Works matching DE "TIN alloys"

Results: 881

Plasma Surface Treatment of CoCr and NiCr Alloys for Dental Applications: A Comparative Study of TiN Thin‐Film Plasma Deposition Techniques.

Published in:

Steel Research International, 2025, v. 96, n. 6, p. 1, doi. 10.1002/srin.202400711

By:

Balica, Naasson Matheus Pereira;
de Almeida, Larissa Solano;
Rossino, Luciana Sgarbi;
Pupim, Denise;
Monção, Renan Matos;
Quelemes, Patrick Veras;
Costa, Thércio H. de C.;
Barbosa, Marcos Guilherme Carvalho Braulio;
Santos, Rafaela Luiz Pereira;
Sousa, Rômulo Ribeiro Magalhães de;
Nunes, Lívio César Cunha

Publication type:

Article

Effects of Interaction Between Sn-Rich and Pb-Rich Phases on the Mechanical Properties of Sn-Pb Eutectic Solder Alloy at Cryogenic Temperature.

Published in:

Journal of Electronic Materials, 2025, v. 54, n. 3, p. 2368, doi. 10.1007/s11664-024-11694-6

By:

An, Qi;
Zhang, Minghua;
Wang, Ningning;
Fei, Jingming

Publication type:

Article

A Comparative Study on the Substitution of Nonmagnetic Ion T3+ (T = Al, Sc and Y; 0 ≤ × ≤ 0.2) on the Co2Sn1−xTxO4 Spinel Oxides to Investigate the Magnetic Characteristics

Published in:

Journal of Electronic Materials, 2024, v. 53, n. 6, p. 2861, doi. 10.1007/s11664-024-10998-x

By:

Ali, Wajahat;
Xinghan, Chen;
Ashtar, Maalik;
Hongxia, Yin;
Razaq, Abdul;
Younis, Muhammad;
Zhilong, Zheng;
Songliu, Yuan

Publication type:

Article

Influence of nitrogen content on the thermal diffusivity of TiN films prepared by magnetron sputtering.

Published in:

Surface Engineering, 2020, v. 36, n. 2, p. 192, doi. 10.1080/02670844.2019.1646964

By:

Lu, Guiyun;
Yu, Lihua;
Ju, Hongbo;
Zuo, Bin;
Xu, Junhua

Publication type:

Article

Electrodeposition of SnBi coatings based on deep eutectic solvent.

Published in:

Surface Engineering, 2014, v. 30, n. 1, p. 59, doi. 10.1179/1743294413Y.0000000198

By:

Gao, Y.;
Hu, W.;
Gao, X.;
Duan, B.

Publication type:

Article

Tin rich layers on ancient copper based objects.

Published in:

Surface Engineering, 2005, v. 21, n. 5/6, p. 359, doi. 10.1179/174329305X64321

By:

Giumlia-Mair, A.

Publication type:

Article

Analysis and research of damage phenomena on tin based organ pipes of different ages.

Published in:

Surface Engineering, 2005, v. 21, n. 5/6, p. 373, doi. 10.1179/174329305X64349

By:

Mapelli, C.;
Nicodemi, W.;
Venturini, R.

Publication type:

Article

A Zwitterionic Phosphonium Stannate(II) via Hydrogen Splitting by a Sn/P Frustrated Lewis‐Pair and Reductive Elimination.

Published in:

Chemistry - A European Journal, 2020, v. 26, n. 72, p. 17381, doi. 10.1002/chem.202004425

By:

Holtkamp, Philipp;
Schwabedissen, Jan;
Neumann, Beate;
Stammler, Hans‐Georg;
Koptyug, Igor V.;
Zhivonitko, Vladimir V.;
Mitzel, Norbert W.

Publication type:

Article

Low‐Valent Group 14 Phosphinidenide Complexes [({SIDipp}P)2M] Exhibit P–M pπ–pπ Interaction (M=Ge, Sn, Pb).

Published in:

Chemistry - A European Journal, 2020, v. 26, n. 1, p. 192, doi. 10.1002/chem.201905061

By:

Balmer, Markus;
Franzke, Yannick J.;
Weigend, Florian;
Hänisch, Carsten

Publication type:

Article

Variation of Aluminium Distribution in Small‐Sized ZSM‐5 Crystals during Desilication.

