Works matching DE "WAFER level packaging"

Results: 109

Effects of microstructure of copper used in redistribution layer on wafer warpage evolution during the thermal process.

Published in:

Journal of Materials Science: Materials in Electronics, 2019, v. 30, n. 12, p. 11136, doi. 10.1007/s10854-019-01456-0

By:

Yang, Heng;
Cheng, Gong;
Luo, Le;
Xu, Gaowei

Publication type:

Article

Explore of warpage origination in WLP and processing influence factors by experiment and theoretical modeling.

Published in:

Journal of Materials Science: Materials in Electronics, 2016, v. 27, n. 11, p. 11548, doi. 10.1007/s10854-016-5285-8

By:

Li, Heng;
Cheng, Gong;
Xu, Gaowei;
Luo, Le

Publication type:

Article

Influence of polyimide on thermal stress evolution in polyimide/Cu thick film composite.

Published in:

Journal of Materials Science: Materials in Electronics, 2016, v. 27, n. 8, p. 8325, doi. 10.1007/s10854-016-4841-6

By:

Li, Heng;
Cheng, Gong;
Xu, Gaowei;
Luo, Le

Publication type:

Article

Shorting out bonding method for multi-stack anodic bonding and its application in wafer-level packaging.

Published in:

Modern Physics Letters B, 2020, v. 34, n. 32, p. N.PAG, doi. 10.1142/S0217984920503698

By:

Liu, Yifang;
Dai, Tingting;
Xie, Peiqin;
Wang, Lingyun;
Zhan, Zhan;
Gu, Dandan;
Xiong, Heng

Publication type:

Article

Laser ablation and stealth dicing of full-thickness silicon wafer.

Published in:

International Journal of Advanced Manufacturing Technology, 2025, v. 137, n. 3, p. 1599, doi. 10.1007/s00170-025-15275-7

By:

Son, Yeongil;
Shin, Joonghan

Publication type:

Article

Application of the surface planer process to Cu pillars and wafer support tape for high-coplanarity wafer-level packaging.

Published in:

International Journal of Advanced Manufacturing Technology, 2022, v. 119, n. 5/6, p. 3427, doi. 10.1007/s00170-021-08622-x

By:

Inoue, Fumihiro;
Phommahaxay, Alain;
Gokita, Yohei;
Möller, Berthold;
Beyne, Eric

Publication type:

Article

PACKAGING FOR MOBILE APPLICATIONS.

Published in:

Intel Technology Journal, 2014, v. 18, n. 3, p. 118

By:

Meyer, Thorsten;
Albers, Sven;
Geissler, Christian;
Ofner, Gerald;
Reingruber, Klaus;
Seidemann, Georg;
Wolter, Andreas

Publication type:

Article

Research on a MEMS Microparticles Vacuum Chamber for Optical Levitation with a Built-In Vacuum Gauge.

Published in:

Photonics, 2022, v. 9, n. 12, p. 911, doi. 10.3390/photonics9120911

By:

Pu, Junji;
Zeng, Kai;
Wu, Yulie;
Xiao, Dingbang

Publication type:

Article

Fluorinated graphene/polyimide nanocomposites for advanced electronic packaging applications.

Published in:

Journal of Applied Polymer Science, 2021, v. 138, n. 6, p. 1, doi. 10.1002/app.49801

By:

Zhang, Fan;
Li, Jinhui;
Wang, Tao;
Huang, Chao;
Ji, Fei;
Shan, Liang;
Zhang, Guoping;
Sun, Rong;
Wong, Ching‐ping

Publication type:

Article

Mechanical Properties of Cu-Core Solder Balls with ENEPIG Surface Finish.

Published in:

Journal of Electronic Materials, 2020, v. 49, n. 10, p. 6073, doi. 10.1007/s11664-020-08338-w

By:

Jeong, Haksan;
Lee, Choong-Jae;
Min, Kyung Deuk;
Son, Jae-yeol;
Jung, Seung-Boo

Publication type:

Article

Wafer-Level Hermetic Package by Low-Temperature Cu/Sn TLP Bonding with Optimized Sn Thickness.

