Works matching DE "THREE-dimensional integrated circuits"

Results: 145

A NOVEL HEAT DISSIPATION STRUCTURE WITH EMBEDDED BOTH THROUGH SILICON VIAS AND MICRO-CHANNELS FOR IMPROVING HEAT TRANSFER PERFORMANCE OF 3-D INTEGRATED CIRCUITS.

Published in:

Thermal Science, 2025, v. 29, n. 2B, p. 873, doi. 10.2298/TSCI240610202X

By:

Peng XU;
Huan HUANG;
Fa ZOU;
Chun SHAN

Publication type:

Article

Correction: Hsieh et al. Single-Grain Gate-All-Around Si Nanowire FET Using Low-Thermal-Budget Processes for Monolithic Three-Dimensional Integrated Circuits. Micromachines 2020, 11 , 741.

Published in:

2025

By:

Hsieh, Tung-Ying;
Hsieh, Ping-Yi;
Yang, Chih-Chao;
Shen, Chang-Hong;
Shieh, Jia-Min;
Yeh, Wen-Kuan;
Wu, Meng-Chyi

Publication type:

Correction Notice

Fast arithmetic in algorithmic self-assembly.

Published in:

Natural Computing, 2016, v. 15, n. 1, p. 115, doi. 10.1007/s11047-015-9512-7

By:

Keenan, Alexandra;
Schweller, Robert;
Sherman, Michael;
Zhong, Xingsi

Publication type:

Article

Chemically synthesized 3D nanostructured polypyrrole electrode for high performance supercapacitor applications.

Published in:

Journal of Materials Science: Materials in Electronics, 2018, v. 29, n. 18, p. 15699, doi. 10.1007/s10854-018-9175-0

By:

Bhalerao, Anuradha B.;
Bulakhe, Ravindra N.;
Deshmukh, Prashant R.;
Shim, Jae-Jin;
Nandurkar, Keshav N.;
Wagh, Bhiwa G.;
Vattikuti, S. V. Prabhakar;
Lokhande, Chandrakant D.

Publication type:

Article

Wireless Sensor Network with a Regular, 3D Rectangular Array Structure.

Published in:

Measurement Techniques, 2016, v. 59, n. 4, p. 357, doi. 10.1007/s11018-016-0971-8

By:

Makarov, V.;
Potomskii, S.

Publication type:

Article

Optimization of Vehicle Body Current and Overvoltage Balance Based on Grounding System Parameters of High Speed Train.

Published in:

Railway Standard Design, 2024, p. 161, doi. 10.13238/j.issn.1004-2954.202212060008

By:

LIU Jiancheng;
SUN Chuanming;
ZHANG Zuoqin;
YAN Jingdong;
XIAO Song;
GUO Yujun

Publication type:

Article

THE FOCUSING NLS ON EXTERIOR DOMAINS IN THREE DIMENSIONS.

Published in:

Communications on Pure & Applied Analysis, 2017, v. 16, n. 6, p. 2269, doi. 10.3934/cpaa.2017112

By:

KAI YANG

Publication type:

Article

Genetic Algorithms and Particle Swarm Optimization Mechanisms for Through-Silicon Via (TSV) Noise Coupling.

Published in:

Applied Computational Intelligence & Soft Computing, 2021, p. 1, doi. 10.1155/2021/8830395

By:

Ait Belaid, Khaoula;
Belahrach, H.;
Ayad, H.

Publication type:

Article

Identification of Random/Clustered TSV Defects in 3D IC During Pre-Bond Testing.

Published in:

Journal of Electronic Testing, 2019, v. 35, n. 5, p. 741, doi. 10.1007/s10836-019-05824-w

By:

Maity, Dilip Kumar;
Roy, Surajit Kumar;
Giri, Chandan

Publication type:

Article

Optimization of Test Wrapper for TSV Based 3D SOCs.

Published in:

Journal of Electronic Testing, 2016, v. 32, n. 5, p. 511, doi. 10.1007/s10836-016-5610-4

By:

Roy, Surajit;
Giri, Chandan;
Rahaman, Hafizur

Publication type:

Article

A Test-Ordering Based Temperature-Cycling Acceleration Technique for 3D Stacked ICs.

