Works matching DE "TIN compounds"

Results: 634

Fabrication of Sn nanostructures by template assisted pulse electrodeposition.

Published in:

Surface Engineering, 2016, v. 32, n. 5, p. 378, doi. 10.1179/1743294415Y.0000000091

By:

Sharma, A.;
Bhattacharya, S.;
Das, S.;
Das, K.

Publication type:

Article

Tuning the π‐Accepting Properties of Mesoionic Carbenes: A Combined Computational and Experimental Study.

Published in:

Chemistry - A European Journal, 2021, v. 27, n. 46, p. 11983, doi. 10.1002/chem.202101742

By:

Dong, Zhaowen;
Blaskovits, J. Terence;
Fadaei‐Tirani, Farzaneh;
Scopelliti, Rosario;
Sienkiewicz, Andrzej;
Corminboeuf, Clémence;
Severin, Kay

Publication type:

Article

Cover Feature: Undiscovered Potential: Ge Catalysts for Lactide Polymerization (Chem. Eur. J. 1/2020).

Published in:

Chemistry - A European Journal, 2020, v. 26, n. 1, p. 3, doi. 10.1002/chem.201904774

By:

Rittinghaus, Ruth D.;
Tremmel, Jakub;
Růžička, Ales;
Conrads, Christian;
Albrecht, Pascal;
Hoffmann, Alexander;
Ksiazkiewicz, Agnieszka N.;
Pich, Andrij;
Jambor, Roman;
Herres‐Pawlis, Sonja

Publication type:

Article

Cluster Fusion: Face-Fused Nine-Atom Deltahedral Clusters in [Sn14Ni(CO)]4−.

Published in:

Angewandte Chemie, 2016, v. 128, n. 23, p. 6833, doi. 10.1002/ange.201602837

By:

Perla, Luis G.;
Sevov, Slavi C.

Publication type:

Article

Synthesis and characterization of the ultra-thin SnS flakes and the micron-thick SnS crystals by chemical vapor deposition.

Published in:

Journal of Materials Science: Materials in Electronics, 2019, v. 30, n. 11, p. 10879, doi. 10.1007/s10854-019-01431-9

By:

Yu, Daizhe;
Li, Qiu;
Wei, Aixiang;
Zhao, Yu;
Liu, Jun;
Xiao, Zhiming

Publication type:

Article

Shear strength between Sn–3.0Ag–0.5Cu solders and Cu substrate after two solid-state aging processes for fan-out package process applications.

Published in:

Journal of Materials Science: Materials in Electronics, 2019, v. 30, n. 11, p. 10550, doi. 10.1007/s10854-019-01399-6

By:

Park, Hwan-Pil;
Seo, Gwancheol;
Kim, Sungcheol;
Ahn, Key-one;
Kim, Young-Ho

Publication type:

Article

Synthesis, physical and semiconducting properties of SnS2 prepared by chemical route.

Published in:

Journal of Materials Science: Materials in Electronics, 2019, v. 30, n. 1, p. 687, doi. 10.1007/s10854-018-0337-x

By:

Kabouche, S.;
Louafi, Y.;
Bardeau, J.-F.;
Trari, M.

Publication type:

Article

Eco-friendly and non-toxic thin film solar cell employing spray pyrolysed p-CZTS and n-SnS:Cu—a novel approach.

Published in:

Journal of Materials Science: Materials in Electronics, 2018, v. 29, n. 23, p. 20455, doi. 10.1007/s10854-018-0179-6

By:

Ninan, Gisa Grace;
Rajesh Menon, M. R.;
Geethu, R.;
Deepu, D. R.;
SudhaKartha, C.;
Vijayakumar, K. P.

Publication type:

Article

Facile hydrothermally synthesis of hexagon tin disulfide nanosheets for high-performance photocatalytic hydrogen generation.

Published in:

Journal of Materials Science: Materials in Electronics, 2018, v. 29, n. 23, p. 19614, doi. 10.1007/s10854-018-0164-0

By:

Hu, Yiwei;
Chen, Xinhang;
Ren, Xiaohui;
Huang, Zongyu;
Qi, Xiang;
Zhong, Jianxin

Publication type:

Article

Effects of In addition on the wettability, interfacial characterization and properties of ternary Sn-Cu-Ni solders.

