Works about WIRE bonding (Electronic packaging)

Results: 114

Ultrasonic technologies enable ultra-fine-pitch low-temperature bonding.

Published in:

Solid State Technology, 2001, v. 44, n. 2, p. 97

By:

Parrini, Lorenzo

Publication type:

Article

Choosing capillaries for fine pitch bonding.

Published in:

Solid State Technology, 1999, v. 42, n. 7, p. 115

By:

Levine, Lee

Publication type:

Article

Brittle-to-ductile transition of Au2Al and AuAl2 intermetallic compounds in wire bonding.

Published in:

Journal of Materials Science: Materials in Electronics, 2019, v. 30, n. 1, p. 862, doi. 10.1007/s10854-018-0357-6

By:

Yang, Haokun;
Cao, Ke;
Zhao, XiaoTian;
Liu, Wei;
Lu, Jian;
Lu, Yang

Publication type:

Article

A study on intermetallic compound formation in Ag–Al system and evaluation of its mechanical properties by micro-indentation.

Published in:

Journal of Materials Science: Materials in Electronics, 2018, v. 29, n. 5, p. 3985, doi. 10.1007/s10854-017-8340-1

By:

Fu, Shao-Wei;
Lee, Chin C.

Publication type:

Article

Effect of Pd distribution on Pd-plated Cu wire using different electronic flame off settings.

Published in:

Journal of Materials Science: Materials in Electronics, 2017, v. 28, n. 6, p. 4613, doi. 10.1007/s10854-016-6099-4

By:

Cheng, Pi-Ying;
Lai, Po-Ying;
Ye, Zheng-Jie;
Hsieh, Cheng-Li;
Ye, Jiun-Ming

Publication type:

Article

Evolutions of bonding wires used in semiconductor electronics: perspective over 25 years.

Published in:

Journal of Materials Science: Materials in Electronics, 2015, v. 26, n. 7, p. 4412, doi. 10.1007/s10854-015-2892-8

By:

Gan, Chong;
Hashim, U.

Publication type:

Article

Further characterization of Pd-coated copper wire on wirebonding process: from a nanoscale perspective.

Published in:

Journal of Materials Science: Materials in Electronics, 2013, v. 24, n. 9, p. 3594, doi. 10.1007/s10854-013-1290-3

By:

Hsu, Hsiang-Chen;
Chu, Li-Ming;
Chang, Wei-Yao;
Chen, Yi-Feng;
Chien, Jih-Hsin;
Fu, Shen-Li;
Ju, Shin-Pon;
Feng, Wen-Jui

Publication type:

Article

Effect of EFO parameters on Cu FAB hardness and work hardening in thermosonic wire bonding.

Published in:

Journal of Materials Science: Materials in Electronics, 2009, v. 20, n. 11, p. 1144, doi. 10.1007/s10854-008-9841-8

By:

Pequegnat, A.;
Hang, C. J.;
Mayer, M.;
Zhou, Y.;
Moon, J. T.;
Persic, J.

Publication type:

Article

Impact of packaging materials on reliability test for low-K wire bond-stacked flip chip CSP.

Published in:

Journal of Materials Science: Materials in Electronics, 2009, v. 20, n. 5, p. 484, doi. 10.1007/s10854-008-9756-4

By:

Chen, K. M.

Publication type:

Article

Effects of bonding frequency on Au wedge wire bondability.

Published in:

Journal of Materials Science: Materials in Electronics, 2008, v. 19, n. 3, p. 281, doi. 10.1007/s10854-007-9312-7

By:

Yu Hin Chan;
Jang-Kyo Kim;
Deming Liu;
Liu, Peter C. K.;
Yiu Ming Cheung;
Ming Wai Ng

Publication type:

Article

A finite element analysis of effects of ultrasonic welding parameters on the temperature distribution in wire bonding.

Published in:

PAMM: Proceedings in Applied Mathematics & Mechanics, 2016, v. 16, n. 1, p. 375, doi. 10.1002/pamm.201610176

By:

Mostafavi, Shimaalsadat;
Markert, Bernd

Publication type:

Article

Machine learning-based shear force quality prediction of ultrasonic wire bonds: utilizing process data and machine data without additional sensors.

Published in:

International Journal of Advanced Manufacturing Technology, 2024, v. 133, n. 11/12, p. 5657, doi. 10.1007/s00170-024-14055-z

By:

Buchner, Christoph;
Seidler, Christian T.;
Huber, Marco F.;
Eigenbrod, Hartmut;
von Ribbeck, Hans-Georg;
Schlicht, Franz

Publication type:

Article

Hybrid external-cavity lasers (ECL) using photonic wire bonds as coupling elements.