Published in:

Journal of Electronic Materials, 2017, v. 46, n. 10, p. 6111, doi. 10.1007/s11664-017-5546-1

By:

Wu, Zijian;
Cai, Jian;
Wang, Qian;
Wang, Junqiang;
Wang, Dejun

Publication type:

Article

3D FEM Simulations of Drop Test Reliability on 3D-WLP: Effects of Solder Reflow Residual Stress and Molding Resin Parameters.

Published in:

Journal of Electronic Materials, 2014, v. 43, n. 3, p. 708, doi. 10.1007/s11664-013-2964-6

By:

Belhenini, Soufyane;
Tougui, Abdellah;
Bouchou, Abdelhake;
Mohan, Ranganathan;
Dosseul, Franck

Publication type:

Article

Investigation on Cu–Sn intermetallic compounds growth and signal transmission loss of the diverse copper lines after soldering in printed circuit board.

Published in:

Journal of Materials Science: Materials in Electronics, 2021, v. 32, n. 17, p. 22372, doi. 10.1007/s10854-021-06723-7

By:

Chen, Yuanming;
Zhang, Lingzhi;
Xu, Jiaying;
Fang, Jianrong;
You, Xiangqing;
Tan, Zhengdong;
Wang, Haiying;
Zhou, Guoyun;
Wang, Shouxu;
He, Wei;
Luo, Yuyao;
Ye, Yiling

Publication type:

Article

Experimental and theoretical investigation of bifurcated wafer warpage evolution in the wafer level packaging processes.

Published in:

Journal of Materials Science: Materials in Electronics, 2020, v. 31, n. 19, p. 16531, doi. 10.1007/s10854-020-04207-8

By:

Zhu, Chunsheng

Publication type:

Article

Effect of epoxy mold compound and package dimensions on the thermomechanical properties of a fan-out package.

Published in:

Journal of Materials Science: Materials in Electronics, 2020, v. 31, n. 9, p. 6835, doi. 10.1007/s10854-020-03243-8

By:

Jeong, Haksan;
Jung, Kwang-Ho;
Lee, Choong-Jae;
Min, Kyung Deuk;
Myung, Woo-Ram;
Jung, Seung-Boo

Publication type:

Article

C 波段宽带薄膜体声波滤波器设计及验证.

Published in:

Piezoelectrics & Acoustooptics, 2023, v. 45, n. 4, p. 535, doi. 10.11977/j.issn.1004-2474.2023.04.011

By:

蒋世义;
蒋平英;
马晋毅;
陈彦光;
徐阳;
刘娅;
徐溢

Publication type:

Article

C 波段 WLP 犠犔犘薄膜体声波滤波器的研制.

Published in:

Piezoelectrics & Acoustooptics, 2022, v. 44, n. 2, p. 260, doi. 10.11977/j.issn.1004-2474.2022.02.022

By:

刘娅;
孙科;
马晋毅;
谢征珍;
蒋平英;
杜雪松

Publication type:

Article

SAW 滤波器 WLP 封装中腔体抗模压塌陷研究 .

Published in:

Piezoelectrics & Acoustooptics, 2021, v. 43, n. 1, p. 84, doi. 10.11977/j.issn.1004-2474.2021.01.018

By:

唐代华;
金中;
司美菊;
罗旋升;
谢东峰;
谢晓

Publication type:

Article

一种基于WLP封装的声表面波滤波器.

Published in:

Piezoelectrics & Acoustooptics, 2020, v. 42, n. 4, p. 579, doi. 10.11977/j.issn.1004.2474.2020.04.031

By:

陈尚权;
吕翼;
赵雪梅;
董加和;
米佳;
陈彦光;
伍平

Publication type:

Article

声表面波器件晶圆键合工艺研究.