Published in:

Journal of Materials Science: Materials in Electronics, 2018, v. 29, n. 21, p. 18840, doi. 10.1007/s10854-018-0009-x

By:

Hu, Xiaowu;
Lai, Yanqing;
Jiang, Xiongxin;
Li, Yulong

Publication type:

Article

Fabrication and investigation of high performance CNT-incorporated tin-oxide supercapacitor.

Published in:

Journal of Materials Science: Materials in Electronics, 2018, v. 29, n. 9, p. 7468, doi. 10.1007/s10854-018-8738-4

By:

Abdollahi, Hassan;
Samkan, Mahmoud;
Mohajerzadeh, Mohammad Ala;
Sanaee, Zeinab;
Mohajerzadeh, Shams

Publication type:

Article

Microstructure, hardness, and shear behavior of the as-soldered SnBi-SAC composite solder pastes.

Published in:

Journal of Materials Science: Materials in Electronics, 2017, v. 28, n. 24, p. 19113, doi. 10.1007/s10854-017-7866-6

By:

Liu, Yang;
Fu, Haifeng;
Zhang, Hao;
Sun, Fenglian;
Wang, Xuan;
Zhang, Guoqi

Publication type:

Article

Facile synthesis of a symmetrical squarylium dye sensitized SnInS composites with enhanced photocatalytic activity under visible-light irradiation.

Published in:

Journal of Materials Science: Materials in Electronics, 2017, v. 28, n. 21, p. 15987, doi. 10.1007/s10854-017-7497-y

By:

Lu, Min;
Wang, Xinyu;
Zhang, Yuzhe;
Li, Zhongyu;
Xu, Song;
Yao, Chao

Publication type:

Article

Effect of indium addition on interfacial IMC growth and bending properties of eutectic Sn-0.7Cu solder joints.

Published in:

Journal of Materials Science: Materials in Electronics, 2017, v. 28, n. 21, p. 16120, doi. 10.1007/s10854-017-7512-3

By:

Tian, Shuang;
Li, Saipeng;
Zhou, Jian;
Xue, Feng;
Cao, Ruihua;
Wang, Fengjiang

Publication type:

Article

Fabrication of CuZnSnS thin films by simple solution method using citric acid as complexing agent.

Published in:

Journal of Materials Science: Materials in Electronics, 2017, v. 28, n. 19, p. 14424, doi. 10.1007/s10854-017-7303-x

By:

Guan, Hao;
Shen, Honglie;
Wang, Wei

Publication type:

Article

Infleunce of molar concentration on ethylene diamine tetra acetic acid (EDTA) added to tin sulfide (SnS) thin films grown by silar method.

Published in:

Journal of Materials Science: Materials in Electronics, 2017, v. 28, n. 18, p. 13602, doi. 10.1007/s10854-017-7200-3

By:

Mani, P.;
Manikandan, K.;
prince, J.

Publication type:

Article

Effects of Sn doping on the microstructure and dielectric and ferroelectric properties of Ba(ZrTi)O ceramics.

Published in:

Journal of Materials Science: Materials in Electronics, 2017, v. 28, n. 11, p. 8177, doi. 10.1007/s10854-017-6526-1

By:

Fu, Xizhi;
Cai, Wei;
Cheng, Gang;
Gao, Rongli

Publication type:

Article

Microwave synthesis of 2D SnO nanosheets: effects of annealing temperatures on their thermoelectric properties.

Published in:

Journal of Materials Science: Materials in Electronics, 2017, v. 28, n. 4, p. 3598, doi. 10.1007/s10854-016-5961-8

By:

Salah, Numan;
AL-Shawafi, Waleed;
Alshahrie, Ahmed;
Habib, Sami;
Azam, Ameer

Publication type:

Article

Electrical characterization of SnSbS thin films by impedance spectroscopy.

Published in:

Journal of Materials Science: Materials in Electronics, 2016, v. 27, n. 5, p. 4326, doi. 10.1007/s10854-016-4300-4

By:

Trabelsi, Imen;
Jebali, Ahlem;
Kanzari, Mounir

Publication type:

Article

Effect of Fe doping on structural, optical and photocatalytic activity of WO nanostructured thin films.

