Works matching DE "THREE-dimensional integrated circuits"
Results: 139
THE ADOPTION OF NOVEL COOLING LIQUIDS FOR ENHANCING HEAT TRANSFER PERFORMANCE OF 3-D INTEGRATED CIRCUITS WITH EMBEDDED MICRO-CHANNEL.
- Published in:
- Thermal Science, 2025, v. 29, n. 1A, p. 227, doi. 10.2298/TSCI240414175H
- By:
- Publication type:
- Article
Intermetallic compounds in 3D integrated circuits technology: a brief review.
- Published in:
- Science & Technology of Advanced Materials, 2017, v. 18, n. 1, p. 693, doi. 10.1080/14686996.2017.1364975
- By:
- Publication type:
- Article
Intermetallic compounds in 3D integrated circuits technology: a brief review.
- Published in:
- Science & Technology of Advanced Materials, 2017, v. 18, n. 1, p. 693, doi. 10.1080/14686996.2017.1364975
- By:
- Publication type:
- Article
Facile Preparation of the Porous PDMS Oil-Absorbent for Oil/Water Separation.
- Published in:
- Advanced Materials Interfaces, 2017, v. 4, n. 3, p. n/a, doi. 10.1002/admi.201600862
- By:
- Publication type:
- Article
Ant Colony Algorithm for Energy Saving to Optimize Three-Dimensional Bonding Chips' Thermal Layout.
- Published in:
- Technologies (2227-7080), 2023, v. 11, n. 5, p. 122, doi. 10.3390/technologies11050122
- By:
- Publication type:
- Article
Technology Evaluation and Selection of 3DIC Integration Using a Three-Stage Fuzzy MCDM.
- Published in:
- Sustainability (2071-1050), 2016, v. 8, n. 2, p. 114, doi. 10.3390/su8020114
- By:
- Publication type:
- Article
AN EQUIVALENT THERMAL CONDUCTIVITY MODEL OF THROUGH SILICON VIA ARRAYS FOR THERMAL ANALYSIS IN 3-D INTEGRATED CIRCUITS.
- Published in:
- Thermal Science, 2024, v. 28, n. 5B, p. 4081, doi. 10.2298/TSCI230919129X
- By:
- Publication type:
- Article
THERMAL MODELLING AND ANALYSIS OF 3-D INTEGRATED CIRCUITS WITH IRREGULAR STRUCTURE.
- Published in:
- Thermal Science, 2023, v. 27, n. 5B, p. 4193, doi. 10.2298/TSCI220805061R
- By:
- Publication type:
- Article
OPTIMIZED METHOD FOR THERMAL THROUGH SILICON VIA PLACEMENT WITH NON-UNIFORM HEAT SOURCES IN 3-D-IC.
- Published in:
- Thermal Science, 2023, v. 27, n. 5A, p. 3551, doi. 10.2298/TSCI220801021D
- By:
- Publication type:
- Article
AN ANALYTICAL THERMAL MODEL FOR THE 3-D INTEGRATED CIRCUIT WITH NEW-TYPE THROUGH SILICON VIA.
- Published in:
- Thermal Science, 2023, v. 27, n. 3B, p. 2391, doi. 10.2298/TSCI220621140X
- By:
- Publication type:
- Article
THERMAL MANAGEMENT OF 3-D INTEGRATED CIRCUITS WITH SPECIAL STRUCTURES.
- Published in:
- Thermal Science, 2021, v. 25, n. 3B, p. 2221, doi. 10.2298/TSCI200115109W
- By:
- Publication type:
- Article
THERMAL OPTIMIZATION OF A 3-D INTEGRATED CIRCUIT.
- Published in:
- Thermal Science, 2020, v. 24, n. 4, p. 2615, doi. 10.2298/TSCI2004615W
- By:
- Publication type:
- Article
THERMAL MODEL FOR 3-D INTEGRATED CIRCUITS WITH INTEGRATED MLGNR-BASED THROUGH SILICON VIA.
- Published in:
- Thermal Science, 2020, v. 24, n. 3B, p. 2067, doi. 10.2298/TSCI180507321X
- By:
- Publication type:
- Article
THERMAL MANAGEMENT OF THE THROUGH SILICON VIAS IN 3-D INTEGRATED CIRCUITS.
- Published in:
- Thermal Science, 2019, v. 23, n. 4, p. 2157, doi. 10.2298/TSCI1904157W
- By:
- Publication type:
- Article
AN ANALYTICAL THERMAL MODEL FOR THREE-DIMENSIONAL INTEGRATED CIRCUITS WITH INTEGRATED MICRO-CHANNEL COOLING.
- Published in:
- Thermal Science, 2017, v. 21, n. 4, p. 1601, doi. 10.2298/TSCI160716041W
- By:
- Publication type:
- Article
A low-cost concurrent TSV test architecture with lossless test output compression scheme.
- Published in:
- PLoS ONE, 2019, v. 14, n. 8, p. 1, doi. 10.1371/journal.pone.0221043
- By:
- Publication type:
- Article
FAILURE ANALYSIS FOR HARDWARE ASSURANCE AND SECURITY.
- Published in:
- Electronic Device Failure Analysis, 2019, v. 21, n. 3, p. 16, doi. 10.31399/asm.edfa.2019-3.p016
- By:
- Publication type:
- Article
3-D TECHNOLOGY: FAILURE ANALYSIS CHALLENGES.
- Published in:
- Electronic Device Failure Analysis, 2016, v. 18, n. 4, p. 24, doi. 10.31399/asm.edfa.2016-4.p024
- By:
- Publication type:
- Article
3D Integration and Packaging of mmWave Circuits and Antennas: Opportunities and Challenges.
