Works matching DE "THROUGH-silicon via"

Results: 97

Fabrication and Characterization of Electrical Interconnects and Microfluidic Cooling for 3D ICS With Silicon Interposer.

Published in:

Heat Transfer Engineering, 2016, v. 37, n. 11, p. 903, doi. 10.1080/01457632.2015.1097753

By:

Oh, Hanju;
Zhang, Yue;
Zheng, Li;
May, Gary S.;
Bakir, Muhannad S.

Publication type:

Article

TSV Manufacturing Fault Modeling and Diagnosis Based on Multi-Tone Dither.

Published in:

Journal of Advanced Computational Intelligence & Intelligent Informatics, 2019, v. 23, n. 1, p. 42, doi. 10.20965/jaciii.2019.p0042

By:

Yuling Shang;
Min Tan;
Chunquan Li;
Liyuan Sun

Publication type:

Article

Research Status of Copper Film Slurries for Through-Silicon Via Process: Research Status of Copper Film Slurries for Through-Silicon Via Process: X. Chen et al.

Published in:

Journal of Electronic Materials, 2025, v. 54, n. 2, p. 910, doi. 10.1007/s11664-024-11629-1

By:

Chen, Xuhua;
Liu, Zeyu;
Wang, Ru;
Han, Shengxing;
Zeng, Yao;
Li, Yiken

Publication type:

Article

Damage Mechanisms in Through-Silicon Vias Due to Thermal Exposure and Electromigration.

Published in:

Journal of Electronic Materials, 2024, v. 53, n. 3, p. 1214, doi. 10.1007/s11664-023-10845-5

By:

Lee, Tae-kyu;
Yang, Hanry;
Dutta, Indranath

Publication type:

Article

Study on Thermal Shock and Annealing Behavior of Sn3Ag0.5Cu-TSV Prepared by Modified Molten Metal Infiltration Method.

Published in:

Journal of Electronic Materials, 2022, v. 51, n. 7, p. 4054, doi. 10.1007/s11664-022-09600-z

By:

Wang, Jiaojiao;
Ma, Limin;
Feng, Jianyu;
Wang, Yishu;
Guo, Fu

Publication type:

Article

TSV‐based common‐mode noise‐suppressing filter design and implementation.

Published in:

Electronics Letters (Wiley-Blackwell), 2022, v. 58, n. 6, p. 243, doi. 10.1049/ell2.12412

By:

Li, Zhensong;
Liu, Huan;
Sun, Yunheng;
Yang, Yang;
Miao, Min;
Ma, Shenglin;
Jin, Yufeng

Publication type:

Article

Fabrication and measurement of 3D LPF based on coaxial TSV.

Published in:

Electronics Letters (Wiley-Blackwell), 2019, v. 55, n. 2, p. 102, doi. 10.1049/el.2018.7325

By:

Fengjuan Wang;
He Li;
Ningmei Yu

Publication type:

Article

AN ANALYTICAL THERMAL MODEL FOR THE 3-D INTEGRATED CIRCUIT WITH NEW-TYPE THROUGH SILICON VIA.

Published in:

Thermal Science, 2023, v. 27, n. 3B, p. 2391, doi. 10.2298/TSCI220621140X

By:

XU, Zhao-Pei;
WANG, Kang-Jia

Publication type:

Article

Addressing Interposer and TSV Quality Challenges.

Published in:

EE: Evaluation Engineering, 2012, v. 51, n. 2, p. 16

By:

Nelson, Rick

Publication type:

Article

Energy-efficient 3D multi-band I/O interface for enhanced mobile memory communication.

Published in:

Automatika: Journal for Control, Measurement, Electronics, Computing & Communications, 2025, v. 66, n. 1, p. 69, doi. 10.1080/00051144.2024.2444758

By:

Alzahmi, Ahmed

Publication type:

Article

Evaluation of Cu-TSV Barrier Materials as a Solution to Copper Protrusion.