Published in:

Chemistry - A European Journal, 2019, v. 25, n. 69, p. 15879, doi. 10.1002/chem.201903852

By:

Li, Teng;
Roy, Kanak;
Krumeich, Frank;
Artiglia, Luca;
Huthwelker, Thomas;
Bokhoven, Jeroen A.

Publication type:

Article

Excavated Cubic Platinum-Tin Alloy Nanocrystals Constructed from Ultrathin Nanosheets with Enhanced Electrocatalytic Activity.

Published in:

Angewandte Chemie, 2016, v. 128, n. 31, p. 9167, doi. 10.1002/ange.201602592

By:

Chen, Qiaoli;
Yang, Yanan;
Cao, Zhenming;
Kuang, Qin;
Du, Guifen;
Jiang, Yaqi;
Xie, Zhaoxiong;
Zheng, Lansun

Publication type:

Article

A Hierarchical Tin/Carbon Composite as an Anode for Lithium-Ion Batteries with a Long Cycle Life.

Published in:

Angewandte Chemie, 2015, v. 127, n. 5, p. 1510, doi. 10.1002/ange.201409530

By:

Xingkang Huang;
Shumao Cui;
Jingbo Chang;
Hallac, Peter B.;
Fell, Christopher R.;
Yanting Luo;
Metz, Bernhard;
Junwei Jiang;
Hurley, Patrick T.;
Junhong Chen

Publication type:

Article

Advancement solidification microstructure and mechanical properties of Sn–2.0Ag–0.5Cu alloy by applying a rotary magnetic field.

Published in:

Journal of Materials Science: Materials in Electronics, 2019, v. 30, n. 20, p. 18838, doi. 10.1007/s10854-019-02240-w

By:

Hammad, A. E.;
Ragab, M.

Publication type:

Article

Wettability and interfacial morphology of Sn–3.0Ag–0.5Cu solder on electroless nickel plated ZnS transparent ceramic.

Published in:

Journal of Materials Science: Materials in Electronics, 2019, v. 30, n. 19, p. 17972, doi. 10.1007/s10854-019-02151-w

By:

Zhang, Shuye;
Zhu, Bingxuan;
Zhou, Xiang;
Wang, Xingxing;
Lin, Tiesong;
He, Peng;
Paik, Kyung-Wook

Publication type:

Article

Influences of doping Ti nanoparticles on microstructure and properties of Sn58Bi solder.

Published in:

Journal of Materials Science: Materials in Electronics, 2019, v. 30, n. 19, p. 17583, doi. 10.1007/s10854-019-02107-0

By:

Jiang, Nan;
Zhang, Liang;
Liu, Zhi-quan;
Sun, Lei;
Xiong, Ming-yue;
Zhao, Meng;
Xu, Kai-kai

Publication type:

Article

Nucleation behavior of Mg2Sn on Ta surface during ultrasonic-assisted soldering of Ta/Sn/Mg joint.

Published in:

Journal of Materials Science: Materials in Electronics, 2019, v. 30, n. 18, p. 17239, doi. 10.1007/s10854-019-02071-9

By:

Yang, Haifeng;
Tan, Qi;
Ji, Hongjun;
Xu, Wenfu;
Wang, Zhihong;
Li, Mingyu

Publication type:

Article

Effect of polyvinyl chloride fire smoke on the long-term corrosion kinetics and surface microstructure of tin–lead and lead-free solders.

Published in:

Journal of Materials Science: Materials in Electronics, 2019, v. 30, n. 17, p. 16395, doi. 10.1007/s10854-019-02013-5

By:

Li, Qian;
Lin, Jin;
Li, Changhai;
Lu, Shouxiang;
Chen, Xiao

Publication type:

Article

Electrochemical migration behavior of Sn-based lead-free solder.

Published in:

Journal of Materials Science: Materials in Electronics, 2019, v. 30, n. 15, p. 14695, doi. 10.1007/s10854-019-01841-9

By:

Qi, Xiao;
Ma, Haoran;
Wang, Chen;
Shang, Shengyan;
Li, Xiaogan;
Wang, Yunpeng;
Ma, Haitao

Publication type:

Article

The microstructure and shear behavior of Zn–25Sn–xTi solder joints with Ni substrate.