Published in:

Journal of Electronic Testing, 2015, v. 31, n. 5/6, p. 503, doi. 10.1007/s10836-015-5541-5

By:

Aghaee, Nima;
Peng, Zebo;
Eles, Petru

Publication type:

Article

A Novel Wafer Manipulation Method for Yield Improvement and Cost Reduction of 3D Wafer-on-Wafer Stacked ICs.

Published in:

Journal of Electronic Testing, 2014, v. 30, n. 1, p. 57, doi. 10.1007/s10836-013-5429-1

By:

Zhang, Bei;
Agrawal, Vishwani

Publication type:

Article

Bringing 3D ICs to Aerospace: Needs for Design Tools and Methodologies.

Published in:

Journal of Information & Communication Convergence Engineering, 2017, v. 15, n. 2, p. 117, doi. 10.6109/jicce.2017.15.2.117

By:

Sung Kyu Lim

Publication type:

Article

Artificial intelligence deep learning for 3D IC reliability prediction.

Published in:

Scientific Reports, 2022, v. 12, n. 1, p. 1, doi. 10.1038/s41598-022-08179-z

By:

Hsu, Po-Ning;
Shie, Kai-Cheng;
Chen, Kuan-Peng;
Tu, Jing-Chen;
Wu, Cheng-Che;
Tsou, Nien-Ti;
Lo, Yu-Chieh;
Chen, Nan-Yow;
Hsieh, Yong-Fen;
Wu, Mia;
Chen, Chih;
Tu, King-Ning

Publication type:

Article

Non-Uniform B-Spline Surface Fitting from Unordered 3D Point Clouds for As-Built Modeling.

Published in:

Computer-Aided Civil & Infrastructure Engineering, 2016, v. 31, n. 7, p. 483, doi. 10.1111/mice.12192

By:

Dimitrov, Andrey;
Gu, Rongqi;
Golparvar‐Fard, Mani

Publication type:

Article

A Modified Iterative Closest Point Algorithm for 3D Point Cloud Registration.

Published in:

Computer-Aided Civil & Infrastructure Engineering, 2016, v. 31, n. 7, p. 515, doi. 10.1111/mice.12184

By:

Marani, Roberto;
Renò, Vito;
Nitti, Massimiliano;
D'Orazio, Tiziana;
Stella, Ettore

Publication type:

Article

Recovery of TSV Based 3D IC.

Published in:

International Journal of Advanced Research in Computer Science, 2017, v. 8, n. 5, p. 149

By:

Ghosh, Sudeep;
Banik, Mandira;
Chakraborty, Tridib

Publication type:

Article

Microstructure Evolution and Protrusion of Electroplated Cu-Filled Through-Silicon Vias Subjected to Thermal Cyclic Loading.

Published in:

Journal of Electronic Materials, 2017, v. 46, n. 10, p. 5916, doi. 10.1007/s11664-017-5577-7

By:

Chen, Si;
An, Tong;
Qin, Fei;
Chen, Pei

Publication type:

Article

In Situ Electromigration in Cu-Sn and Ni-Sn Critical Solder Length for Three-Dimensional Integrated Circuits.

Published in:

Journal of Electronic Materials, 2016, v. 45, n. 12, p. 6163, doi. 10.1007/s11664-016-4874-x

By:

Huang, Y.;
Chen, C.;
Lee, B.;
Chen, H.;
Wang, C.;
Wu, Albert

Publication type:

Article

Evolution of the Intermetallic Compounds in Ni/Sn-2.5Ag/Ni Microbumps for Three-Dimensional Integrated Circuits.

Published in:

Journal of Electronic Materials, 2015, v. 44, n. 10, p. 3888, doi. 10.1007/s11664-015-3925-z

By:

Hsu, H.;
Huang, Y.;
Huang, S.;
Chang, T.;
Wu, Albert

Publication type:

Article

Inhibition of Gold Embrittlement in Micro-joints for Three-Dimensional Integrated Circuits.