Published in:

Scientific Reports, 2021, v. 11, n. 1, p. 1, doi. 10.1038/s41598-021-95981-w

By:

Xu, Yilin;
Maier, Pascal;
Blaicher, Matthias;
Dietrich, Philipp-Immanuel;
Marin-Palomo, Pablo;
Hartmann, Wladislaw;
Bao, Yiyang;
Peng, Huanfa;
Billah, Muhammad Rodlin;
Singer, Stefan;
Troppenz, Ute;
Moehrle, Martin;
Randel, Sebastian;
Freude, Wolfgang;
Koos, Christian

Publication type:

Article

0.90(Bi1/2Na1/2)TiO3–0.05(Bi1/2K1/2)TiO3– 0.05BaTiO3 transducer for ultrasonic wirebonding applications.

Published in:

Applied Physics A: Materials Science & Processing, 2006, v. 84, n. 3, p. 313, doi. 10.1007/s00339-006-3625-x

By:

Choy, S. H.;
Wang, X. X.;
Chong, C. P.;
Chan, H. L. W.;
Liu, P. C. K.;
Choy, C. L.

Publication type:

Article

Application research on the time--frequency analysis method in the quality detection of ultrasonic wire bonding.

Published in:

International Journal of Distributed Sensor Networks, 2021, v. 17, n. 5, p. 1, doi. 10.1177/15501477211018346

By:

Wuwei Feng;
Xin Chen;
Cuizhu Wang;
Yuzhou Shi

Publication type:

Article

Evolution and investigation of copper and gold ball bonds in extended reliability stressing.

Published in:

Gold Bulletin, 2014, v. 47, n. 3, p. 141, doi. 10.1007/s13404-014-0135-z

By:

Gan, C.;
Classe, F.;
Chan, B.;
Hashim, U.

Publication type:

Article

Some thoughts on bondability and strength of gold wire bonding.

Published in:

Gold Bulletin, 2012, v. 45, n. 3, p. 115, doi. 10.1007/s13404-012-0060-y

By:

Zulkifli, Muhammad;
Abdullah, Shahrum;
Othman, Norinsan;
Jalar, Azman

Publication type:

Article

Highlights from recent literature.

Published in:: Gold Bulletin, 2012, v. 45, n. 1, p. 47, doi. 10.1007/s13404-012-0044-y
Publication type:: Article

Corrosion-Induced Mass Loss of Cu9Al4 at the Cu-Al Ball-Bond Interface: Explained Based on Full Immersion of Cu, Al, and Cu-Al Intermetallic Galvanic Couples.

Published in:

Journal of Electronic Materials, 2019, v. 48, n. 1, p. 44, doi. 10.1007/s11664-018-6625-7

By:

Wu, Yuelin;
Lee, Andre

Publication type:

Article

Detecting the Internal Distribution and Structure of Pd-Doped Ag Wire Bonds Using an RF Technique.

Published in:

Journal of Electronic Materials, 2018, v. 47, n. 12, p. 7258, doi. 10.1007/s11664-018-6661-3

By:

Hwang, Lih-Tyng;
Sung, Yi-Jung;
Feng, Chang-Yi;
Chuang, Eson

Publication type:

Article

The Intermetallic Compound Formation for the Wire Bond Between an Al Pad and Ag-xPd Alloy Wire.

Published in:

Journal of Electronic Materials, 2016, v. 45, n. 12, p. 6130, doi. 10.1007/s11664-016-5044-x

By:

Huang, Wei-Hsiang;
Lin, Kwang-Lung;
Lin, Yu-Wei;
Cheng, Yun-Kai

Publication type:

Article

The Influence of Pd-Doped Au Wire Bonding on HAZ Microstructure and Looping Profile in Micro-Electromechanical Systems (MEMS) Packaging.

Published in:

Journal of Electronic Materials, 2015, v. 44, n. 7, p. 2507, doi. 10.1007/s11664-015-3812-7

By:

Ismail, Roslina;
Omar, Ghazali;
Jalar, Azman;
Majlis, Burhanuddin

Publication type:

Article

Review of Capabilities of the ENEPIG Surface Finish.

Published in:

Journal of Electronic Materials, 2014, v. 43, n. 11, p. 3885, doi. 10.1007/s11664-014-3322-z

By:

Ratzker, Menahem;
Pearl, Adam;
Osterman, Michael;
Pecht, Michael;
Milad, George

Publication type:

Article

Effects of Bonding Wires and Epoxy Molding Compound on Gold and Copper Ball Bonds Intermetallic Growth Kinetics in Electronic Packaging.

Published in:

Journal of Electronic Materials, 2014, v. 43, n. 4, p. 1017, doi. 10.1007/s11664-014-3011-y

By:

Gan, C.;
Classe, F.;
Chan, B.;
Hashim, U.

