Works matching DE "THREE-dimensional integrated circuits"
1
- Advanced Functional Materials, 2017, v. 27, n. 5, p. n/a, doi. 10.1002/adfm.201604754
- Chen, Jin;
- Huang, Xingyi;
- Zhu, Yingke;
- Jiang, Pingkai
- Article
2
- Journal of Materials Science: Materials in Electronics, 2022, v. 33, n. 13, p. 10471, doi. 10.1007/s10854-022-08034-x
- Fang, Mingang;
- Tang, Chu;
- Chen, Yiming;
- Li, Junhui;
- Chen, Zhuo;
- Wang, Fuliang;
- Zhu, Wenhui
- Article
3
- Journal of Materials Science: Materials in Electronics, 2021, v. 32, n. 14, p. 19543, doi. 10.1007/s10854-021-06473-6
- Wang, Cong;
- Li, Chuanqiang;
- Luo, Zhi;
- Li, Ming;
- Lin, Nai;
- Ding, Kaiwen;
- Man, Shu;
- Duan, Ji'an
- Article
4
- Journal of Materials Science: Materials in Electronics, 2018, v. 29, n. 18, p. 15699, doi. 10.1007/s10854-018-9175-0
- Bhalerao, Anuradha B.;
- Bulakhe, Ravindra N.;
- Deshmukh, Prashant R.;
- Shim, Jae-Jin;
- Nandurkar, Keshav N.;
- Wagh, Bhiwa G.;
- Vattikuti, S. V. Prabhakar;
- Lokhande, Chandrakant D.
- Article
5
- International Journal of Image & Graphics, 2025, v. 25, n. 2, p. 1, doi. 10.1142/S0219467825500081
- Sharma, Manvinder;
- Saripalli, Sudhakara Reddy;
- Gupta, Anuj Kumar;
- Palta, Pankaj;
- Pandey, Digvijay
- Article
6
- Active & Passive Electronic Components, 2012, p. 1, doi. 10.1155/2012/763572
- Chi-Jih Shih;
- Chih-Yao Hsu;
- Chun-Yi Kuo;
- James Li;
- Jiann-Chyi Rau;
- Chakrabarty, Krishnendu
- Article
7
- Communications on Pure & Applied Analysis, 2017, v. 16, n. 6, p. 2269, doi. 10.3934/cpaa.2017112
- Article
8
- International Journal of Circuit Theory & Applications, 2023, v. 51, n. 10, p. 4879, doi. 10.1002/cta.3672
- Meitei, Naorem Yaipharenba;
- Baishnab, Krishna Lal;
- Trivedi, Gaurav
- Article
9
- Nature Communications, 2023, v. 14, n. 1, p. 1, doi. 10.1038/s41467-023-41868-5
- Wang, Wenhui;
- Li, Ke;
- Lan, Jun;
- Shen, Mei;
- Wang, Zhongrui;
- Feng, Xuewei;
- Yu, Hongyu;
- Chen, Kai;
- Li, Jiamin;
- Zhou, Feichi;
- Lin, Longyang;
- Zhang, Panpan;
- Li, Yida
- Article
10
- Progress in Electromagnetics Research, 2013, v. 134, p. 419, doi. 10.2528/pier12102105
- Article
11
- Thermal Science, 2025, v. 29, n. 1A, p. 227, doi. 10.2298/TSCI240414175H
- Huan HUANG;
- Chun SHAN;
- Futang LONG;
- Zongjie ZENG;
- Lei XIE;
- Fa ZOU;
- Peng XU
- Article
12
- Thermal Science, 2024, v. 28, n. 5B, p. 4081, doi. 10.2298/TSCI230919129X
- Zhao-Pei XU;
- Kang-Jia WANG
- Article
13
- Thermal Science, 2023, v. 27, n. 5B, p. 4193, doi. 10.2298/TSCI220805061R
- Xixin RAO;
- Huizhong LIU;
- Sai WANG;
- Jianhao SONG;
- Cheng JIN;
- Chengdi XIAO
- Article
14
- Thermal Science, 2023, v. 27, n. 5A, p. 3551, doi. 10.2298/TSCI220801021D
- Article
15
- Thermal Science, 2023, v. 27, n. 3B, p. 2391, doi. 10.2298/TSCI220621140X
- XU, Zhao-Pei;
- WANG, Kang-Jia
- Article
16
- Thermal Science, 2021, v. 25, n. 3B, p. 2221, doi. 10.2298/TSCI200115109W
- WANG, Kang-Jia;
- LI, Cui-Ling
- Article
17