Published in:

Journal of Electronic Materials, 2020, v. 49, n. 3, p. 2076, doi. 10.1007/s11664-019-07894-0

By:

Zare, Yazdan;
Sasajima, Yasushi;
Onuki, Jin

Publication type:

Article

Heating Rate Dependence of the Mechanisms of Copper Pumping in Through-Silicon Vias.

Published in:

Journal of Electronic Materials, 2019, v. 48, n. 1, p. 159, doi. 10.1007/s11664-018-6805-5

By:

Yang, Hanry;
Lee, Tae-Kyu;
Meinshausen, Lutz;
Dutta, Indranath

Publication type:

Article

Mechanism of the Local Cu Protrusion in Cu-Filled Through Silicon Vias Under Heat Treatment.

Published in:

Journal of Electronic Materials, 2019, v. 48, n. 1, p. 152, doi. 10.1007/s11664-018-6803-7

By:

Zhao, Xuewei;
Ma, Limin;
Wang, Yishu;
Guo, Fu

Publication type:

Article

Effect of Thermal Mechanical Behaviors of Cu on Stress Distribution in Cu-Filled Through-Silicon Vias Under Heat Treatment.

Published in:

Journal of Electronic Materials, 2018, v. 47, n. 1, p. 142, doi. 10.1007/s11664-017-5885-y

By:

Zhao, Xuewei;
Ma, Limin;
Wang, Yishu;
Guo, Fu

Publication type:

Article

Tape-Assisted Transfer of Carbon Nanotube Bundles for Through-Silicon-Via Applications.

Published in:

Journal of Electronic Materials, 2015, v. 44, n. 8, p. 2898, doi. 10.1007/s11664-015-3752-2

By:

Mu, Wei;
Sun, Shuangxi;
Jiang, Di;
Fu, Yifeng;
Edwards, Michael;
Zhang, Yong;
Jeppson, Kjell;
Liu, Johan

Publication type:

Article

Analysis of 3D TSV Vertical Interconnection Using Pre-applied Nonconductive Films.

Published in:

Journal of Electronic Materials, 2014, v. 43, n. 11, p. 4214, doi. 10.1007/s11664-014-3319-7

By:

Choi, Yongwon;
Shin, Jiwon;
Suk, Kyung-lim;
Kim, Young;
Kim, Il;
Paik, Kyung-Wook

Publication type:

Article

Effect of Copper TSV Annealing on Via Protrusion for TSV Wafer Fabrication.

Published in:

Journal of Electronic Materials, 2012, v. 41, n. 9, p. 2533, doi. 10.1007/s11664-012-2117-3

By:

Heryanto, A.;
Putra, W.N.;
Trigg, A.;
Gao, S.;
Kwon, W.S.;
Che, F.X.;
Ang, X.F.;
Wei, J.;
I Made, R.;
Gan, C.L.;
Pey, K.L.

Publication type:

Article

Microstructure Evolution and Defect Formation in Cu Through-Silicon Vias (TSVs) During Thermal Annealing.

Published in:

Journal of Electronic Materials, 2012, v. 41, n. 4, p. 712, doi. 10.1007/s11664-012-1943-7

By:

Shin, Hae-A-Seul;
Kim, Byoung-Joon;
Kim, Ju-Heon;
Hwang, Sung-Hwan;
Budiman, Arief;
Son, Ho-Young;
Byun, Kwang-Yoo;
Tamura, Nobumichi;
Kunz, Martin;
Kim, Dong-Ik;
Joo, Young-Chang

Publication type:

Article

Three-Stage Optimization of Pre-Bond Diagnosis of TSV Defects.

Published in:

Journal of Electronic Testing, 2017, v. 33, n. 5, p. 573, doi. 10.1007/s10836-017-5681-x

By:

Zhang, Bei;
Agrawal, Vishwani

Publication type:

Article

基于TSV技术的3D电感的设计与实现.

Published in:

Electronic Components & Materials, 2018, v. 37, n. 6, p. 49, doi. 10.14106/j.cnki.1001-2028.2018.06.010

By:

薛宇;
张洪泽;
刘鹏飞;
朱健

Publication type:

Article

A novel efficient TSV built-in test for stacked 3D ICs.