Publication type:

Article

Copper Wire Bonding Concerns and Best Practices.

Published in:

Journal of Electronic Materials, 2013, v. 42, n. 8, p. 2415, doi. 10.1007/s11664-013-2576-1

By:

Chauhan, Preeti;
Zhong, Z.;
Pecht, Michael

Publication type:

Article

Effect of Thickness and Phosphorus Content on Au/Pd/Ni(P) Metal Finish of Printed Circuit Board.

Published in:

Journal of Electronic Materials, 2013, v. 42, n. 8, p. 2648, doi. 10.1007/s11664-013-2609-9

By:

Huang, Chih-Kai;
Lin, Keh-Wen;
Huang, Yu-Ming;
Caparanga, Alvin;
Leron, Rhoda;
Li, Meng-Hui

Publication type:

Article

Development and Status of Cu Ball/Wedge Bonding in 2012.

Published in:

Journal of Electronic Materials, 2013, v. 42, n. 3, p. 558, doi. 10.1007/s11664-012-2383-0

By:

Schneider-Ramelow, Martin;
Geißler, Ute;
Schmitz, Stefan;
Grübl, Wolfgang;
Schuch, Bernhard

Publication type:

Article

Room-Temperature Nanoindentation Creep of Thermally Cycled Ultrasonically Bonded Heavy Aluminum Wires.

Published in:

Journal of Electronic Materials, 2013, v. 42, n. 3, p. 537, doi. 10.1007/s11664-012-2385-y

By:

Agyakwa, P.A.;
Marques, V.M.F.;
Corfield, M.R.;
Li, J.F.;
Yang, L.;
Johnson, C.M.

Publication type:

Article

Microstructural Investigation of Interfacial Features in Al Wire Bonds.

Published in:

Journal of Electronic Materials, 2012, v. 41, n. 12, p. 3436, doi. 10.1007/s11664-012-2215-2

By:

Khatibi, G.;
Weiss, B.;
Bernardi, J.;
Schwarz, S.

Publication type:

Article

Tensile and Fatigue Behavior of Al-1Si Wire Used in Wire Bonding.

Published in:

Journal of Electronic Materials, 2011, v. 40, n. 6, p. 1422, doi. 10.1007/s11664-011-1592-2

By:

Danaher, F.;
Williams, J.;
Singh, D.;
Jiang, L.;
Chawla, N.

Publication type:

Article

Comparison of Insulated with Bare Au Bonding Wire: HAZ Length, HAZ Breaking Force, and FAB Deformability.

Published in:

Journal of Electronic Materials, 2009, v. 38, n. 6, p. 834, doi. 10.1007/s11664-009-0762-y

By:

Wan Ho Song;
Chunjin Hang;
Pequegnat, Andrew;
Mayer, Michael;
Zhou, Norman Y.;
Young-Kyu Song;
Persic, John

Publication type:

Article

In Situ Studies of the Effect of Ultrasound During Deformation on Residual Hardness of a Metal.

Published in:

Journal of Electronic Materials, 2009, v. 38, n. 5, p. 647, doi. 10.1007/s11664-009-0732-4

By:

Lum, I.;
Hang, C. J.;
Mayer, M.;
Zhou, Y.

Publication type:

Article

Suppressing Growth of the Cu5Zn8 Intermetallic Layer in Sn-Zn-Ag-Al-Ga/Cu Solder Joints.

Published in:

Journal of Electronic Materials, 2009, v. 38, n. 1, p. 88, doi. 10.1007/s11664-008-0579-0

By:

Lai, R.;
Lin, K.;
Salam, B.

Publication type:

Article

Electromigration Behavior in Sn-37Pb and Sn-3.0Ag-0.5Cu Flip-Chip Solder Joints under High Current Density.

Published in:

Journal of Electronic Materials, 2009, v. 38, n. 1, p. 70, doi. 10.1007/s11664-008-0574-5

By:

Ha, Sang-Su;
Kim, Jong-Woong;
Yoon, Jeong-Won;
Ha, Sang-Ok;
Jung, Seung-Boo

Publication type:

Article

The Feasibility of Au Ball Bonding on Sn-Plated Cu.

Published in:

Journal of Electronic Materials, 2007, v. 36, n. 6, p. 682, doi. 10.1007/s11664-007-0121-9

By:

Lee, J.;
Mayer, M.;
Zhou, Y.

Publication type:

Article

Electromigration Effects on Intermetallic Growth at Wire-Bond Interfaces.

Published in:

Journal of Electronic Materials, 2006, v. 35, n. 11, p. 1961, doi. 10.1007/s11664-006-0300-0

By:

Orchard, H. T.;
Greer, A. L.

Publication type:

Article

Solid-State Reaction in an Au Wire Connection with an Al-Cu Pad During Aging.

