Works matching DE "WARPAGE in electronic circuits"
Results: 33
Completely in situ and non-contact warpage assessment using 3D DIC with virtual patterning method.
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- International Journal of Advanced Manufacturing Technology, 2019, v. 100, n. 9-12, p. 2803, doi. 10.1007/s00170-018-2834-8
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- Article
A reduction of protector cover warpage via topology optimization.
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- International Journal of Advanced Manufacturing Technology, 2018, v. 98, n. 9-12, p. 2531, doi. 10.1007/s00170-018-2388-9
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- Article
Warpage and bending behavior of polymer-metal hybrids: experimental and numerical simulations.
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- International Journal of Advanced Manufacturing Technology, 2018, v. 98, n. 1-4, p. 873, doi. 10.1007/s00170-018-2226-0
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- Article
Dynamic digital fringe projection technique for measuring the warpage of unpainted PBGA packages and boards.
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- International Journal of Advanced Manufacturing Technology, 2018, v. 96, n. 9-12, p. 3235, doi. 10.1007/s00170-018-1819-y
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- Article
Multi-objective optimization of variable packing pressure profile and process parameters in plastic injection molding for minimizing warpage and cycle time.
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- International Journal of Advanced Manufacturing Technology, 2017, v. 92, n. 9-12, p. 3991, doi. 10.1007/s00170-017-0456-1
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- Article
Warpage Prediction in Injection Molding Using Artificial Neural Network.
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- Journal of Soft Computing & Decision Support Systems, 2015, v. 2, n. 5, p. 7
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- Article
Warpage and Shrinkage Analysis and Optimization of Rapid Tooling Molded thin Wall Component Using Modified Particle Swarm Algorithm.
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- Journal of Advanced Manufacturing Systems, 2019, v. 18, n. 1, p. 85, doi. 10.1142/S0219686719500045
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- Article
Effects of localized warpage and stress on chip-on-glass packaging: Induced light-leakage phenomenon in mid-sized TFT-LCD.
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- 2012
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- Publication type:
- Other
Innovative parametric design for environmentally conscious adhesive dispensing process.
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- Journal of Intelligent Manufacturing, 2015, v. 26, n. 1, p. 1, doi. 10.1007/s10845-013-0755-9
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- Article
Vibration analysis of circular Janus MoSSe plates.
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- Journal of Southeast University (English Edition), 2023, v. 39, n. 3, p. 225, doi. 10.3969/j.issn.1003-7985.2023.03.002
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- Article
Shrinkage and Warpage in the Permanent Shape of Sape-Memory Polyurethane Parts.
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- Materiale Plastice, 2021, n. 4, p. 102, doi. 10.37358/MP.21.4.5536
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- Article
Warpage Reduction for Power MOSFET Wafers.
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- Electrica, 2021, v. 21, n. 2, p. 173, doi. 10.5152/electrica.2021.21019
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- Article
Effects of Hydrothermal Environment on the Deformation of the Thin Bamboo Bundle Veneer Laminated Composites.
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- Journal of Renewable Materials, 2023, v. 11, n. 3, p. 1499, doi. 10.32604/jrm.2022.025130
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- Article
Optimization on Parameter Settings in Determining Warpage Factors of a Side-Gated Thin Shallow Part Injection Molding for PP, ABS & PC+ABS Materials.
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- International Review of Mechanical Engineering, 2012, v. 6, n. 4, p. 865
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- Article
Fabrication and Power Densities of Anode-Supported Solid Oxide Fuel Cells with Different Ni-YSZ Anode Functional Layer Thicknesses.
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- Fuel Cells, 2015, v. 15, n. 1, p. 90, doi. 10.1002/fuce.201400138
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- Article
Influence of the Viscoelastic Properties of the Polyimide Dielectric Coating on the Wafer Warpage.
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- Journal of Electronic Materials, 2014, v. 43, n. 9, p. 3255, doi. 10.1007/s11664-014-3255-6
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- Article
Simulation of Fused Deposition Modeling of Glass Fiber Reinforced ABS Impact Samples: The Effect of Fiber Ratio, Infill Rate, and Infill Pattern on Warpage and Residual Stresses.