Published in:

Journal of Materials Science: Materials in Electronics, 2019, v. 30, n. 14, p. 13090, doi. 10.1007/s10854-019-01672-8

By:

Chang, Che-Wei;
Lin, Kwang-Lung

Publication type:

Article

Viscoplastic characterization and mechanical strength of novel Sn–1.7Ag–0.7Cu lead-free solder alloys with microalloying of Te and Co.

Published in:

Journal of Materials Science: Materials in Electronics, 2019, v. 30, n. 14, p. 12937, doi. 10.1007/s10854-019-01656-8

By:

El-Daly, A. A.;
Ibrahiem, A. A.;
Abdo, M. A.;
Eid, N. A. M.

Publication type:

Article

Microstructure refinement, characterization of tensile behavior and aging resistance of Zr-modified SAC105 solder alloy.

Published in:

Journal of Materials Science: Materials in Electronics, 2019, v. 30, n. 12, p. 11429, doi. 10.1007/s10854-019-01492-w

By:

Wang, Hongxuan;
Lu, Tao;
Yi, Danqing;
Wang, Bin

Publication type:

Article

Microstrucutre and thermoelectric properties of rapidly prepared Sn1−xMnxTe alloys.

Published in:

Journal of Materials Science: Materials in Electronics, 2018, v. 29, n. 22, p. 18949, doi. 10.1007/s10854-018-0018-9

By:

Yang, Bin;
Li, Shuangming;
Li, Xin;
Feng, Songke;
Liu, Zhenpeng;
Zhong, Hong

Publication type:

Article

Nanoindentation creep on CuSn, CuSn and (Cu, Ni)Sn intermetallic compounds grown in electrodeposited multilayered thin film.

Published in:

Journal of Materials Science: Materials in Electronics, 2018, v. 29, n. 2, p. 1258, doi. 10.1007/s10854-017-8030-z

By:

Haseeb, A. S. M. A.;
Rahman, Abu Zayed Mohammad Saliqur;
Chia, Pay Ying

Publication type:

Article

Microstructure and mechanical behavior of Sn-40Bi- xCu alloy.

Published in:

Journal of Materials Science: Materials in Electronics, 2017, v. 28, n. 20, p. 15708, doi. 10.1007/s10854-017-7464-7

By:

Wu, Xulei;
Xia, Ming;
li, Sujie;
Wang, Xiaojing;
Liu, Bin;
Zhang, Jiaoxia;
Liu, Ning

Publication type:

Article

Composition estimation of Sn-Bi alloy electrodeposition using polarization curve.

Published in:

Journal of Materials Science: Materials in Electronics, 2017, v. 28, n. 15, p. 11186, doi. 10.1007/s10854-017-6906-6

By:

Goh, Yingxin;
Haseeb, A.

Publication type:

Article

Thermophysical structure-sensitive properties of Tin-Zinc alloys.

Published in:

Journal of Materials Science: Materials in Electronics, 2017, v. 28, n. 1, p. 750, doi. 10.1007/s10854-016-5586-y

By:

Yakymovych, A.;
Plevachuk, Yu.;
Sklyarchuk, V.;
Janickovic, D.;
Illekova, E.;
Svec, P.

Publication type:

Article

Microstructure and fracture behavior of non eutectic Sn-Bi solder alloys.

Published in:

Journal of Materials Science: Materials in Electronics, 2016, v. 27, n. 4, p. 3182, doi. 10.1007/s10854-015-4143-4

By:

Lai, Zhongmin;
Ye, Dan

Publication type:

Article

Dielectric properties of Sn-substituted lead calcium iron niobate.

Published in:

Journal of Materials Science: Materials in Electronics, 2016, v. 27, n. 4, p. 3653, doi. 10.1007/s10854-015-4204-8

By:

Bahel, Shalini;
Puri, Maalti;
Narang, Sukhleen

Publication type:

Article

Effect of Nd on tin whisker growth in Sn-Zn soldered joint.

Published in:

Journal of Materials Science: Materials in Electronics, 2016, v. 27, n. 4, p. 3742, doi. 10.1007/s10854-015-4217-3

By:

Xue, Peng;
Wang, Ke-Hong;
Zhou, Qi;
Huang, Jun;
Long, Wei-min;
Zhang, Qing-ke

Publication type:

Article

Interfacial microstructure, wettability and material properties of nickel (Ni) nanoparticle doped tin-bismuth-silver (Sn-Bi-Ag) solder on copper (Cu) substrate.

