Works matching DE "THROUGH-silicon via"
Results: 95
A novel efficient TSV built-in test for stacked 3D ICs.
- Published in:
- Turkish Journal of Electrical Engineering & Computer Sciences, 2018, v. 26, n. 4, p. 1909, doi. 10.3906/elk-1711-220
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- Publication type:
- Article
AN ANALYTICAL THERMAL MODEL FOR THE 3-D INTEGRATED CIRCUIT WITH NEW-TYPE THROUGH SILICON VIA.
- Published in:
- Thermal Science, 2023, v. 27, n. 3B, p. 2391, doi. 10.2298/TSCI220621140X
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- Publication type:
- Article
Peer-Reviewed Literature of Interest to Failure Analysis: A Cornucopia.
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- Electronic Device Failure Analysis, 2021, v. 23, n. 3, p. 46
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- Publication type:
- Article
LITERATURE REVIEW.
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- Electronic Device Failure Analysis, 2020, v. 22, n. 2, p. 46
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- Publication type:
- Article
HIGH RESOLUTION ACOUSTIC GHz MICROSCOPY.
- Published in:
- Electronic Device Failure Analysis, 2018, v. 20, n. 4, p. 4, doi. 10.31399/asm.edfa.2018-4.p004
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- Publication type:
- Article
NOVEL TECHNIQUE MEASURES WARPAGE IN NEXT-GENERATION ICs.
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- Electronic Device Failure Analysis, 2017, v. 19, n. 3, p. 43
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- Publication type:
- Article
EMERGING TECHNIQUES FOR 2-D/2.5-D/3-D PACKAGE FAILURE ANALYSIS: EOTPR, 3-D X-RAY, AND PLASMA FIB.
- Published in:
- Electronic Device Failure Analysis, 2016, v. 18, n. 4, p. 30, doi. 10.31399/asm.edfa.2016-4.p030
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- Publication type:
- Article
PLASMA FIB PROVIDES VITAL DELAYERING AND SITE SPECIFIC FAILURE ANALYSIS CAPABILITIES FOR LARGER-SCALE STRUCTURES.
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- Electronic Device Failure Analysis, 2016, v. 18, n. 1, p. 30, doi. 10.31399/asm.edfa.2016-1.p030
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- Publication type:
- Article
3-D ICs with TSVs: The Hard Work Continues.
- Published in:
- 2013
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- Publication type:
- Proceeding
Through-Silicon Vias and 3D Inductors for RF Applications.
- Published in:
- Microwave Journal, 2014, v. 57, n. 2, p. 80
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- Publication type:
- Article
Experimental characterisation of coaxial TSV transistor keep out zones.
- Published in:
- Micro & Nano Letters (Wiley-Blackwell), 2018, v. 13, n. 10, p. 1457, doi. 10.1049/mnl.2018.5280
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- Publication type:
- Article
Study of the protrusion of through-silicon vias in dual annealing-CMP processes for 3D integration.
- Published in:
- Microsystems & Nanoengineering, 2025, v. 11, n. 1, p. 1, doi. 10.1038/s41378-024-00797-z
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- Publication type:
- Article
Through-polymer, via technology-enabled, flexible, lightweight, and integrated devices for implantable neural probes.
- Published in:
- Microsystems & Nanoengineering, 2024, v. 10, n. 1, p. 1, doi. 10.1038/s41378-024-00691-8
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- Publication type:
- Article
Genetic Algorithms and Particle Swarm Optimization Mechanisms for Through-Silicon Via (TSV) Noise Coupling.
- Published in:
- Applied Computational Intelligence & Soft Computing, 2021, p. 1, doi. 10.1155/2021/8830395
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- Publication type:
- Article
Quartz resonator assembling with TSV interposer using polymer sealing or metal bonding.
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- Nanoscale Research Letters, 2014, v. 9, n. 1, p. 1, doi. 10.1186/1556-276X-9-541
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- Publication type:
- Article
基于TSV技术的3D电感的设计与实现.
- Published in:
- Electronic Components & Materials, 2018, v. 37, n. 6, p. 49, doi. 10.14106/j.cnki.1001-2028.2018.06.010
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- Publication type:
- Article
A Framework for Scalable TSV Assignment and Selection in Three-Dimensional Networks-on-Chips.