Published in:

Journal of Materials Science: Materials in Electronics, 2016, v. 27, n. 2, p. 1847, doi. 10.1007/s10854-015-3963-6

By:

Ramkumar, S.;
Rajarajan, G.

Publication type:

Article

Synthesis and characterization of Sn-doped β-GaO nano- and micrometer particles by chemical vapor deposition.

Published in:

Journal of Materials Science: Materials in Electronics, 2016, v. 27, n. 1, p. 942, doi. 10.1007/s10854-015-3837-y

By:

Wei, Jiyong;
Shi, Feng

Publication type:

Article

A novel nano-Sn particle/poly(3,4-ethylenedioxythiophene):poly(styrenesulfonate)/poly(vinyl alcohol) core-shell hierarchical composite as high-performance anode material for lithium ion batteries.

Published in:

Journal of Materials Science: Materials in Electronics, 2015, v. 26, n. 10, p. 7523, doi. 10.1007/s10854-015-3388-2

By:

Ma, Daqian;
Bi, Peng;
Meng, Haowen;
Yu, Xiaohui;
Dou, Peng;
Yang, Hongyan;
Sun, Yanli;
Cao, Zhenzhen;
Zheng, Jiao;
Wang, Chao;
Xu, Xinhua

Publication type:

Article

Microstructures and properties of Sn58Bi, Sn35Bi0.3Ag, Sn35Bi1.0Ag solder and solder joints.

Published in:

Journal of Materials Science: Materials in Electronics, 2015, v. 26, n. 10, p. 7629, doi. 10.1007/s10854-015-3400-x

By:

Zhang, Liang;
Sun, Lei;
Guo, Yong-huan

Publication type:

Article

Structural and electrical properties of the new sulfosalt SnSbS thin films prepared by vacuum thermal evaporation.

Published in:

Journal of Materials Science: Materials in Electronics, 2015, v. 26, n. 10, p. 7763, doi. 10.1007/s10854-015-3422-4

By:

Trabelsi, I.;
Ben Mehrez, N.;
Kanzari, M.

Publication type:

Article

Effect of TiO nanoparticle addition and cooling rate on microstructure and mechanical properties of novel Sn1.5Sb0.7Cu solders.

Published in:

Journal of Materials Science: Materials in Electronics, 2015, v. 26, n. 6, p. 3493, doi. 10.1007/s10854-015-2860-3

By:

Huang, C.;
Chen, Chin-Hsin;
Chang, S.;
Tsao, L.;
Chen, R.

Publication type:

Article

Highly-efficient quantum dot-sensitized solar cells based on Sn doped ZnO and CuS electrodes.

Published in:

Journal of Materials Science: Materials in Electronics, 2015, v. 26, n. 4, p. 2145, doi. 10.1007/s10854-014-2660-1

By:

Tan, Jie;
Shen, Yue;
Zhang, Zongkun;
Wu, Qishuang;
Gu, Feng;
Cao, Meng;
Wang, Linjun

Publication type:

Article

Prospect for SnSbS (n = 1, m = 1, 2, 3) sulfosalt compounds.

Published in:

Journal of Materials Science: Materials in Electronics, 2015, v. 26, n. 4, p. 2002, doi. 10.1007/s10854-014-2531-9

By:

Ben Rabeh, Mohamed;
Khedmi, N.;
Kanzari, Mounir

Publication type:

Article

Effects of Zn concentration on the aging reactions and IMC massive spalling phenomenon in the Sn-58Bi- xZn/Cu system.

Published in:

Journal of Materials Science: Materials in Electronics, 2015, v. 26, n. 3, p. 1338, doi. 10.1007/s10854-014-2544-4

By:

Ma, Dongliang;
Wu, Ping

Publication type:

Article

Interfacial reaction and mechanical properties between low melting temperature Sn-58Bi solder and various surface finishes during reflow reactions.

Published in:

Journal of Materials Science: Materials in Electronics, 2015, v. 26, n. 3, p. 1649, doi. 10.1007/s10854-014-2589-4

By:

Lee, Sang-Min;
Yoon, Jeong-Won;
Jung, Seung-Boo

Publication type:

Article

Effects of minor Bi, Ni on the wetting properties, microstructures, and shear properties of Sn-0.7Cu lead-free solder joints.