Published in:

Journal of Electronic Materials, 2014, v. 43, n. 11, p. 4262, doi. 10.1007/s11664-014-3360-6

By:

Shih, W.;
Yang, T.;
Chuang, H.;
Kuo, M.;
Kao, C.

Publication type:

Article

Interfacial Reactions in Cu/Ga and Cu/Ga/Cu Couples.

Published in:

Journal of Electronic Materials, 2014, v. 43, n. 1, p. 204, doi. 10.1007/s11664-013-2721-x

By:

Lin, Shih-kang;
Cho, Cheng-liang;
Chang, Hao-miao

Publication type:

Article

Evaluation of Electromigration Behaviors of Pb-Free Microbumps in Three-Dimensional Integrated Circuit Packaging.

Published in:

Journal of Electronic Materials, 2014, v. 43, n. 1, p. 236, doi. 10.1007/s11664-013-2840-4

By:

Hsu, Hao;
Lin, Tzu-Yang;
Ouyang, Fan-Yi

Publication type:

Article

Evaluation of Strain Measurement in a Die-to-Interposer Chip Using In Situ Synchrotron X-Ray Diffraction and Finite-Element Analysis.

Published in:

Journal of Electronic Materials, 2014, v. 43, n. 1, p. 52, doi. 10.1007/s11664-013-2828-0

By:

Hsu, Hsueh-Hsien;
Chiu, Tz-Cheng;
Chang, Tao-Chih;
Huang, Shin-Yi;
Lee, Hsin-Yi;
Ku, Ching-Shun;
Lin, Yang-Yi;
Su, Chien-Hao;
Chou, Li-Wei;
Ouyang, Yao-Tsung;
Huang, YI-Ting;
Wu, Albert

Publication type:

Article

Intermetallic Compound Formation Mechanisms for Cu-Sn Solid-Liquid Interdiffusion Bonding.

Published in:

Journal of Electronic Materials, 2012, v. 41, n. 9, p. 2453, doi. 10.1007/s11664-012-2060-3

By:

Liu, H.;
Wang, K.;
Aasmundtveit, K.E.;
Hoivik, N.

Publication type:

Article

Effect of Copper TSV Annealing on Via Protrusion for TSV Wafer Fabrication.

Published in:

Journal of Electronic Materials, 2012, v. 41, n. 9, p. 2533, doi. 10.1007/s11664-012-2117-3

By:

Heryanto, A.;
Putra, W.N.;
Trigg, A.;
Gao, S.;
Kwon, W.S.;
Che, F.X.;
Ang, X.F.;
Wei, J.;
I Made, R.;
Gan, C.L.;
Pey, K.L.

Publication type:

Article

Effect of Prebonding Anneal on the Microstructure Evolution and Cu-Cu Diffusion Bonding Quality for Three-Dimensional Integration.

Published in:

Journal of Electronic Materials, 2012, v. 41, n. 9, p. 2567, doi. 10.1007/s11664-012-2153-z

By:

Peng, L.;
Lim, D.F.;
Zhang, L.;
Li, H.Y.;
Tan, C.S.

Publication type:

Article

Low-Resistance Cu-Sn Electroplated-Evaporated Microbumps for 3D Chip Stacking.

Published in:

Journal of Electronic Materials, 2012, v. 41, n. 4, p. 720, doi. 10.1007/s11664-012-1949-1

By:

Murugesan, M.;
Ohara, Y.;
Fukushima, T.;
Tanaka, T.;
Koyanagi, M.

Publication type:

Article

Electrical and Mechanical Properties of Through-Silicon Vias and Bonding Layers in Stacked Wafers for 3D Integrated Circuits.

Published in:

Journal of Electronic Materials, 2012, v. 41, n. 2, p. 232, doi. 10.1007/s11664-011-1767-x

By:

Hwang, Sung-Hwan;
Kim, Byoung-Joon;
Lee, Ho-Young;
Joo, Young-Chang

Publication type:

Article

Influence of Bonding Parameters on the Interaction Between Cu and Noneutectic Sn-In Solder Thin Films.