Published in:

Journal of Materials Science: Materials in Electronics, 2016, v. 27, n. 4, p. 3982, doi. 10.1007/s10854-015-4252-0

By:

Gain, Asit;
Zhang, Liangchi

Publication type:

Article

Interfacial reactions between Cu substrate and Sn-1Ag-0.5Cu solder containing 0.1 wt% Al by dipping method.

Published in:

Journal of Materials Science: Materials in Electronics, 2015, v. 26, n. 10, p. 8229, doi. 10.1007/s10854-015-3486-1

By:

Shnawah, Dhafer;
Sabri, Mohd;
Said, Suhana;
Jauhari, Iswadi;
Mahdavifard, Mohammad;
Bashir, Mohamed;
Elsheikh, Mohamed

Publication type:

Article

Retarding the Cu-Sn and Ag-Sn intermetallic compounds by applying Cu-xZn alloy on micro-bump in novel 3D-IC technologies.

Published in:

Journal of Materials Science: Materials in Electronics, 2015, v. 26, n. 4, p. 2357, doi. 10.1007/s10854-015-2691-2

By:

Chen, Wei-Yu;
Chou, Tzu-Ting;
Tu, Wei;
Chang, Hsiang-Ching;
Lee, Christine;
Duh, Jenq-Gong

Publication type:

Article

Microstructural properties evaluation of SnSSe alloy films.

Published in:

Journal of Materials Science: Materials in Electronics, 2015, v. 26, n. 3, p. 1641, doi. 10.1007/s10854-014-2588-5

By:

Dhanasekaran, V.;
Sundaram, K.;
Jung, Jongwan;
Mahalingam, T.

Publication type:

Article

Evaluation of cooling rate on electrochemical behavior of Sn-0.3Ag-0.9Zn solder alloy in 3.5 wt% NaCl solution.

Published in:

Journal of Materials Science: Materials in Electronics, 2015, v. 26, n. 1, p. 11, doi. 10.1007/s10854-014-2356-6

By:

Wang, Huan;
Gao, Zhiming;
Liu, Yongchang;
Li, Chong;
Ma, Zongqing;
Yu, Liming

Publication type:

Article

Comparative corrosion behaviour of different Sn-based solder alloys.

Published in:

Journal of Materials Science: Materials in Electronics, 2015, v. 26, n. 1, p. 464, doi. 10.1007/s10854-014-2422-0

By:

Farina, Silvia;
Morando, Carina

Publication type:

Article

Composition control of co-electroplating Au-Sn deposits using experimental strategies.

Published in:

Journal of Materials Science: Materials in Electronics, 2014, v. 25, n. 11, p. 4933, doi. 10.1007/s10854-014-2254-y

By:

Huang, M.;
Huang, F.;
Pan, J.;
Zhang, T.

Publication type:

Article

Thermal properties of Sn-based solder alloys.

Published in:

Journal of Materials Science: Materials in Electronics, 2014, v. 25, n. 8, p. 3440, doi. 10.1007/s10854-014-2036-6

By:

Morando, Carina;
Fornaro, Osvaldo;
Garbellini, Olga;
Palacio, Hugo

Publication type:

Article

Effects of Ga addition on microstructure and properties of Sn-0.5Ag-0.7Cu solder.

Published in:

Journal of Materials Science: Materials in Electronics, 2014, v. 25, n. 8, p. 3566, doi. 10.1007/s10854-014-2057-1

By:

Luo, Dong-xue;
Xue, Song-bai;
Li, Zai-qian

Publication type:

Article

Influence of TiO nanoparticles on IMC growth in Sn-3.0Ag-0.5Cu-xTiO solder joints during isothermal aging process.

Published in:

Journal of Materials Science: Materials in Electronics, 2014, v. 25, n. 2, p. 981, doi. 10.1007/s10854-013-1675-3

By:

Tang, Y.;
Li, G.;
Chen, D.;
Pan, Y.

Publication type:

Article

Reactions and mechanical properties between AuSn20 solders and metalized Al-Si alloys for electronic packaging application.

