Works matching DE "WIRE bonding (Electronic packaging)"
Results: 115
Ultrasonic technologies enable ultra-fine-pitch low-temperature bonding.
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- Solid State Technology, 2001, v. 44, n. 2, p. 97
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Choosing capillaries for fine pitch bonding.
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- Solid State Technology, 1999, v. 42, n. 7, p. 115
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Reinforcement of Ag nanoparticle paste with nanowires for low temperature pressureless bonding.
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- Journal of Materials Science, 2012, v. 47, n. 19, p. 6801, doi. 10.1007/s10853-012-6624-7
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Detailed investigation of ultrasonic Al–Cu wire-bonds: II. Microstructural evolution during annealing.
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- Journal of Materials Science, 2008, v. 43, n. 18, p. 6038, doi. 10.1007/s10853-008-2955-9
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Detailed investigation of ultrasonic Al–Cu wire-bonds: I. Intermetallic formation in the as-bonded state.
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- Journal of Materials Science, 2008, v. 43, n. 18, p. 6029, doi. 10.1007/s10853-008-2954-x
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Microstructural evolution of gold–aluminum wire-bonds.
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- Journal of Materials Science, 2007, v. 42, n. 7, p. 2347, doi. 10.1007/s10853-007-1593-y
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Laser Drop on Demand Micro Joining for High Temperature Wire Bonding Applications – System Technology And Mechanical Joint Performance.
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- Journal of Laser Micro / Nanoengineering, 2017, v. 12, n. 3, p. 239, doi. 10.2961/jlmn.2017.03.0012
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Investigation of Optical Interconnection by using Photonic Wire Bonding.
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- Journal of Laser Micro / Nanoengineering, 2015, v. 10, n. 2, p. 148, doi. 10.2961/jlmn.2015.02.0007
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Reducing non-stick on pad for wire bond: A review.
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- Australian Journal of Mechanical Engineering, 2012, v. 9, n. 2, p. 147, doi. 10.7158/M11-771.2012.9.2
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Learning to Dispatch Operations with Intentional Delay for Re-Entrant Multiple-Chip Product Assembly Lines.
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- Sustainability (2071-1050), 2018, v. 10, n. 11, p. 4123, doi. 10.3390/su10114123
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HEAT TRANSFER AND STRUCTURE STRESS ANALYSIS OF MICRO PACKAGING COMPONENT OF HIGH POWER LIGHT EMITTING DIODE.
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- Thermal Science, 2013, v. 17, n. 5, p. 1277, doi. 10.2298/TSCI1305277H
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HIGH RESOLUTION ACOUSTIC GHz MICROSCOPY.
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- Electronic Device Failure Analysis, 2018, v. 20, n. 4, p. 4, doi. 10.31399/asm.edfa.2018-4.p004
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WIRE BONDING.
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- Electronic Device Failure Analysis, 2016, v. 18, n. 1, p. 22, doi. 10.31399/asm.edfa.2016-1.p022
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Low Loss Configuration for Integrated PIN-Schottky Limiters.
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- Microwave Journal, 2014, p. 40
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A COMPARISON STUDY OF HIGH-FREQUENCY CHARACTERISTICS FOR BALL AND RIBBON BONDING.
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- Microwave Journal, 2010, v. 53, n. 6, p. 62
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INNOVATIVE THIN FILM TECHNIQUES TO ELIMINATE FAULTY WIRE BONDS AND IMPROVE HIGH FREQUENCY CIRCUIT DENSITIES.
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- Microwave Journal, 2005, p. 40
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Melt Tearing and Ovality in Wire Coating.
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- Polymer Engineering & Science, 2000, v. 40, n. 8, p. 1862, doi. 10.1002/pen.11318
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An in situ TEM study of phase formation in gold-aluminum couples.
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- Journal of Materials Science, 2004, v. 39, n. 1, p. 165, doi. 10.1023/B:JMSC.0000007741.97288.bd
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TECHNOLOGY OF PRODUCING THE CONTACT CONNECTIONS OF SUPERCONDUCTOR METAL-SHEATHED CABLE.
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- Management Systems in Production Engineering, 2017, v. 25, n. 2, p. 110, doi. 10.1515/mspe-2017-0017
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The 56xx Desktop Micro Factory - the New Equipment for Wire-Bond Technologies.
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- Acta Physica Polonica: A, 2009, v. 116, p. S.196, doi. 10.12693/APhysPolA.116.S-196
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Application research on the time--frequency analysis method in the quality detection of ultrasonic wire bonding.
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- International Journal of Distributed Sensor Networks, 2021, v. 17, n. 5, p. 1, doi. 10.1177/15501477211018346
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6 to 44 GHz, 45° Beamwidth Dual Polarized Antenna.
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- Microwave Journal, 2021, v. 64, n. 5, p. 142
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A Microelectromechanical Switch with Metamaterial Contacts, Part I: Concepts and Technology.
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- Microwave Journal, 2020, v. 63, n. 5, p. 82
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PEOPLE.
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- Microwave Journal, 2019, v. 62, n. 6, p. 46
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Comparison of Insulated with Bare Au Bonding Wire: HAZ Length, HAZ Breaking Force, and FAB Deformability.
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- Journal of Electronic Materials, 2009, v. 38, n. 6, p. 834, doi. 10.1007/s11664-009-0762-y
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In Situ Studies of the Effect of Ultrasound During Deformation on Residual Hardness of a Metal.
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- Journal of Electronic Materials, 2009, v. 38, n. 5, p. 647, doi. 10.1007/s11664-009-0732-4
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Suppressing Growth of the Cu<sub>5</sub>Zn<sub>8</sub> Intermetallic Layer in Sn-Zn-Ag-Al-Ga/Cu Solder Joints.
