Electrochemical etching of macropores in silicon with grooved etch seeds.
- Published in:
- Semiconductors, 2008, v. 42, n. 6, p. 746, doi. 10.1134/S1063782608060183
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- Publication type:
- Article
Works matching DE "VIA (Electricity)"
Results: 7
1
2
Zinc and Tin-Zinc Via-Filling for the Formation of Through-Silicon Vias in a System-in-Package.
- Published in:
- Journal of Electronic Materials, 2009, v. 38, n. 5, p. 685, doi. 10.1007/s11664-008-0646-6
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- Publication type:
- Article
3
High Shear Speed Characteristics of Sub-100 μm Low Alpha SAC105 Solder Bump Directly Fabricated on Cu Filled Through Si Via for 3D Integration.
- Published in:
- Journal of Microelectronic & Electronic Packaging, 2015, v. 12, n. 3, p. 161, doi. 10.4071/imaps.416
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- Publication type:
- Article
4
Impact of Grain Structure and Material Properties on Via Extrusion in 3D Interconnects.
- Published in:
- Journal of Microelectronic & Electronic Packaging, 2015, v. 12, n. 3, p. 118, doi. 10.4071/imaps.456
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- Publication type:
- Article
5
Studying the Impact of Return Current Path on the EM Simulation of High-Speed Package and Board Designs.
- Published in:
- Journal of Microelectronic & Electronic Packaging, 2012, v. 9, n. 2, p. 52, doi. 10.4071/imaps.318
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- Publication type:
- Article
6
Through-Silicon-Via Pairs Modelling via Compressed Sensing.
- Published in:
- PIERS Proceedings, 2014, p. 2496
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- Publication type:
- Article
7
Fabrication of resonator--quantum well infrared photodetector focal plane array by inductively coupled plasma etching.
- Published in:
- Optical Engineering, 2016, v. 55, n. 2, p. 1, doi. 10.1117/1.OE.55.2.026119
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- Publication type:
- Article