Published in:

Turkish Journal of Electrical Engineering & Computer Sciences, 2018, v. 26, n. 4, p. 1909, doi. 10.3906/elk-1711-220

By:

GUIBANE, Badi;
HAMDI, Belgacem;
BENSALEM, Brahim;
MTIBAA, Abdellatif

Publication type:

Article

A Framework for Scalable TSV Assignment and Selection in Three-Dimensional Networks-on-Chips.

Published in:

VLSI Design, 2017, p. 1, doi. 10.1155/2017/9427678

By:

Charif, Amir;
Coelho, Alexandre;
Zergainoh, Nacer-Eddine;
Nicolaidis, Michael

Publication type:

Article

Integrated Passive Devices and Switching Circuit Design for a 3D DC/DC Converter up to 60 V.

Published in:

Journal of Circuits, Systems & Computers, 2020, v. 29, n. 03, p. N.PAG, doi. 10.1142/S0218126620500395

By:

Saponara, Sergio;
Ciarpi, Gabriele;
Erlbacher, Tobias;
Rattmann, Gudrun

Publication type:

Article

A TSV Fault-Tolerant Scheme Based on Failure Classification in 3D-NoC.

Published in:

Journal of Circuits, Systems & Computers, 2017, v. 26, n. 4, p. -1, doi. 10.1142/S0218126617500591

By:

Ouyang, Yiming;
Da, Jian;
Wang, Xiumin;
Han, Qianqian;
Liang, Huaguo;
Du, Gaoming

Publication type:

Article

Minimal Buffer Insertion Based Low Power Clock Tree Synthesis for 3D Integrated Circuits.

Published in:

Journal of Circuits, Systems & Computers, 2016, v. 25, n. 11, p. -1, doi. 10.1142/S0218126616501425

By:

Sumanth Kumar, Kamineni;
Reuben, John

Publication type:

Article

Generic Integer Linear Programming Formulation for 3D IC Partitioning.

Published in:

Journal of Information Science & Engineering, 2012, v. 28, n. 6, p. 1129

By:

WAN-YU LEE;
JIANG, IRIS HUI-RU;
TSUNG-WAN MEI

Publication type:

Article

TSV-based antenna for on-chip wireless communication.

Published in:

IET Microwaves, Antennas & Propagation (Wiley-Blackwell), 2020, v. 14, n. 4, p. 302, doi. 10.1049/iet-map.2019.0431

By:

Pano, Vasil;
Tekin, Ibrahim;
Yuqiao Liu;
Dandekar, Kapil R.;
Taskin, Baris

Publication type:

Article

Admittance extraction and analysis for through silicon vias near edge and at corner of silicon substrate.

Published in:

IET Microwaves, Antennas & Propagation (Wiley-Blackwell), 2016, v. 10, n. 12, p. 1345, doi. 10.1049/iet-map.2015.0373

By:

Sheng Liu;
Wanchun Tang;
Cheng Huang;
Jianping Zhu;
Wei Zhuang

Publication type:

Article

Study of the protrusion of through-silicon vias in dual annealing-CMP processes for 3D integration.

Published in:

Microsystems & Nanoengineering, 2025, v. 11, n. 1, p. 1, doi. 10.1038/s41378-024-00797-z

By:

Liu, Tianjian;
Wang, Shizhao;
Dong, Fang;
Xi, Yang;
Zhang, Yunpeng;
He, Tao;
Sun, Xiang;
Liu, Sheng

Publication type:

Article

Through-polymer, via technology-enabled, flexible, lightweight, and integrated devices for implantable neural probes.

Published in:

Microsystems & Nanoengineering, 2024, v. 10, n. 1, p. 1, doi. 10.1038/s41378-024-00691-8

By:

Zhou, Cunkai;
Tian, Ye;
Li, Gen;
Ye, Yifei;
Gao, Lusha;
Li, Jiazhi;
Liu, Ziwei;
Su, Haoyang;
Lu, Yunxiao;
Li, Meng;
Zhou, Zhitao;
Wei, Xiaoling;
Qin, Lunming;
Tao, Tiger H.;
Sun, Liuyang

Publication type:

Article

An Introductory Overview of Various Typical Lead-Free Solders for TSV Technology.