Published in:

Piezoelectrics & Acoustooptics, 2020, v. 42, n. 3, p. 361, doi. 10.11977/j.issn.1004-2474.2020.03.018

By:

卢丹丹;
米佳;
彭兴文;
谭昕怡;
金中

Publication type:

Article

Modeling of wave propagation in thin graphene sheets with WLP-FDTD method.

Published in:

Journal of Electromagnetic Waves & Applications, 2016, v. 30, n. 6, p. 780, doi. 10.1080/09205071.2016.1150210

By:

Chen, Wei-Jun;
Shao, Wei;
Quan, Jun;
Long, Shi-Yu

Publication type:

Article

Optimization of corn, rice and buckwheat formulations for gluten-free wafer production.

Published in:

Food Science & Technology International, 2016, v. 22, n. 5, p. 410, doi. 10.1177/1082013215610981

By:

Dogan, Ismail Sait;
Yildiz, Onder;
Meral, Raciye

Publication type:

Article

Demonstration of wafer-level light emitting diode with very high output power.

Published in:

Electronics Letters (Wiley-Blackwell), 2014, v. 50, n. 25, p. 1970

By:

Yibin Zhang;
Fei Xu;
Desheng Zhao;
Hongjuan Huang;
Wei Wang;
Jianwei Xu;
Yong Cai;
Guangyi Shi;
Guojun Lu;
Zhenlin Miao;
Yundong Qi;
Baoshun Zhang

Publication type:

Article

Design and Fabrication of Wafer-Level Microlens Array with Moth-Eye Antireflective Nanostructures.

Published in:

Nanomaterials (2079-4991), 2019, v. 9, n. 5, p. 747, doi. 10.3390/nano9050747

By:

Xie, Shuping;
Wan, Xinjun;
Yang, Bo;
Zhang, Wei;
Wei, Xiaoxiao;
Zhuang, Songlin

Publication type:

Article

Fabricating process of thin‐strain sensor by utilizing wafer‐level‐packaging techniques.

Published in:

Electronics & Communications in Japan, 2024, v. 107, n. 2, p. 1, doi. 10.1002/ecj.12450

By:

Aono, Takanori;
Kanamaru, Masatoshi;
Ikeda, Hiroshi

Publication type:

Article

Silicon migration seal wafer‐level vacuum encapsulation.

Published in:

Electronics & Communications in Japan, 2021, v. 104, n. 1, p. 120, doi. 10.1002/ecj.12283

By:

Suzuki, Yukio;
Dupuit, Victor;
Kojima, Toshiya;
Kanamori, Yoshiaki;
Tanaka, Shuji

Publication type:

Article

Investigation of Various Commonly Associated Imperfections in Radiofrequency Micro-Electro-Mechanical System Devices and its Empirical Modeling.

Published in:

IETE Journal of Research, 2023, v. 69, n. 4, p. 1995, doi. 10.1080/03772063.2021.1880342

By:

Karmakar, A.;
Biswas, B.;
Chauhan, A.K.

Publication type:

Article

Design and Electrical Characterization of Wafer-level Micro-package for GaAs-based RFMEMS Switches.

Published in:

IETE Journal of Research, 2013, v. 59, n. 3, p. 201, doi. 10.4103/0377-2063.116079

By:

Chaturvedi, Sandeep;
Sai Saravanan, G.;
Bhat, Mahadeva K.;
Bhalke, Sangam;
Badnikar, S. L.;
Muralidharan, R.;
Koul, Shiban K.

Publication type:

Article

Author Index Volume 29 (2020).

Published in:: Journal of Circuits, Systems & Computers, 2020, v. 29, n. 16, p. N.PAG, doi. 10.1142/S0218126620990017
Publication type:: Article

A Low-Loss and High-Isolation Transformer-Based mm-Wave SPDT with Integrated Fan-out Wafer Level Packaging.