- Thermal Science, 2020, v. 24, n. 4, p. 2615, doi. 10.2298/TSCI2004615W
- Kang-Jia WANG;
- Chu-Xia HUA;
- Yan-Hong LIANG
- Article
18
- Thermal Science, 2020, v. 24, n. 3B, p. 2067, doi. 10.2298/TSCI180507321X
- Article
19
- Thermal Science, 2019, v. 23, n. 4, p. 2157, doi. 10.2298/TSCI1904157W
- WANG, Kang-Jia;
- HUA, Chu-Xia;
- SUN, Hong-Chang
- Article
20
- Thermal Science, 2017, v. 21, n. 4, p. 1601, doi. 10.2298/TSCI160716041W
- Kang-Jia WANG;
- Hong-Chang SUN;
- Zhong-Liang PAN
- Article
21
- Journal of Algorithms & Computational Technology, 2016, v. 10, n. 3, p. 176, doi. 10.1177/1748301816649070
- Cui Huang;
- Dakun Zhang;
- Guozhi Song
- Article
22
- Circuits, Systems & Signal Processing, 2017, v. 36, n. 5, p. 2102, doi. 10.1007/s00034-016-0402-8
- Yang, Chao;
- An, Ping;
- Shen, Liquan;
- Liu, Deyang
- Article
23
- Particle & Particle Systems Characterization, 2013, v. 30, n. 9, p. 759, doi. 10.1002/ppsc.201300101
- Krommenhoek, Peter J.;
- Tracy, Joseph B.
- Article
24
- Molecules, 2021, v. 26, n. 15, p. 4616, doi. 10.3390/molecules26154616
- Ikuno, Takashi;
- Somei, Zen
- Article
25
- Electronics Letters (Wiley-Blackwell), 2020, v. 56, n. 23, p. 1239, doi. 10.1049/el.2020.2030
- Callens, N.;
- Lefebvre, J.;
- Gielen, G.
- Article
26
- Electronics Letters (Wiley-Blackwell), 2020, v. 56, n. 22, p. 1202, doi. 10.1049/el.2020.1946
- Article
27
- Electronics Letters (Wiley-Blackwell), 2016, v. 52, n. 24, p. 2013, doi. 10.1049/el.2016.3305
- Song Wang;
- Ruimin Hu;
- Shihong Chen;
- Xiaochen Wang;
- Yuhong Yang;
- Weiping Tu
- Article
28
- Electronic Components & Materials, 2018, v. 37, n. 6, p. 49, doi. 10.14106/j.cnki.1001-2028.2018.06.010
- Article
29
- International Journal for Numerical Methods in Biomedical Engineering, 2010, v. 26, n. 2, p. 190, doi. 10.1002/cnm.1136
- Vinh, Phan Ngoc;
- Larson, Magnus
- Article
30
- Journal of Microelectronic & Electronic Packaging, 2019, v. 16, n. 3, p. 124, doi. 10.4071/imaps.930748
- Ravichandran, Siddharth;
- Shuhei Yamada;
- Tomonori Ogawa;
- Tailong Shi;
- Fuhan Liu;
- Smet, Vanessa;
- Sundaram, Venky;
- Tummala, Rao
- Article
31
- Journal of Microelectronic & Electronic Packaging, 2016, v. 13, n. 2, p. 71, doi. 10.4071/imaps.494
- McDonough, Colin;
- La Tulipe, Doug;
- Pascual, Dan;
- Tariello, Paul;
- Mucci, John;
- Smalley, Matt;
- Nguyen, Anh;
- Tuan Vo;
- Johnson, Corbet;
- Nguyen, Phung;
- Hebding, Jeremiah;
- Leake, Gerald;
- Moresco, Michele;
- Timurdogan, Erman;
- Stojanović, Vladimir;
- Watts, Michael R.;
- Coolbaugh, Douglas
- Article
32
- Journal of Microelectronic & Electronic Packaging, 2015, v. 12, n. 3, p. 161, doi. 10.4071/imaps.416
- Do Hyun Jung;
- Agarwal, Shalu;
- Kumar, Santosh;
- Jae Pil Jung
- Article
33
- Journal of Microelectronic & Electronic Packaging, 2012, v. 9, n. 2, p. 97, doi. 10.4071/imaps.309
- Heng-Chieh Chien;
- Lau, John H.;
- Yu-Lin Chao;
- Ra-Min Tain;
- Ming-Ji Dai;
- Sheng-Tsai Wu;
