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Fabricating process of thin‐strain sensor by utilizing wafer‐level‐packaging techniques.
- Published in:
- Electronics & Communications in Japan, 2024, v. 107, n. 2, p. 1, doi. 10.1002/ecj.12450
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- Publication type:
- Article
Research on Low-Insertion-Loss Packaging Materials for DC-6 GHz Attenuation Chips.
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- Electronics (2079-9292), 2024, v. 13, n. 9, p. 1785, doi. 10.3390/electronics13091785
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- Publication type:
- Article
Size Effects of Au/Ni-Coated Polymer Particles on the Electrical Performance of Anisotropic Conductive Adhesive Films under Flexible Mechanical Conditions.
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- Materials (1996-1944), 2024, v. 17, n. 7, p. 1658, doi. 10.3390/ma17071658
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- Article
Research on the Reliability of Advanced Packaging under Multi-Field Coupling: A Review.
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- Micromachines, 2024, v. 15, n. 4, p. 422, doi. 10.3390/mi15040422
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- Publication type:
- Article
Ultrathin Antenna-in-Package Based on TMV-Embedded FOWLP for 5G mm-Wave Applications.
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- Electronics (2079-9292), 2024, v. 13, n. 5, p. 839, doi. 10.3390/electronics13050839
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- Article
Graphene‐Based Silicon Photonic Devices for Optical Interconnects.
- Published in:
- Advanced Functional Materials, 2024, v. 34, n. 9, p. 1, doi. 10.1002/adfm.202307461
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- Article
TRAINING CALENDAR.
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- 2024
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- Publication type:
- Calendar
Cavity-depth Effect on 3D Wafer-level-packaged MEMS Resonators by Slide-film Damping.
- Published in:
- Sensors & Materials, 2024, v. 36, n. 2, Part 1, p. 415, doi. 10.18494/SAM4707
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- Publication type:
- Article
Plasma dicing before grinding process for highly reliable singulation of low-profile and large die sizes in advanced packages.
- Published in:
- Micro & Nano Systems Letters, 2023, v. 11, n. 1, p. 1, doi. 10.1186/s40486-023-00183-w
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- Article
TRAINING CALENDAR.
- Published in:
- 2023
- Publication type:
- Calendar
Research on Packaging Reliability and Quality Factor Degradation Model for Wafer-Level Vacuum Sealing MEMS Gyroscopes.
- Published in:
- Micromachines, 2023, v. 14, n. 10, p. 1956, doi. 10.3390/mi14101956
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- Article
C 波段宽带薄膜体声波滤波器设计及验证.
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- Piezoelectrics & Acoustooptics, 2023, v. 45, n. 4, p. 535, doi. 10.11977/j.issn.1004-2474.2023.04.011
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- Publication type:
- Article
Three-Dimensional Integrated Fan-Out Wafer-Level Package Micro-Bump Electromigration Study.
- Published in:
- Micromachines, 2023, v. 14, n. 6, p. 1255, doi. 10.3390/mi14061255
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- Publication type:
- Article
Synthesized Improvement of Die Fly and Die Shift Concerning the Wafer Molding Process for Ultrafine SAW Filter FOWLP.
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- Electronics (2079-9292), 2023, v. 12, n. 9, p. 2073, doi. 10.3390/electronics12092073
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- Publication type:
- Article
Exploring the Influence of Material Properties of Epoxy Molding Compound on Wafer Warpage in Fan-Out Wafer-Level Packaging.
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- Materials (1996-1944), 2023, v. 16, n. 9, p. 3482, doi. 10.3390/ma16093482
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- Publication type:
- Article
Room-temperature bonding of Al<sub>2</sub>O<sub>3</sub> thin films deposited using atomic layer deposition.
- Published in:
- Scientific Reports, 2023, v. 13, n. 1, p. 1, doi. 10.1038/s41598-023-30376-7
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- Publication type:
- Article
A True Process-Heterogeneous Stacked Embedded DRAM Structure Based on Wafer-Level Hybrid Bonding.
- Published in:
- Electronics (2079-9292), 2023, v. 12, n. 5, p. 1077, doi. 10.3390/electronics12051077
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- Publication type:
- Article
Research on Defect Inspection Technology for Bump Height in Wafer-Level Packaging Based on the Triangulation Method.