Published in:

Journal of Materials Science: Materials in Electronics, 2014, v. 25, n. 2, p. 742, doi. 10.1007/s10854-013-1639-7

By:

Zhu, Xuewei;
Wang, Richu;
Peng, Chaoqun;
Wei, Xiaofeng;
Peng, Jian

Publication type:

Article

Liquid-state and solid-state interfacial reactions between Sn-Ag-Cu-Fe composite solders and Cu substrate.

Published in:

Journal of Materials Science: Materials in Electronics, 2014, v. 25, n. 1, p. 328, doi. 10.1007/s10854-013-1590-7

By:

Liu, Xiaoying;
Huang, Mingliang;
Zhao, Ning;
Wang, Lai

Publication type:

Article

Effect of Pd thickness on wettability and interfacial reaction of Sn-1.0Ag-Ce solders on ENEPIG surface finish.

Published in:

Journal of Materials Science: Materials in Electronics, 2014, v. 25, n. 1, p. 423, doi. 10.1007/s10854-013-1605-4

By:

Bui, Q.;
Jung, S.

Publication type:

Article

Effect of strain rate on interfacial fracture behaviors of Sn-58Bi/Cu solder joints.

Published in:

Journal of Materials Science: Materials in Electronics, 2014, v. 25, n. 1, p. 57, doi. 10.1007/s10854-013-1548-9

By:

Hu, Xiaowu;
Yu, Xiao;
Li, Yulong;
Huang, Qiang;
Liu, Yi;
Min, Zhixian

Publication type:

Article

Development of solidification microstructure and tensile mechanical properties of Sn-0.7Cu and Sn-0.7Cu-2.0Ag solders.

Published in:

Journal of Materials Science: Materials in Electronics, 2014, v. 25, n. 1, p. 478, doi. 10.1007/s10854-013-1612-5

By:

Spinelli, José;
Garcia, Amauri

Publication type:

Article

Effects of 0.1 wt% Ni addition and rapid solidification process on Sn–9Zn solder.

Published in:

Journal of Materials Science: Materials in Electronics, 2013, v. 24, n. 12, p. 4868, doi. 10.1007/s10854-013-1490-x

By:

Jing, Yanxia;
Sheng, Guangmin;
Huang, Zhenhua;
Zhao, Guoji

Publication type:

Article

Development of a lead-free composite solder from Sn-Ag-Cu and Ag-coated carbon nanotubes.

Published in:

Journal of Materials Science: Materials in Electronics, 2013, v. 24, n. 10, p. 3707, doi. 10.1007/s10854-013-1307-y

By:

Chantaramanee, S.;
Wisutmethangoon, S.;
Sikong, L.;
Plookphol, T.

Publication type:

Article

Effect of cerium addition on wetting, undercooling, and mechanical properties of Sn-3.9Ag-0.7Cu Pb-free solder alloys.

Published in:

Journal of Materials Science: Materials in Electronics, 2013, v. 24, n. 9, p. 3456, doi. 10.1007/s10854-013-1270-7

By:

Xie, H.;
Jiang, L.;
Chawla, N.

Publication type:

Article

Effect of ZnO nanoparticles addition on thermal, microstructure and tensile properties of Sn-3.5 Ag-0.5 Cu (SAC355) solder alloy.

Published in:

Journal of Materials Science: Materials in Electronics, 2013, v. 24, n. 9, p. 3210, doi. 10.1007/s10854-013-1230-2

By:

Fawzy, A.;
Fayek, S.;
Sobhy, M.;
Nassr, E.;
Mousa, M.;
Saad, G.

Publication type:

Article

Formation of Sn-Bi solder alloys by sequential electrodeposition and reflow.

Published in:

Journal of Materials Science: Materials in Electronics, 2013, v. 24, n. 6, p. 2052, doi. 10.1007/s10854-012-1055-4

By:

Goh, Yingxin;
Lee, Seen;
Haseeb, A.

Publication type:

Article

Electrochemical migration behaviour of Cu, Sn, Ag and Sn63/Pb37.

Published in:

Journal of Materials Science: Materials in Electronics, 2012, v. 23, n. 2, p. 551, doi. 10.1007/s10854-011-0435-5

By:

Medgyes, Bálint;
Illés, Balázs;
Harsányi, Gábor

Publication type:

Article