bio‐based epoxy polymers derived from natural phenolic compound.

Published in:

Journal of Applied Polymer Science, 2023, v. 140, n. 9, p. 1, doi. 10.1002/app.53450

By:

Sudprasert, Pirada;
Kariya, Shotaro;
Ogino, Kenji;
Chirachanchai, Suwabun;
Kanehashi, Shinji

Publication type:

Article

Dependence of Some Physical Characteristics of Epoxy Compounds on the Filler Parameters.

Published in:

Russian Physics Journal, 2016, v. 59, n. 5, p. 729, doi. 10.1007/s11182-016-0828-2

By:

Kim, S.;
Ushakov, V.

Publication type:

Article

Thermal and Cure Kinetics of Epoxy Molding Compounds Cured with Thermal Latency Accelerators.

Published in:

Advances in Materials Science & Engineering, 2013, p. 1, doi. 10.1155/2013/391267

By:

Chean-Cheng Su;
Chien-Huan Wei;
Bo-Ching Li

Publication type:

Article

Experimental and Numerical Investigation of Delamination Between Epoxy Molding Compound (EMC) and Metal in Encapsulated Microelectronic Packages.

Published in:

Experimental Techniques, 2024, v. 48, n. 4, p. 599, doi. 10.1007/s40799-023-00679-5

By:

Shih, M.-K.;
Liu, Y.-H.;
Lin, G.-S.;
Hsu, E.;
Yang, J.

Publication type:

Article

High thermal conductive epoxy molding compound with thermal conductive pathway.

Published in:

Journal of Applied Polymer Science, 2009, v. 113, n. 4, p. 2117, doi. 10.1002/app.30045

By:

Zeng, Jun;
Fu, Renli;
Shen, Yuan;
He, Hong;
Song, Xiufeng

Publication type:

Article