Published in:

Journal of Circuits, Systems & Computers, 2020, v. 29, n. 7, p. N.PAG, doi. 10.1142/S0218126620501157

By:

Quan, Xing;
Luo, Jiang;
Su, Guodong;
Jing, Kai;
Zhan, Jinsong

Publication type:

Article

Mechanism research of negative resistance oscillations characteristics of the silicon magnetic sensitive transistor with long base region.

Published in:

International Journal of Modern Physics B: Condensed Matter Physics; Statistical Physics; Applied Physics, 2018, v. 32, n. 24, p. N.PAG, doi. 10.1142/S0217979218502612

By:

Bai, Yunjia;
Zhao, Xiaofeng;
Hao, Jiandong;
Wen, Dianzhong

Publication type:

Article

Adhesion and Interface Studies of the Structure‐Controlled Polyimide with Smooth Copper for High‐Frequency Communication.

Published in:

Advanced Materials Interfaces, 2022, v. 9, n. 5, p. 1, doi. 10.1002/admi.202101745

By:

Zhong, Ao;
Li, Jinhui;
Zhang, Guoping;
Sun, Rong

Publication type:

Article

Challenges: ESD Protection for Heterogeneously Integrated SoICs in Advanced Packaging.

Published in:

Electronics (2079-9292), 2024, v. 13, n. 12, p. 2341, doi. 10.3390/electronics13122341

By:

Pan, Zijin;
Li, Xunyu;
Hao, Weiquan;
Miao, Runyu;
Yue, Zijian;
Wang, Albert

Publication type:

Article

Research on Low-Insertion-Loss Packaging Materials for DC-6 GHz Attenuation Chips.

Published in:

Electronics (2079-9292), 2024, v. 13, n. 9, p. 1785, doi. 10.3390/electronics13091785

By:

Wei, Zhijie;
Yu, Shenglin;
Wei, Pengcheng

Publication type:

Article

Ultrathin Antenna-in-Package Based on TMV-Embedded FOWLP for 5G mm-Wave Applications.

Published in:

Electronics (2079-9292), 2024, v. 13, n. 5, p. 839, doi. 10.3390/electronics13050839

By:

Yin, Yuhang;
Xia, Chenhui;
Liu, Shuli;
Zhang, Zhimo;
Chen, Chen;
Wang, Gang;
Wang, Chenqian;
Wu, Yafei

Publication type:

Article

Synthesized Improvement of Die Fly and Die Shift Concerning the Wafer Molding Process for Ultrafine SAW Filter FOWLP.

Published in:

Electronics (2079-9292), 2023, v. 12, n. 9, p. 2073, doi. 10.3390/electronics12092073

By:

Li, Wei;
Yu, Daquan

Publication type:

Article

A True Process-Heterogeneous Stacked Embedded DRAM Structure Based on Wafer-Level Hybrid Bonding.

Published in:

Electronics (2079-9292), 2023, v. 12, n. 5, p. 1077, doi. 10.3390/electronics12051077

By:

Wang, Song;
Jiang, Xiping;
Bai, Fujun;
Xiao, Wenwu;
Long, Xiaodong;
Ren, Qiwei;
Kang, Yi

Publication type:

Article

Optimization of TSV Leakage in Via-Middle TSV Process for Wafer-Level Packaging.

Published in:

Electronics (2079-9292), 2021, v. 10, n. 19, p. 2370, doi. 10.3390/electronics10192370

By:

Liu, Xuanjie;
Sun, Qingqing;
Huang, Yiping;
Chen, Zheng;
Liu, Guoan;
Zhang, David Wei

Publication type:

Article

Design and Implementation of RF Front-End Module Based on 3D Heterogenous-Integrated Wafer-Level Packaging.

Published in:

Electronics (2079-9292), 2021, v. 10, n. 16, p. 1893, doi. 10.3390/electronics10161893

By:

Yu, Faxin;
Zhou, Qi;
Wang, Zhiyu;
Mo, Jiongjiong;
Chen, Hua

Publication type:

Article

All-in-One Wafer-Level Solution for MMIC Automatic Testing.