Published in:

Journal of Materials Science: Materials in Electronics, 2015, v. 26, n. 3, p. 1572, doi. 10.1007/s10854-014-2577-8

By:

Shen, Jun;
Pu, Yayun;
Wu, Dong;
Tang, Qin;
Zhao, Mali

Publication type:

Article

Enhancement of mean-time-to-failure of Sn3.0Ag0.5Cu solder bump joint under current stressing via controlling bump shape.

Published in:

Journal of Materials Science: Materials in Electronics, 2015, v. 26, n. 3, p. 1940, doi. 10.1007/s10854-014-2633-4

By:

Chen, Ping;
Zhao, Xiuchen;
Wang, Yong;
Liu, Ying;
Li, Hong;
Gu, Yue

Publication type:

Article

Effects of rare earth Ce addition on the microstructure, wettability and interfacial reactions of eutectic Sn-0.7Cu solder.

Published in:

Journal of Materials Science: Materials in Electronics, 2015, v. 26, n. 1, p. 345, doi. 10.1007/s10854-014-2406-0

By:

Zhao, N.;
Huang, M.;
Zhong, Y.;
Ma, H.;
Pan, X.

Publication type:

Article

Effects of temperature and strain rate on mechanical behavior of low-silver lead-free solder under drop impact.

Published in:

Journal of Materials Science: Materials in Electronics, 2015, v. 26, n. 1, p. 601, doi. 10.1007/s10854-014-2441-x

By:

Niu, Xiao-Yan;
Li, Wei;
Wang, Gui-Xiang;
Shu, Xue-Feng

Publication type:

Article

Effect of BaTiO on the microstructure and mechanical properties of Sn1.0Ag0.5Cu lead-free solder.

Published in:

Journal of Materials Science: Materials in Electronics, 2015, v. 26, n. 1, p. 613, doi. 10.1007/s10854-014-2443-8

By:

Yang, Li;
Ge, Jinguo;
Zhang, Yaocheng;
Dai, Jun;
Jing, Yanfeng

Publication type:

Article

Investigation on the intermetallic compound layer growth of SnZnGa/SnZnGaNd solder joints.

Published in:

Journal of Materials Science: Materials in Electronics, 2014, v. 25, n. 10, p. 4219, doi. 10.1007/s10854-014-2152-3

By:

Xue, Peng;
Xue, Song-bai;
Shen, Yi-fu;
Long, Fei;
Zhu, Hong

Publication type:

Article

A study of Ag additive methods by comparing mechanical properties between Sn57.6Bi0.4Ag and 0.4 wt% nano-Ag-doped Sn58Bi BGA solder joints.

Published in:

Journal of Materials Science: Materials in Electronics, 2014, v. 25, n. 10, p. 4380, doi. 10.1007/s10854-014-2177-7

By:

Sun, Huayu;
Li, Qingqian;
Chan, Y.

Publication type:

Article

Reliability of SnAgCu/SnAgCuCe solder joints with different heights for electronic packaging.

Published in:

Journal of Materials Science: Materials in Electronics, 2014, v. 25, n. 10, p. 4489, doi. 10.1007/s10854-014-2192-8

By:

Zhang, Liang;
Han, Ji-guang;
Guo, Yong-huan;
Sun, Lei

Publication type:

Article

Investigation on high temperature mechanical fatigue failure behavior of SnAgCu/Cu solder joint.

Published in:

Journal of Materials Science: Materials in Electronics, 2014, v. 25, n. 3, p. 1429, doi. 10.1007/s10854-014-1746-0

By:

Zhu, Yongxin;
Li, Xiaoyan;
Wang, Chao;
Gao, Ruiting

Publication type:

Article

Growth behavior of interfacial Cu-Sn intermetallic compounds of Sn/Cu reaction couples during dip soldering and aging.

Published in:

Journal of Materials Science: Materials in Electronics, 2014, v. 25, n. 2, p. 936, doi. 10.1007/s10854-013-1667-3

By:

Hu, Xiaowu;
Ke, Zunrong

Publication type:

Article

Corrosion behavior of pure tin deposit under 55 °C/85 % RH reliability test.