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- VLSI Design, 2017, p. 1, doi. 10.1155/2017/9427678
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- Publication type:
- Article
Editorial for the Special Issue on Small-Scale Deformation using Advanced Nanoindentation Techniques.
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- 2019
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- Publication type:
- Editorial
In Situ Mechanical Characterization of the Mixed-Mode Fracture Strength of the Cu/Si Interface for TSV Structures.
- Published in:
- Micromachines, 2019, v. 10, n. 2, p. 86, doi. 10.3390/mi10020086
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- Publication type:
- Article
Fabrication and Optimization of High Aspect Ratio Through-Silicon-Vias Electroplating for 3D Inductor.
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- Micromachines, 2018, v. 9, n. 10, p. 528, doi. 10.3390/mi9100528
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- Publication type:
- Article
Addressing Interposer and TSV Quality Challenges.
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- EE: Evaluation Engineering, 2012, v. 51, n. 2, p. 16
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- Publication type:
- Article
Generic Integer Linear Programming Formulation for 3D IC Partitioning.
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- Journal of Information Science & Engineering, 2012, v. 28, n. 6, p. 1129
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- Publication type:
- Article
TSV‐based common‐mode noise‐suppressing filter design and implementation.
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- Electronics Letters (Wiley-Blackwell), 2022, v. 58, n. 6, p. 243, doi. 10.1049/ell2.12412
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- Publication type:
- Article
Fast power density aware three‐dimensional integrated circuit floorplanning for hard macroblocks using best operator combination genetic algorithm.
- Published in:
- International Journal of Circuit Theory & Applications, 2023, v. 51, n. 10, p. 4879, doi. 10.1002/cta.3672
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- Publication type:
- Article
SIP with TSV for Class 1 Medical Devices.
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- Journal of Microelectronic & Electronic Packaging, 2016, v. 13, n. 1, p. 1, doi. 10.4071/imaps.497
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- Publication type:
- Article
Impact of Grain Structure and Material Properties on Via Extrusion in 3D Interconnects.
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- Journal of Microelectronic & Electronic Packaging, 2015, v. 12, n. 3, p. 118, doi. 10.4071/imaps.456
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- Publication type:
- Article
Thermal Performance of 3D IC Integration with Through-Silicon Via (TSV).
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- Journal of Microelectronic & Electronic Packaging, 2012, v. 9, n. 2, p. 97, doi. 10.4071/imaps.309
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- Publication type:
- Article
TSV Manufacturing Fault Modeling and Diagnosis Based on Multi-Tone Dither.
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- Journal of Advanced Computational Intelligence & Intelligent Informatics, 2019, v. 23, n. 1, p. 42, doi. 10.20965/jaciii.2019.p0042
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- Publication type:
- Article
TSV-based antenna for on-chip wireless communication.
- Published in:
- IET Microwaves, Antennas & Propagation (Wiley-Blackwell), 2020, v. 14, n. 4, p. 302, doi. 10.1049/iet-map.2019.0431
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- Publication type:
- Article
Admittance extraction and analysis for through silicon vias near edge and at corner of silicon substrate.
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- IET Microwaves, Antennas & Propagation (Wiley-Blackwell), 2016, v. 10, n. 12, p. 1345, doi. 10.1049/iet-map.2015.0373
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- Publication type:
- Article
Advanced Electronic Packaging Technology: From Hard to Soft.
- Published in:
- Materials (1996-1944), 2023, v. 16, n. 6, p. 2346, doi. 10.3390/ma16062346
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- Publication type:
- Article
Through-Silicon via Device Non-Destructive Defect Evaluation Using Ultra-High-Resolution Acoustic Microscopy System.
- Published in:
- Materials (1996-1944), 2023, v. 16, n. 2, p. 860, doi. 10.3390/ma16020860
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- Publication type:
- Article
Stress Impact of the Annealing Procedure of Cu-Filled TSV Packaging on the Performance of Nano-Scaled MOSFETs Evaluated by an Analytical Solution and FEA-Based Submodeling Technique.