Published in:

Electronics (2079-9292), 2018, v. 7, n. 5, p. 57, doi. 10.3390/electronics7050057

By:

Ding, Xu;
Wang, Zhiyu;
Liu, Jiarui;
Zhou, Min;
Chen, Wei;
Chen, Hua;
Mo, Jiongjiong;
Yu, Faxin

Publication type:

Article

Plasma dicing before grinding process for highly reliable singulation of low-profile and large die sizes in advanced packages.

Published in:

Micro & Nano Systems Letters, 2023, v. 11, n. 1, p. 1, doi. 10.1186/s40486-023-00183-w

By:

Kim, Keunhoi;
Park, Jongcheol;
Kim, Kyoungmin;
Kim, TaeHyun;
Kwon, SooHyun;
Na, Yeeun

Publication type:

Article

FACTORS AFFECTING FARMERS' DESIRE TO CHANGE THE CULTIVATION PATTERN (MEDICINAL PLANTS CULTIVATION).

Published in:

Scientific Papers Series Management, Economic Engineering in Agriculture & Rural Development, 2021, v. 21, n. 3, p. 805

By:

YAQUBI, Roqu;
EBRAHIMI, Mohammad Sadegh;
YAQUBI, Fatme

Publication type:

Article

Design of New Au–NiCo MEMS Vertical Probe for Fine-Pitch Wafer-Level Probing.

Published in:

Crystals (2073-4352), 2021, v. 11, n. 5, p. 485, doi. 10.3390/cryst11050485

By:

Le, Xuan Luc;
Choa, Sung-Hoon;
Lee, Ji-Hoon

Publication type:

Article

Hybrid Bright-Dark-Field Microscopic Fringe Projection System for Cu Pillar Height Measurement in Wafer-Level Package.

Published in:

Sensors (14248220), 2024, v. 24, n. 16, p. 5157, doi. 10.3390/s24165157

By:

Wang, Dezhao;
Zhou, Weihu;
Zhang, Zili;
Meng, Fanchang

Publication type:

Article

Development of a Reliable High-Performance WLP for a SAW Device.

Published in:

Sensors (14248220), 2022, v. 22, n. 15, p. 5760, doi. 10.3390/s22155760

By:

Chen, Zuohuan;
Yu, Daquan

Publication type:

Article

A Novel High-Q Dual-Mass MEMS Tuning Fork Gyroscope Based on 3D Wafer-Level Packaging.

Published in:

Sensors (14248220), 2021, v. 21, n. 19, p. 6428, doi. 10.3390/s21196428

By:

Xu, Pengfei;
Si, Chaowei;
He, Yurong;
Wei, Zhenyu;
Jia, Lu;
Han, Guowei;
Ning, Jin;
Yang, Fuhua

Publication type:

Article

Wafer-Level-Based Open-Circuit Sensitivity Model from Theoretical ALEM and Empirical OSCM Parameters for a Capacitive MEMS Acoustic Sensor.

Published in:

Sensors (14248220), 2019, v. 19, n. 3, p. 488, doi. 10.3390/s19030488

By:

Lee, Jaewoo;
Im, Jong-Pil;
Kim, Jeong-Hun;
Lim, Sol-Yee;
Moon, Seung-Eon

Publication type:

Article

A Lateral Differential Resonant Pressure Microsensor Based on SOI-Glass Wafer-Level Vacuum Packaging.

Published in:

Sensors (14248220), 2015, v. 15, n. 9, p. 24257, doi. 10.3390/s150924257

By:

Bo Xie;
Yonghao Xing;
Yanshuang Wang;
Jian Chen;
Deyong Chen;
Junbo Wang

Publication type:

Article

TRAINING CALENDAR.

Published in:

2024

By:

Ring, Rosalinda M.

Publication type:

Calendar

TRAINING CALENDAR.

Published in:: 2023
Publication type:: Calendar