Published in:

Journal of Electronic Materials, 2011, v. 40, n. 11, p. 2329, doi. 10.1007/s11664-011-1747-1

By:

Sasangka, Wardhana;
Gan, Chee;
Thompson, Carl;
Choi, Won;
Wei, Jun

Publication type:

Article

Thermo-compression bonding process characteristics and shape control of Cu-pillar microbump joints by optimizing of solder melting.

Published in:

Journal of Materials Science: Materials in Electronics, 2022, v. 33, n. 13, p. 10471, doi. 10.1007/s10854-022-08034-x

By:

Fang, Mingang;
Tang, Chu;
Chen, Yiming;
Li, Junhui;
Chen, Zhuo;
Wang, Fuliang;
Zhu, Wenhui

Publication type:

Article

Bonding strength enhancement by Ag–Zn–Cu intermetallic compounds and microscale tapers array fabricated by femtosecond laser.

Published in:

Journal of Materials Science: Materials in Electronics, 2021, v. 32, n. 14, p. 19543, doi. 10.1007/s10854-021-06473-6

By:

Wang, Cong;
Li, Chuanqiang;
Luo, Zhi;
Li, Ming;
Lin, Nai;
Ding, Kaiwen;
Man, Shu;
Duan, Ji'an

Publication type:

Article

Intermetallic compounds in 3D integrated circuits technology: a brief review.

Published in:

Science & Technology of Advanced Materials, 2017, v. 18, n. 1, p. 693, doi. 10.1080/14686996.2017.1364975

By:

Annuar, Syahira;
Mahmoodian, Reza;
Hamdi, Mohd;
Tu, King-Ning

Publication type:

Article

Intermetallic compounds in 3D integrated circuits technology: a brief review.

Published in:

Science & Technology of Advanced Materials, 2017, v. 18, n. 1, p. 693, doi. 10.1080/14686996.2017.1364975

By:

Annuar, Syahira;
Mahmoodian, Reza;
Hamdi, Mohd;
Tu, King-Ning

Publication type:

Article

Network-on-chips on 3-D ICs: Past, Present, and Future.

Published in:

IETE Technical Review, 2012, v. 29, n. 4, p. 318, doi. 10.4103/0256-4602.101313

By:

Pawan Kumar, M.;
Murali, Srinivasan;
Veezhinathan, Kamakoti

Publication type:

Article

First-Principles Study of Cu Addition on Mechanical Properties of Ni 3 Sn 4 -Based Intermetallic Compounds.

Published in:

Metals (2075-4701), 2024, v. 14, n. 1, p. 64, doi. 10.3390/met14010064

By:

Yao, Jinye;
Wang, Li;
Guo, Shihao;
Li, Xiaofu;
Chen, Xiangxu;
Shang, Min;
Ma, Haoran;
Ma, Haitao

Publication type:

Article

Electrical and Mechanical Analysis of Different TSV Geometries.

Published in:

Metals (2075-4701), 2020, v. 10, n. 4, p. 467, doi. 10.3390/met10040467

By:

Jeong, Il Ho;
Eslami Majd, Alireza;
Jung, Jae Pil;
Ekere, Nduka Nnamdi

Publication type:

Article

3D sound field reproduction in arbitrary listening zone for multichannel system.

Published in:

Electronics Letters (Wiley-Blackwell), 2016, v. 52, n. 24, p. 2013, doi. 10.1049/el.2016.3305

By:

Song Wang;
Ruimin Hu;
Shihong Chen;
Xiaochen Wang;
Yuhong Yang;
Weiping Tu

Publication type:

Article

Skew cancellation technique for >256-Gbyte/s high-bandwidth memory (HBM).

Published in:

Electronics Letters (Wiley-Blackwell), 2016, v. 52, n. 13, p. 1155, doi. 10.1049/el.2015.4001

By:

Ahn, K.;
Yoo, C.

Publication type:

Article

3-D non-uniform time step locally one-dimensional FDTD method.

Published in:

Electronics Letters (Wiley-Blackwell), 2016, v. 52, n. 12, p. 993, doi. 10.1049/el.2016.1101

By:

Zaifeng Yang;
Eng Leong Tan

Publication type:

Article

Visual surveillance using wide-angle camera and laser range finder.