Published in:

Inorganics, 2025, v. 13, n. 3, p. 86, doi. 10.3390/inorganics13030086

By:

Choi, Sooyong;
Lim, Sooman;
Hanifah, Muhamad Mukhzani Muhamad;
Matteini, Paolo;
Yusoff, Wan Yusmawati Wan;
Hwang, Byungil

Publication type:

Article

A Short Review of Through-Silicon via (TSV) Interconnects: Metrology and Analysis.

Published in:

Applied Sciences (2076-3417), 2023, v. 13, n. 14, p. 8301, doi. 10.3390/app13148301

By:

Wang, Jintao;
Duan, Fangcheng;
Lv, Ziwen;
Chen, Si;
Yang, Xiaofeng;
Chen, Hongtao;
Liu, Jiahao

Publication type:

Article

A TSV-Structured Room Temperature p-Type TiO 2 Nitric Oxide Gas Sensor.

Published in:

Applied Sciences (2076-3417), 2022, v. 12, n. 19, p. 9946, doi. 10.3390/app12199946

By:

Yeh, Yu-Ming;
Chang, Shoou-Jinn;
Wang, Pin-Hsiang;
Hsueh, Ting-Jen

Publication type:

Article

Editorial for Special Issue on Reliability Analysis of Electrotechnical Devices.

Published in:

Applied Sciences (2076-3417), 2022, v. 12, n. 8, p. 4086, doi. 10.3390/app12084086

By:

Tan, Cher-Ming

Publication type:

Article

High-efficiency core-shell solar cell array from Si wafer.

Published in:

Applied Physics A: Materials Science & Processing, 2012, v. 107, n. 4, p. 911, doi. 10.1007/s00339-012-6818-5

By:

Guo, Ning;
Wei, Jinquan;
Shu, Qinke;
Jia, Yi;
Song, Shuang;
Xu, Ying;
Wang, Hongguang;
Li, Peixu;
Zhu, Hongwei;
Wang, Kunlin;
Wu, Dehai

Publication type:

Article

SIP with TSV for Class 1 Medical Devices.

Published in:

Journal of Microelectronic & Electronic Packaging, 2016, v. 13, n. 1, p. 1, doi. 10.4071/imaps.497

By:

Youngtak Lee;
Doug Link

Publication type:

Article

Impact of Grain Structure and Material Properties on Via Extrusion in 3D Interconnects.

Published in:

Journal of Microelectronic & Electronic Packaging, 2015, v. 12, n. 3, p. 118, doi. 10.4071/imaps.456

By:

Tengfei Jiang;
Chenglin Wu;
Im, Jay;
Rui Huang;
Ho, Paul S.

Publication type:

Article

Thermal Performance of 3D IC Integration with Through-Silicon Via (TSV).

Published in:

Journal of Microelectronic & Electronic Packaging, 2012, v. 9, n. 2, p. 97, doi. 10.4071/imaps.309

By:

Heng-Chieh Chien;
Lau, John H.;
Yu-Lin Chao;
Ra-Min Tain;
Ming-Ji Dai;
Sheng-Tsai Wu;
Wei-Chung Lo;
Ming-Jer Kao

Publication type:

Article

Genetic Algorithms and Particle Swarm Optimization Mechanisms for Through-Silicon Via (TSV) Noise Coupling.

Published in:

Applied Computational Intelligence & Soft Computing, 2021, p. 1, doi. 10.1155/2021/8830395

By:

Ait Belaid, Khaoula;
Belahrach, H.;
Ayad, H.

Publication type:

Article

A Novel 3D Encapsulation Structure Based on Subwavelength Structure and Inserted Pyrex Glass for RF MEMS Infrared Detectors.