Published in:

Journal of Electronic Materials, 2006, v. 35, n. 2, p. 323, doi. 10.1007/BF02692453

By:

Guh-Yaw Jang;
Jenq-Gong Duh;
Takahashi, Hideyuki;
Su, David

Publication type:

Article

Innovative Wire Bonding Method Using a Chemically Reacted Thin Layer for Chips with Copper Interconnects.

Published in:

Journal of Electronic Materials, 2006, v. 35, n. 2, p. 279, doi. 10.1007/BF02692447

By:

Yeau Ren Jeng;
Sang Mao Chiu

Publication type:

Article

In-Situ Cleaning and Passivation of Oxidized Cu Surfaces by Alkanethiols and Its Application to Wire Bonding.

Published in:

Journal of Electronic Materials, 2004, v. 33, n. 9, p. 1005, doi. 10.1007/s11664-004-0027-8

By:

Whelan, Caroline M.;
Kinsella, Michael;
Hong Meng Ho;
Maex, Karen

Publication type:

Article

Thermosonic Bonding of Gold Wire onto a Copper Pad with Titanium Thin-Film Deposition.

Published in:

Journal of Electronic Materials, 2004, v. 33, n. 4, p. 290, doi. 10.1007/s11664-004-0135-5

By:

Jong-Ning Aoh;
Cheng-Li Chuang

Publication type:

Article

Process Windows for Low-Temperature Au Wire Bonding.

Published in:

Journal of Electronic Materials, 2004, v. 33, n. 2, p. 146, doi. 10.1007/s11664-004-0285-5

By:

Yu Hin Chan, L.;
Jang-Kyo Kim;
Deming Liu;
Liu, Peter C. K.;
Yiu Ming Cheung, Peter C. K.;
Ming Wai Ng, Peter C. K.

Publication type:

Article

Emerging Interconnection Technology and Pb-Free Solder Materials for Advanced Microelectronic Packaging.

Published in:

Metals (2075-4701), 2021, v. 11, n. 12, p. 1941, doi. 10.3390/met11121941

By:

Ahn, Byungmin

Publication type:

Article

Recent Progress in Transient Liquid Phase and Wire Bonding Technologies for Power Electronics.

Published in:

Metals (2075-4701), 2020, v. 10, n. 7, p. 934, doi. 10.3390/met10070934

By:

Kang, Hyejun;
Sharma, Ashutosh;
Jung, Jae Pil

Publication type:

Article

Automated bonding position inspection on multi-layered wire IC using machine vision.

Published in:

International Journal of Production Research, 2010, v. 48, n. 23, p. 6977, doi. 10.1080/00207540903059497

By:

Perng, Der-Baau;
Lee, Shu-Ming;
Chou, Cheng-Chuan

Publication type:

Article

Paralleled GaN DHEMTs integrated cascode GaN switch for high-current applications.

Published in:

Electronics Letters (Wiley-Blackwell), 2018, v. 54, n. 14, p. 899, doi. 10.1049/el.2018.1273

By:

Tianhua Zhu;
Fang Zhuo

Publication type:

Article

Unbalanced input pair zero current detector for DC–DC buck converter.

Published in:

Electronics Letters (Wiley-Blackwell), 2015, v. 51, n. 17, p. 1359, doi. 10.1049/el.2015.0323

By:

Kok, C. L.;
Siek, L.

Publication type:

Article

Effect of Cu and PdCu wire bonding on bond pad splash.

Published in:

Electronics Letters (Wiley-Blackwell), 2014, v. 50, n. 15, p. 1095, doi. 10.1049/el.2013.3514

By:

Tan, Y. Y.;
Sim, K. S.

Publication type:

Article

Enhanced adhesion and thermal stability of Al/Cr film on indium-tin-oxide (ITO)-coated glass.

Published in:

Journal of Adhesion Science & Technology, 2003, v. 17, n. 15, p. 2085, doi. 10.1163/156856103322584227

By:

Hsieh, J. H.;
Tzong-Ming Wu;
Tong, J. Z.;
Yang, S.

Publication type:

Article

INFLUENCE OF RELATIVE SPEED DRAWING ON THE MECHANICAL CHARACTERISTICS ULTRASONIC METAL WIRE DRAWING.

Published in:

TEHNOMUS, 2013, p. 240

By:

Mihai, Susan;
Dănuţa Mihaela, Bălănescu (Prisacaru);
Oreste, Cristodulo

Publication type:

Article

Electrical characterization of a RF power transistor ceramic package including multiple wirebonds.

Published in:

International Journal of RF & Microwave Computer-Aided Engineering, 2013, v. 23, n. 1, p. 52, doi. 10.1002/mmce.20650

By:

Kopyt, Pawel

Publication type:

Article