Published in:

Electronics Letters (Wiley-Blackwell), 2016, v. 52, n. 6, p. 445, doi. 10.1049/el.2016.0022

By:

Song, T.-H.;
Ha, J.-E.

Publication type:

Article

Coupling capacitance in through-silicon vias:non-homogeneous medium effect.

Published in:

Electronics Letters (Wiley-Blackwell), 2016, v. 52, n. 2, p. 152, doi. 10.1049/el.2015.3141

By:

Ramadan, T.;
Yahya, E.;
Ismail, Y.;
Dessouky, M.

Publication type:

Article

On-chip trimming circuit based on embedded one-time-programming memory for magnetic wireless interlayer transmission module.

Published in:

Electronics Letters (Wiley-Blackwell), 2015, v. 51, n. 24, p. 2064, doi. 10.1049/el.2015.2275

By:

Liang-Shun Chang;
Kuei-Hung Shen;
Ming-Jinn Tsai;
Chrong-Jung Lin;
Ya-Chin King

Publication type:

Article

Ant Colony Algorithm for Energy Saving to Optimize Three-Dimensional Bonding Chips' Thermal Layout.

Published in:

Technologies (2227-7080), 2023, v. 11, n. 5, p. 122, doi. 10.3390/technologies11050122

By:

Sun, Bihao;
Yang, Peizhi;
Zhu, Zhiyuan

Publication type:

Article

SnO Nanosheet Transistor with Remarkably High Hole Effective Mobility and More than Six Orders of Magnitude On-Current/Off-Current.

Published in:

Nanomaterials (2079-4991), 2025, v. 15, n. 9, p. 640, doi. 10.3390/nano15090640

By:

Chen, Kuan-Chieh;
Wu, Jiancheng;
Pooja, Pheiroijam;
Chin, Albert

Publication type:

Article

Enhanced Copper Bonding Interfaces by Quenching to Form Wrinkled Surfaces.

Published in:

Nanomaterials (2079-4991), 2024, v. 14, n. 10, p. 861, doi. 10.3390/nano14100861

By:

Lu, Tsan-Feng;
Yen, Yu-Ting;
Wang, Pei-Wen;
Cheng, Yuan-Fu;
Chen, Cheng-Hsiang;
Wu, YewChung Sermon

Publication type:

Article

Enhanced Nanotwinned Copper Bonding through Epoxy-Induced Copper Surface Modification.

Published in:

Nanomaterials (2079-4991), 2024, v. 14, n. 9, p. 771, doi. 10.3390/nano14090771

By:

Lu, Tsan-Feng;
Wang, Pei-Wen;
Cheng, Yuan-Fu;
Yen, Yu-Ting;
Wu, YewChung Sermon

Publication type:

Article

Cu-Based Thermocompression Bonding and Cu/Dielectric Hybrid Bonding for Three-Dimensional Integrated Circuits (3D ICs) Application.

Published in:

Nanomaterials (2079-4991), 2023, v. 13, n. 17, p. 2490, doi. 10.3390/nano13172490

By:

Huang, Yuan-Chiu;
Lin, Yu-Xian;
Hsiung, Chien-Kang;
Hung, Tzu-Heng;
Chen, Kuan-Neng

Publication type:

Article

A Novel Source/Drain Extension Scheme with Laser-Spike Annealing for Nanosheet Field-Effect Transistors in 3D ICs.

Published in:

Nanomaterials (2079-4991), 2023, v. 13, n. 5, p. 868, doi. 10.3390/nano13050868

By:

Lee, Sanguk;
Jeong, Jinsu;
Kang, Bohyeon;
Lee, Seunghwan;
Lee, Junjong;
Lim, Jaewan;
Hwang, Hyeonjun;
Ahn, Sungmin;
Baek, Rockhyun

Publication type:

Article

Remarkably High-Performance Nanosheet GeSn Thin-Film Transistor.

Published in:

Nanomaterials (2079-4991), 2022, v. 12, n. 2, p. 261, doi. 10.3390/nano12020261

By:

Yen, Te Jui;
Chin, Albert;
Chan, Weng Kent;
Chen, Hsin-Yi Tiffany;
Gritsenko, Vladimir

Publication type:

Article