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- Hittite Journal of Science & Engineering, 2023, v. 10, n. 1, p. 21, doi. 10.17350/HJSE19030000287
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- Article
Numerical Simulation on the Warpage of Reconstructed Wafer During Encapsulation Process.
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- Journal of Microelectronic & Electronic Packaging, 2022, v. 19, n. 3, p. 89, doi. 10.4071/imaps.1721531
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- Article
Elevated Standoff Heights of Solder Joint Interconnections Can Result in Appreciable Stress and Warpage Relief.
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- Journal of Microelectronic & Electronic Packaging, 2019, v. 16, n. 1, p. 13, doi. 10.4071/imaps.735566
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- Article
Process Optimization for 3-D IC Assembly.
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- Journal of Microelectronic & Electronic Packaging, 2015, v. 12, n. 4, p. 219, doi. 10.4071/imaps.474
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- Article
Warpage Evaluation of High-Temperature Sandwich-Structured Power Module for SiC Power Semiconductor Devices.
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- Journal of Microelectronic & Electronic Packaging, 2015, v. 12, n. 3, p. 153, doi. 10.4071/imaps.464
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- Article
Challenges of Scalable 2.5D IC Assembly.
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- Journal of Microelectronic & Electronic Packaging, 2015, v. 12, n. 3, p. 123, doi. 10.4071/imaps.455
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- Article
New Stacked Die Interconnect Technology for High-Performance and Low-Cost FPGA.
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- Journal of Microelectronic & Electronic Packaging, 2015, v. 12, n. 3, p. 111, doi. 10.4071/imaps.452
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- Article
Automatic Segmentation Method for Segmenting PBGA Package and PWB Regions During Warpage Measurement of Unpainted PWB Assembly.
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- Journal of Microelectronic & Electronic Packaging, 2015, v. 12, n. 2, p. 104, doi. 10.4071/imaps.449
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- Article
Assessment and Characterization of Stress Induced by Via-First TSV Technology.
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- Journal of Microelectronic & Electronic Packaging, 2011, v. 8, n. 4, p. 129, doi. 10.4071/imaps.313
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- Article
Modelling and optimization of injection molding process for PBT/PET parts using modified particle swarm algorithm.
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- Indian Journal of Engineering & Materials Sciences, 2020, v. 27, n. 3, p. 603, doi. 10.56042/ijems.v27i3.45057
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- Article
Study of the filling mechanism and parameter optimization method for vacuum casting.
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- International Journal of Advanced Manufacturing Technology, 2016, v. 83, n. 5-8, p. 711, doi. 10.1007/s00170-015-7597-x
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- Article
A warpage optimization method for injection molding using artificial neural network with parametric sampling evaluation strategy.
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- International Journal of Advanced Manufacturing Technology, 2013, v. 65, n. 1-4, p. 343, doi. 10.1007/s00170-012-4173-5
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- Article
An Innovative Surrogate-Based Searching Method for Reducing Warpage and Cycle Time in Injection Molding.
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- Advances in Polymer Technology, 2016, v. 35, n. 3, p. 288, doi. 10.1002/adv.21554
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- Article
P-63: Effect of Glass Substrate Characteristics on Pattern Tolerance in Inverted Staggered Type TFT Array Fabrication.
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- SID Symposium Digest of Technical Papers, 2015, v. 46, n. 1, p. 1372, doi. 10.1002/sdtp.10129
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- Article
Warpage Analysis of Electroplated Cu Films on Fiber-Reinforced Polymer Packaging Substrates.
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- Polymers (20734360), 2015, v. 7, n. 6, p. 985, doi. 10.3390/polym7060985
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- Article
Warpage reduction through optimized process parameters and annealed process of injection-molded plastic parts.
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- Journal of Mechanical Science & Technology, 2018, v. 32, n. 10, p. 4787, doi. 10.1007/s12206-018-0926-x
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- Article
Influence of processing parameters on warpage according to the Taguchi experiment.
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- Journal of Mechanical Science & Technology, 2015, v. 29, n. 10, p. 4153, doi. 10.1007/s12206-015-0909-0
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- Publication type:
- Article