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- Applied Sciences (2076-3417), 2023, v. 13, n. 3, p. 1997, doi. 10.3390/app13031997
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- Publication type:
- Article
Paradigm Changing Integration Technology for the Production of Flexible Electronics by Transferring Structures, Dies and Electrical Components from Rigid to Flexible Substrates.
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- Micromachines, 2023, v. 14, n. 2, p. 415, doi. 10.3390/mi14020415
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- Publication type:
- Article
Development and Characterization of Low Temperature Wafer-Level Vacuum Packaging Using Cu-Sn Bonding and Nanomultilayer Getter.
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- Micromachines, 2023, v. 14, n. 2, p. 448, doi. 10.3390/mi14020448
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- Publication type:
- Article
Prevention of Cu Electrolytic Migration Defects on RDL by a Cu-Selective Passivation to Enhance Reliability.
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- Journal of Microelectronic & Electronic Packaging, 2023, v. 20, n. 1, p. 17, doi. 10.4071/imaps.1903845
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- Publication type:
- Article
Wafer-level vapor cells filled with laser-actuated hermetic seals for integrated atomic devices.
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- Microsystems & Nanoengineering, 2022, v. 8, n. 1, p. 1, doi. 10.1038/s41378-022-00468-x
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- Publication type:
- Article
링 공진기의 체배종속적 전류분포 해석을 통한Molding Compound의 광대역 유전율 측정 방법 연구.
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- Journal of Korean Institute of Electromagnetic Engineering & Science / Han-Guk Jeonjapa Hakoe Nonmunji, 2022, v. 33, n. 12, p. 901, doi. 10.5515/KJKIEES.2022.33.12.901
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- Article
Research on a MEMS Microparticles Vacuum Chamber for Optical Levitation with a Built-In Vacuum Gauge.
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- Photonics, 2022, v. 9, n. 12, p. 911, doi. 10.3390/photonics9120911
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- Publication type:
- Article
Development of a Reliable High-Performance WLP for a SAW Device.
- Published in:
- Sensors (14248220), 2022, v. 22, n. 15, p. 5760, doi. 10.3390/s22155760
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- Publication type:
- Article
Predicting Wafer-Level Package Reliability Life Using Mixed Supervised and Unsupervised Machine Learning Algorithms.
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- Materials (1996-1944), 2022, v. 15, n. 11, p. 3897, doi. 10.3390/ma15113897
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- Publication type:
- Article
Wafer-Level Vacuum-Packaged Electric Field Microsensor: Structure Design, Theoretical Model, Microfabrication, and Characterization.
- Published in:
- Micromachines, 2022, v. 13, n. 6, p. 928, doi. 10.3390/mi13060928
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- Publication type:
- Article
Design and development of broadband DC-10 GHz packaged RF MEMS switches with on chip CPW-microstrip transitions.
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- Sādhanā: Academy Proceedings in Engineering Sciences, 2022, v. 47, n. 2, p. 1, doi. 10.1007/s12046-022-01813-6
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- Article
Editorial for the Special Issue "MEMS Packaging Technologies and 3D Integration".
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- 2022
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- Publication type:
- Editorial
Glass Frit Jetting for Advanced Wafer-Level Hermetic Packaging.
- Published in:
- Materials (1996-1944), 2022, v. 15, n. 8, p. N.PAG, doi. 10.3390/ma15082786
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- Publication type:
- Article
C 波段 WLP 犠犔犘薄膜体声波滤波器的研制.
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- Piezoelectrics & Acoustooptics, 2022, v. 44, n. 2, p. 260, doi. 10.11977/j.issn.1004-2474.2022.02.022
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- Publication type:
- Article
Application of the surface planer process to Cu pillars and wafer support tape for high-coplanarity wafer-level packaging.
- Published in:
- International Journal of Advanced Manufacturing Technology, 2022, v. 119, n. 5/6, p. 3427, doi. 10.1007/s00170-021-08622-x
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- Article
Investigation of Warpage for Multi-Die Fan-Out Wafer-Level Packaging Process.
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- Materials (1996-1944), 2022, v. 15, n. 5, p. 1683, doi. 10.3390/ma15051683
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- Publication type:
- Article
Adhesion and Interface Studies of the Structure‐Controlled Polyimide with Smooth Copper for High‐Frequency Communication.