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- Journal of Electronic Materials, 2009, v. 38, n. 1, p. 88, doi. 10.1007/s11664-008-0579-0
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Electromigration Behavior in Sn-37Pb and Sn-3.0Ag-0.5Cu Flip-Chip Solder Joints under High Current Density.
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- Journal of Electronic Materials, 2009, v. 38, n. 1, p. 70, doi. 10.1007/s11664-008-0574-5
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The Feasibility of Au Ball Bonding on Sn-Plated Cu.
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- Journal of Electronic Materials, 2007, v. 36, n. 6, p. 682, doi. 10.1007/s11664-007-0121-9
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Electromigration Effects on Intermetallic Growth at Wire-Bond Interfaces.
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- Journal of Electronic Materials, 2006, v. 35, n. 11, p. 1961, doi. 10.1007/s11664-006-0300-0
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Solid-State Reaction in an Au Wire Connection with an Al-Cu Pad During Aging.
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- Journal of Electronic Materials, 2006, v. 35, n. 2, p. 323, doi. 10.1007/BF02692453
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Innovative Wire Bonding Method Using a Chemically Reacted Thin Layer for Chips with Copper Interconnects.
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- Journal of Electronic Materials, 2006, v. 35, n. 2, p. 279, doi. 10.1007/BF02692447
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In-Situ Cleaning and Passivation of Oxidized Cu Surfaces by Alkanethiols and Its Application to Wire Bonding.
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- Journal of Electronic Materials, 2004, v. 33, n. 9, p. 1005, doi. 10.1007/s11664-004-0027-8
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Thermosonic Bonding of Gold Wire onto a Copper Pad with Titanium Thin-Film Deposition.
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- Journal of Electronic Materials, 2004, v. 33, n. 4, p. 290, doi. 10.1007/s11664-004-0135-5
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Process Windows for Low-Temperature Au Wire Bonding.
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- Journal of Electronic Materials, 2004, v. 33, n. 2, p. 146, doi. 10.1007/s11664-004-0285-5
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Effect of EFO parameters on Cu FAB hardness and work hardening in thermosonic wire bonding.
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- Journal of Materials Science: Materials in Electronics, 2009, v. 20, n. 11, p. 1144, doi. 10.1007/s10854-008-9841-8
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Impact of packaging materials on reliability test for low-K wire bond-stacked flip chip CSP.
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- Journal of Materials Science: Materials in Electronics, 2009, v. 20, n. 5, p. 484, doi. 10.1007/s10854-008-9756-4
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Effects of bonding frequency on Au wedge wire bondability.
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- Journal of Materials Science: Materials in Electronics, 2008, v. 19, n. 3, p. 281, doi. 10.1007/s10854-007-9312-7
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Quasi-Rigid Mode of Bond Head Assembly in Wire Bonding Machines and Its Improvement #.
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- Mechanics Based Design of Structures & Machines, 2005, v. 33, n. 3/4, p. 293, doi. 10.1080/15367730500374290
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A finite element analysis of effects of ultrasonic welding parameters on the temperature distribution in wire bonding.
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- PAMM: Proceedings in Applied Mathematics & Mechanics, 2016, v. 16, n. 1, p. 375, doi. 10.1002/pamm.201610176
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Machine learning-based shear force quality prediction of ultrasonic wire bonds: utilizing process data and machine data without additional sensors.
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- International Journal of Advanced Manufacturing Technology, 2024, v. 133, n. 11/12, p. 5657, doi. 10.1007/s00170-024-14055-z
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Polymer Magnetic Composite Core Based Microcoils and Microtransformers for Very High Frequency Power Applications.
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- Micromachines, 2016, v. 7, n. 4, p. 60, doi. 10.3390/mi7040060
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Evolution and investigation of copper and gold ball bonds in extended reliability stressing.
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- Gold Bulletin, 2014, v. 47, n. 3, p. 141, doi. 10.1007/s13404-014-0135-z
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An Experimental Approach to Enhance Cu Wire Bonding Yield Through Parameter Optimization.
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- Experimental Techniques, 2014, v. 38, n. 3, p. 29, doi. 10.1111/j.1747-1567.2011.00799.x
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A Prototype of Knowledge-Based System for Fault Diagnosis in Automatic Wire Bonding Machine.
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- Turkish Journal of Engineering & Environmental Sciences, 2008, v. 32, n. 4, p. 235
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On an IC wire bonding machine production–inventory problem with time value of money.
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- International Journal of Production Research, 2017, v. 55, n. 9, p. 2431, doi. 10.1080/00207543.2016.1213914
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Highly Accelerated Mechanical Lifetime Testing for Wire Bonds in Power Electronics.
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- Journal of Microelectronic & Electronic Packaging, 2022, v. 19, n. 2, p. 49, doi. 10.4071/imaps.1717134
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A Wirebonding Instrument for Insulated and Coaxial Wires.
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- Journal of Microelectronic & Electronic Packaging, 2020, v. 17, n. 2, p. 52, doi. 10.4071/imaps.1115585
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Investigations on the Additive Manufacturing and Heavy Wire Bonding Capability of Selective Laser-Melted Circuit Carriers.
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- Journal of Microelectronic & Electronic Packaging, 2017, v. 14, n. 2, p. 63, doi. 10.4071/imaps.453827
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The Design and Evaluation of an Integrated Wire Bond-less Power Module using a Low Temperature Co-fired Ceramic Interposer.
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- Journal of Microelectronic & Electronic Packaging, 2016, v. 13, n. 4, p. 169, doi. 10.4071/imaps.514
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