Published in:

Electronics (2079-9292), 2019, v. 8, n. 9, p. 974, doi. 10.3390/electronics8090974

By:

Zhao, Jicong;
Ge, Mingmin;
Song, Chenguang;
Sun, Ling;
Sun, Haiyan

Publication type:

Article

Numerical Laplace Inversion Method for Through-Silicon Via (TSV) Noise Coupling in 3D-IC Design.

Published in:

Electronics (2079-9292), 2019, v. 8, n. 9, p. 1010, doi. 10.3390/electronics8091010

By:

Ait Belaid, Khaoula;
Belahrach, Hassan;
Ayad, Hassan

Publication type:

Article

TSV Technology and High-Energy Heavy Ions Radiation Impact Review.

Published in:

Electronics (2079-9292), 2018, v. 7, n. 7, p. 112, doi. 10.3390/electronics7070112

By:

Tian, Wenchao;
Ma, Tianran;
Liu, Xiaohan

Publication type:

Article

Through-Silicon-Via Pairs Modelling via Compressed Sensing.

Published in:

PIERS Proceedings, 2014, p. 2496

By:

Tao Wang;
Jun Fan;
Yiyu Shi;
Boping Wu

Publication type:

Article

Electrical and Mechanical Analysis of Different TSV Geometries.

Published in:

Metals (2075-4701), 2020, v. 10, n. 4, p. 467, doi. 10.3390/met10040467

By:

Jeong, Il Ho;
Eslami Majd, Alireza;
Jung, Jae Pil;
Ekere, Nduka Nnamdi

Publication type:

Article

基于硅通孔的三维微系统互联结构总剂量效应损伤机制研究.

Published in:

Atomic Energy Science & Technology, 2024, v. 58, n. 8, p. 1789, doi. 10.7538/yzk.2023.youxian.0771

By:

王昊;
陈睿;
陈钱;
韩建伟;
于新;
孟德超;
杨驾鹏;
薛玉雄;
周泉丰;
韩瑞龙

Publication type:

Article

Signal Integrity Analysis in Carbon Nanotube Based Through-Silicon Via.

Published in:

Active & Passive Electronic Components, 2014, p. 1, doi. 10.1155/2014/524107

By:

Majumder, Manoj Kumar;
Kumari, Archana;
Kaushik, Brajesh Kumar;
Manhas, Sanjeev Kumar

Publication type:

Article

Nondestructive monitoring of annealing and chemical–mechanical planarization behavior using ellipsometry and deep learning.

Published in:

Microsystems & Nanoengineering, 2023, v. 9, n. 1, p. 1, doi. 10.1038/s41378-023-00529-9

By:

Sun, Qimeng;
Yang, Dekun;
Liu, Tianjian;
Liu, Jianhong;
Wang, Shizhao;
Hu, Sizhou;
Liu, Sheng;
Song, Yi

Publication type:

Article

High Frequency Electrical Characterization of 3D Signal/Ground through Silicon Vias.

Published in:

Progress in Electromagnetics Research Letters, 2014, v. 47, p. 71, doi. 10.2528/pierl14052704

By:

Adamshick, Steve;
Carroll, Robert;
Rao, Megha;
La Tulipe, Douglas;
Kruger, Seth;
Burke, John;
Liehr, Michael

Publication type:

Article

Boundary Layers Defect Diagnosis and Analysis of Through Silicon Via (TSV).

Published in:

International Journal of Performability Engineering, 2019, v. 15, n. 1, p. 97, doi. 10.23940/ijpe.19.01.p10.97106

By:

Yuan Chen;
Peng Zhang;
Kuiliang Xia;
Hongzhong Huang

Publication type:

Article

Assessment of through‐silicon‐vias with different configurations of ground vias and accounting for substrate losses.

Published in:

International Journal of RF & Microwave Computer-Aided Engineering, 2021, v. 31, n. 10, p. 1, doi. 10.1002/mmce.22811

By:

Rodríguez‐Velásquez, Yojanes;
Murphy‐Arteaga, Roberto S.;
Torres‐Torres, Reydezel

Publication type:

Article