Published in:

Journal of Materials Science: Materials in Electronics, 2014, v. 25, n. 1, p. 317, doi. 10.1007/s10854-013-1588-1

By:

Yeh, Min-Chi;
Li, Jyun;
Lo, Pei;
Yu, Rick;
Yu, Cheng-Fu;
Hsieh, Ker-Chang

Publication type:

Article

Microstructural characterization and mechanical properties of microplasma oxidized TiO/Ti joints soldered using Sn3.5Ag4Ti(Ce) active filler.

Published in:

Journal of Materials Science: Materials in Electronics, 2014, v. 25, n. 1, p. 233, doi. 10.1007/s10854-013-1577-4

By:

Tsao, L.

Publication type:

Article

PVD grown SnS thin films onto different substrate surfaces.

Published in:

Journal of Materials Science: Materials in Electronics, 2013, v. 24, n. 12, p. 4739, doi. 10.1007/s10854-013-1468-8

By:

Revathi, N.;
Bereznev, S.;
Iljina, J.;
Safonova, M.;
Mellikov, E.;
Volobujeva, O.

Publication type:

Article

Synthesis and characterization of Sn1Mg1−xO2 thin films fabricated by aero-sole assisted chemical vapor deposition.

Published in:

Journal of Materials Science: Materials in Electronics, 2013, v. 24, n. 12, p. 5140, doi. 10.1007/s10854-013-1536-0

By:

Farooq, W. Aslam;
Ali, Syed Mansoor;
Muhammad, Jan;
Ali, Syed Danish;
Aziz, Muhammad Hammad;
Rehman, Naeem-ur;
Hussain, Muhammad

Publication type:

Article

Synthesis and characterization of SnS/ZnO nanocomposite by chemical method.

Published in:

Journal of Materials Science: Materials in Electronics, 2013, v. 24, n. 12, p. 4807, doi. 10.1007/s10854-013-1479-5

By:

Sohila, S.;
Ramesh, R.;
Ramya, S.;
Ponnusamy, S.;
Muthamizhchelvan, C.

Publication type:

Article

Nanocrystalline ITO-SnS transparent thin films for photoconductive sensor applications.

Published in:

Journal of Materials Science: Materials in Electronics, 2013, v. 24, n. 10, p. 3694, doi. 10.1007/s10854-013-1305-0

By:

Motevalizadeh, L.;
Khorshidifar, M.;
Ebrahimizadeh Abrishami, M.;
Bagheri Mohagheghi, M.

Publication type:

Article

NTC characteristic of SnSbO-BaTiFeO composite materials.

Published in:

Journal of Materials Science: Materials in Electronics, 2013, v. 24, n. 10, p. 3932, doi. 10.1007/s10854-013-1342-8

By:

Ouyang, Pan;
Zhang, Hong;
Xue, Dan;
Li, Zhicheng

Publication type:

Article

Microstructure and interface evolution of Sn-2.5Bi-1.4In-1Zn-0.3Ag/Cu joint during isothermal aging.

Published in:

Journal of Materials Science: Materials in Electronics, 2013, v. 24, n. 10, p. 4122, doi. 10.1007/s10854-013-1370-4

By:

Zhou, Zhihui;
Liu, Yongchang;
Dong, Mingjie;
Gao, Zhiming;
Li, Huijun

Publication type:

Article

Formation of CuSnS thin film by the heat treatment of electrodeposited SnS-Cu layers.

Published in:

Journal of Materials Science: Materials in Electronics, 2013, v. 24, n. 10, p. 4060, doi. 10.1007/s10854-013-1361-5

By:

Mathews, N.;
Tamy Benítez, J.;
Paraguay-Delgado, F.;
Pal, M.;
Huerta, L.

Publication type:

Article

Thermal stress driven Sn whisker growth: in air and in vacuum.

Published in:

Journal of Materials Science: Materials in Electronics, 2013, v. 24, n. 10, p. 3897, doi. 10.1007/s10854-013-1336-6

By:

Jo, Jung-Lae;
Nagao, Shijo;
Sugahara, Tohru;
Tsujimoto, Masanobu;
Suganuma, Katsuaki

Publication type:

Article

Review on microstructure evolution in Sn-Ag-Cu solders and its effect on mechanical integrity of solder joints.

Published in:

Journal of Materials Science: Materials in Electronics, 2013, v. 24, n. 9, p. 3149, doi. 10.1007/s10854-013-1240-0

By:

Sona, Mrunali;
Prabhu, K.

Publication type:

Article