- Published in:
- Materials (1996-1944), 2021, v. 14, n. 18, p. 5226, doi. 10.3390/ma14185226
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- Publication type:
- Article
Boundary Layers Defect Diagnosis and Analysis of Through Silicon Via (TSV).
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- International Journal of Performability Engineering, 2019, v. 15, n. 1, p. 97, doi. 10.23940/ijpe.19.01.p10.97106
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- Publication type:
- Article
MEMS Pressure Sensors with Novel TSV Design for Extreme Temperature Environments †.
- Published in:
- Sensors (14248220), 2025, v. 25, n. 3, p. 636, doi. 10.3390/s25030636
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- Publication type:
- Article
TSV Developments.
- Published in:
- Electronic Device Failure Analysis, 2012, v. 14, n. 3, p. 46, doi. 10.31399/asm.edfa.2012-3.p046
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- Publication type:
- Article
Challenges in Failure Analysis for Three-Dimensional Integration.
- Published in:
- Electronic Device Failure Analysis, 2012, v. 14, n. 3, p. 2
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- Publication type:
- Article
Assessment of through‐silicon‐vias with different configurations of ground vias and accounting for substrate losses.
- Published in:
- International Journal of RF & Microwave Computer-Aided Engineering, 2021, v. 31, n. 10, p. 1, doi. 10.1002/mmce.22811
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- Publication type:
- Article
Electrical models of through silicon Vias and silicon‐based devices for millimeter‐wave application.
- Published in:
- International Journal of RF & Microwave Computer-Aided Engineering, 2018, v. 28, n. 9, p. N.PAG, doi. 10.1002/mmce.21447
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- Publication type:
- Article
Fabrication and measurement of 3D LPF based on coaxial TSV.
- Published in:
- Electronics Letters (Wiley-Blackwell), 2019, v. 55, n. 2, p. 102, doi. 10.1049/el.2018.7325
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- Publication type:
- Article
Coupling capacitance in through-silicon vias:non-homogeneous medium effect.
- Published in:
- Electronics Letters (Wiley-Blackwell), 2016, v. 52, n. 2, p. 152, doi. 10.1049/el.2015.3141
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- Publication type:
- Article
On-chip trimming circuit based on embedded one-time-programming memory for magnetic wireless interlayer transmission module.
- Published in:
- Electronics Letters (Wiley-Blackwell), 2015, v. 51, n. 24, p. 2064, doi. 10.1049/el.2015.2275
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- Publication type:
- Article
Analytical evaluation of scattering parameters for equivalent circuit of through silicon via array.
- Published in:
- Electronics Letters (Wiley-Blackwell), 2015, v. 51, n. 13, p. 1025, doi. 10.1049/el.2015.1265
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- Publication type:
- Article
Simultaneous process self-calibration method using TDC for 3D DDR4 DRAM.
- Published in:
- Electronics Letters (Wiley-Blackwell), 2014, v. 50, n. 22, p. 1579, doi. 10.1049/el.2014.1595
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- Publication type:
- Article
BMD impact on silicon fin defect at TSV bottom.
- Published in:
- Electronics Letters (Wiley-Blackwell), 2014, v. 50, n. 13, p. 954, doi. 10.1049/el.2014.0974
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- Publication type:
- Article
Surface second harmonic generation induced by 3D strain fields.
- Published in:
- Physica Status Solidi (B), 2016, v. 253, n. 2, p. 218, doi. 10.1002/pssb.201552517
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- Publication type:
- Article
Recovery of TSV Based 3D IC.
- Published in:
- International Journal of Advanced Research in Computer Science, 2017, v. 8, n. 5, p. 149
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- Publication type:
- Article
Three-Dimensional Integrated Circuit (3D IC) Key Technology: Through-Silicon Via (TSV).
- Published in:
- Nanoscale Research Letters, 2017, v. 12, n. 1, p. 1, doi. 10.1186/s11671-017-1831-4
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- Publication type:
- Article
Electrical and Mechanical Analysis of Different TSV Geometries.
- Published in:
- Metals (2075-4701), 2020, v. 10, n. 4, p. 467, doi. 10.3390/met10040467
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- Publication type:
- Article
Editorial for the Special Issue on Advanced Interconnect and Packaging, 2nd Edition.
- Published in:
- 2024
- By:
- Publication type:
- Editorial