- Published in:
- Advanced Materials Interfaces, 2022, v. 9, n. 5, p. 1, doi. 10.1002/admi.202101745
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- Article
Around the Circuit.
- Published in:
- Microwave Journal, 2022, v. 65, n. 2, p. 58
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- Publication type:
- Article
Optimization of TSV Leakage in Via-Middle TSV Process for Wafer-Level Packaging.
- Published in:
- Electronics (2079-9292), 2021, v. 10, n. 19, p. 2370, doi. 10.3390/electronics10192370
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- Publication type:
- Article
A Novel High-Q Dual-Mass MEMS Tuning Fork Gyroscope Based on 3D Wafer-Level Packaging.
- Published in:
- Sensors (14248220), 2021, v. 21, n. 19, p. 6428, doi. 10.3390/s21196428
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- Publication type:
- Article
An Overview of AI-Assisted Design-on-Simulation Technology for Reliability Life Prediction of Advanced Packaging.
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- Materials (1996-1944), 2021, v. 14, n. 18, p. 5342, doi. 10.3390/ma14185342
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- Publication type:
- Article
Investigation on Cu–Sn intermetallic compounds growth and signal transmission loss of the diverse copper lines after soldering in printed circuit board.
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- Journal of Materials Science: Materials in Electronics, 2021, v. 32, n. 17, p. 22372, doi. 10.1007/s10854-021-06723-7
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- Publication type:
- Article
Solder Joint Reliability Risk Estimation by AI-Assisted Simulation Framework with Genetic Algorithm to Optimize the Initial Parameters for AI Models.
- Published in:
- Materials (1996-1944), 2021, v. 14, n. 17, p. 4835, doi. 10.3390/ma14174835
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- Publication type:
- Article
Design and Implementation of RF Front-End Module Based on 3D Heterogenous-Integrated Wafer-Level Packaging.
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- Electronics (2079-9292), 2021, v. 10, n. 16, p. 1893, doi. 10.3390/electronics10161893
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- Publication type:
- Article
Cadence AWR Design Environment Version 16 Enables Integration of Heterogenous Technologies.
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- Microwave Journal, 2021, v. 64, n. 7, p. 38
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- Publication type:
- Article
Large‐Scale Fabrication of Surface Ion Traps on a 300 mm Glass Wafer.
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- Physica Status Solidi (B), 2021, v. 258, n. 7, p. 1, doi. 10.1002/pssb.202000589
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- Article
FACTORS AFFECTING FARMERS' DESIRE TO CHANGE THE CULTIVATION PATTERN (MEDICINAL PLANTS CULTIVATION).
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- Scientific Papers Series Management, Economic Engineering in Agriculture & Rural Development, 2021, v. 21, n. 3, p. 805
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- Publication type:
- Article
Design of New Au–NiCo MEMS Vertical Probe for Fine-Pitch Wafer-Level Probing.
- Published in:
- Crystals (2073-4352), 2021, v. 11, n. 5, p. 485, doi. 10.3390/cryst11050485
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- Publication type:
- Article
SECURITY ASSESSMENT OF IC PACKAGING AGAINST OPTICAL ATTACKS.
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- Electronic Device Failure Analysis, 2021, v. 23, n. 2, p. 4, doi. 10.31399/asm.edfa.2021-2.p004
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- Publication type:
- Article
Silicon migration seal wafer‐level vacuum encapsulation.
- Published in:
- Electronics & Communications in Japan, 2021, v. 104, n. 1, p. 120, doi. 10.1002/ecj.12283
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- Publication type:
- Article
Reliability Evaluation of Fan-Out Type 3D Packaging-On-Packaging.
- Published in:
- Micromachines, 2021, v. 12, n. 3, p. 295, doi. 10.3390/mi12030295
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- Publication type:
- Article
Fluorinated graphene/polyimide nanocomposites for advanced electronic packaging applications.
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- Journal of Applied Polymer Science, 2021, v. 138, n. 6, p. 1, doi. 10.1002/app.49801
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- Publication type:
- Article
SAW 滤波器 WLP 封装中腔体抗模压塌陷研究 .
- Published in:
- Piezoelectrics & Acoustooptics, 2021, v. 43, n. 1, p. 84, doi. 10.11977/j.issn.1004-2474.2021.01.018
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- Publication type:
- Article