- Wei-Chung Lo;
- Ming-Jer Kao
- Article
34
- International Journal of Emerging Electric Power Systems, 2017, v. 18, n. 6, p. 1, doi. 10.1515/ijeeps-2017-0099
- Jingrong Yu;
- Limin Deng;
- Maoyun Liu;
- Zhifeng Qiu
- Article
35
- Journal of Phase Equilibria & Diffusion, 2016, v. 37, n. 4, p. 469, doi. 10.1007/s11669-016-0475-x
- Attari, Vahid;
- Arroyave, Raymundo
- Article
36
- Natural Computing, 2016, v. 15, n. 1, p. 115, doi. 10.1007/s11047-015-9512-7
- Keenan, Alexandra;
- Schweller, Robert;
- Sherman, Michael;
- Zhong, Xingsi
- Article
37
- International Journal of RF & Microwave Computer-Aided Engineering, 2018, v. 28, n. 9, p. N.PAG, doi. 10.1002/mmce.21447
- Liu, Xiaoxian;
- Zhu, Zhangming;
- Yang, Yintang;
- Liu, Yang;
- Lu, Qijun;
- Yin, Xiangkun
- Article
38
- Micro & Nano Letters (Wiley-Blackwell), 2016, v. 11, n. 10, p. 568, doi. 10.1049/mnl.2016.0242
- Yu-Hsiang Tang;
- Yu-Hsin Lin;
- Ming-Hua Shiao;
- Chih-Sheng Yu
- Article
39
- IETE Technical Review, 2012, v. 29, n. 4, p. 318, doi. 10.4103/0256-4602.101313
- Pawan Kumar, M.;
- Murali, Srinivasan;
- Veezhinathan, Kamakoti
- Article
40
- Applied Sciences (2076-3417), 2022, v. 12, n. 8, p. 4086, doi. 10.3390/app12084086
- Article
41
- Applied Sciences (2076-3417), 2020, v. 10, n. 3, p. 748, doi. 10.3390/app10030748
- Kapoor, Dipesh;
- Tan, Cher Ming;
- Sangwan, Vivek
- Article
42
- International Journal for Numerical Methods in Engineering, 2015, v. 102, n. 13, p. 1894, doi. 10.1002/nme.4878
- Jiang, Y.;
- Tay, T. E.;
- Chen, L.;
- Zhang, Y. W.
- Article
43
- Journal of Circuits, Systems & Computers, 2024, v. 33, n. 17, p. 1, doi. 10.1142/S0218126624503092
- Feng, Yinghao;
- Dong, Gang;
- Liu, Daihang;
- Zhi, Changle;
- Yang, Deguang;
- Wang, Yang;
- Zhu, Zhangming;
- Yang, Yintang
- Article
44
- Journal of Circuits, Systems & Computers, 2024, v. 33, n. 16, p. 1, doi. 10.1142/S0218126624502815
- Cheng, Xin;
- Zhou, Jinjia;
- Zhang, Zhiqiang;
- Yu, Wenxin
- Article
45
- Journal of Circuits, Systems & Computers, 2020, v. 29, n. 16, p. N.PAG, doi. 10.1142/S0218126620990017
- Article
46
- Journal of Circuits, Systems & Computers, 2020, v. 29, n. 11, p. N.PAG, doi. 10.1142/S0218126620501443
- Ni, Tianming;
- Shu, Yue;
- Chang, Hao;
- Lu, Lin;
- Dai, Guangzhen;
- Zhu, Shidong;
- Qu, Chengming;
- Huang, Zhengfeng
- Article
47
- Journal of Circuits, Systems & Computers, 2020, v. 29, n. 10, p. N.PAG, doi. 10.1142/S0218126620501613
- Moon, Dongwoo;
- Lee, Milim;
- Lee, Changhyun;
- Park, Joung-Hu;
- Park, Changkun
- Article
48
- Nanoscale Research Letters, 2017, v. 12, n. 1, p. 1, doi. 10.1186/s11671-017-1831-4
- Shen, Wen-Wei;
- Chen, Kuan-Neng
- Article
49
- Journal of Electronic Testing, 2022, v. 38, n. 5, p. 465, doi. 10.1007/s10836-022-06031-w
- Article
50
- Journal of Electronic Testing, 2021, v. 37, n. 2, p. 191, doi. 10.1007/s10836-021-05939-z
- Gerakis, Vasileios;
- Tsiatouhas, Yiorgos;
- Hatzopoulos, Alkis
- Article