- Published in:
- Microwave Journal, 2016, v. 59, n. 2, p. 22
- By:
- Publication type:
- Article
New Tile Structure for Microwave Modules Using Solderless Vertical Interconnections.
- Published in:
- Microwave Journal, 2012, v. 55, n. 10, p. 76
- By:
- Publication type:
- Article
Development of thin quartz glass utilising through-glass-via (TGV) formation by dry etching technology.
- Published in:
- Micro & Nano Letters (Wiley-Blackwell), 2016, v. 11, n. 10, p. 568, doi. 10.1049/mnl.2016.0242
- By:
- Publication type:
- Article
Coordinated 3D spectrum utilization for B5G indoor HetNets: A collaborated crowdsensing approach.
- Published in:
- IET Communications (Wiley-Blackwell), 2022, v. 16, n. 2, p. 111, doi. 10.1049/cmu2.12322
- By:
- Publication type:
- Article
Three-Dimensional Numerical Modeling of Heat and Moisture Transfer in Natural Rubber Sheet Drying Process.
- Published in:
- Drying Technology, 2015, v. 33, n. 9, p. 1124, doi. 10.1080/07373937.2015.1014910
- By:
- Publication type:
- Article
Non-Uniform B-Spline Surface Fitting from Unordered 3D Point Clouds for As-Built Modeling.
- Published in:
- Computer-Aided Civil & Infrastructure Engineering, 2016, v. 31, n. 7, p. 483, doi. 10.1111/mice.12192
- By:
- Publication type:
- Article
A Modified Iterative Closest Point Algorithm for 3D Point Cloud Registration.
- Published in:
- Computer-Aided Civil & Infrastructure Engineering, 2016, v. 31, n. 7, p. 515, doi. 10.1111/mice.12184
- By:
- Publication type:
- Article
Genetic Algorithms and Particle Swarm Optimization Mechanisms for Through-Silicon Via (TSV) Noise Coupling.
- Published in:
- Applied Computational Intelligence & Soft Computing, 2021, p. 1, doi. 10.1155/2021/8830395
- By:
- Publication type:
- Article
Solid-State Power Density Enabling Unprecedented EMP Capabilities.
- Published in:
- Microwave Journal, 2020, v. 63, n. 12, p. 70
- By:
- Publication type:
- Article
Fast arithmetic in algorithmic self-assembly.
- Published in:
- Natural Computing, 2016, v. 15, n. 1, p. 115, doi. 10.1007/s11047-015-9512-7
- By:
- Publication type:
- Article
基于TSV技术的3D电感的设计与实现.
- Published in:
- Electronic Components & Materials, 2018, v. 37, n. 6, p. 49, doi. 10.14106/j.cnki.1001-2028.2018.06.010
- By:
- Publication type:
- Article
Adaptive Bit Allocation for 3D Video Coding.
- Published in:
- Circuits, Systems & Signal Processing, 2017, v. 36, n. 5, p. 2102, doi. 10.1007/s00034-016-0402-8
- By:
- Publication type:
- Article
Accurate TSV Number Minimization in High-Level Synthesis.
- Published in:
- Journal of Information Science & Engineering, 2011, v. 27, n. 5, p. 1527
- By:
- Publication type:
- Article
Advanced Electronic Interconnection.
- Published in:
- 2019
- By:
- Publication type:
- Editorial
Broadband Microwave Signal Dissipation in Nanostructured Copper Oxide at Air‐film Interface**.
- Published in:
- Electroanalysis, 2020, v. 32, n. 12, p. 2795, doi. 10.1002/elan.202060246
- By:
- Publication type:
- Article
Cellulose Nanofiber Supported 3D Interconnected BN Nanosheets for Epoxy Nanocomposites with Ultrahigh Thermal Management Capability.
- Published in:
- Advanced Functional Materials, 2017, v. 27, n. 5, p. n/a, doi. 10.1002/adfm.201604754
- By:
- Publication type:
- Article
Pipelined extended-counting ${\bf I\Delta \Sigma}$IΔΣ for 3D-stacked CMOS image sensors.
- Published in:
- Electronics Letters (Wiley-Blackwell), 2020, v. 56, n. 23, p. 1239, doi. 10.1049/el.2020.2030
- By:
- Publication type:
- Article
Different degradation mechanism by conduction region in AsTeGeSiN threshold switching device.
- Published in:
- Electronics Letters (Wiley-Blackwell), 2020, v. 56, n. 22, p. 1202, doi. 10.1049/el.2020.1946
- By:
- Publication type:
- Article
Enhanced Copper Bonding Interfaces by Quenching to Form Wrinkled Surfaces.
- Published in:
- Nanomaterials (2079-4991), 2024, v. 14, n. 10, p. 861, doi. 10.3390/nano14100861
- By:
- Publication type:
- Article
Enhanced Nanotwinned Copper Bonding through Epoxy-Induced Copper Surface Modification.
- Published in:
- Nanomaterials (2079-4991), 2024, v. 14, n. 9, p. 771, doi. 10.3390/nano14090771
- By:
- Publication type:
- Article
Cu-Based Thermocompression Bonding and Cu/Dielectric Hybrid Bonding for Three-Dimensional Integrated Circuits (3D ICs) Application.
- Published in:
- Nanomaterials (2079-4991), 2023, v. 13, n. 17, p. 2490, doi. 10.3390/nano13172490
- By:
- Publication type:
- Article
A Novel Source/Drain Extension Scheme with Laser-Spike Annealing for Nanosheet Field-Effect Transistors in 3D ICs.
- Published in:
- Nanomaterials (2079-4991), 2023, v. 13, n. 5, p. 868, doi. 10.3390/nano13050868
- By:
- Publication type:
- Article
Remarkably High-Performance Nanosheet GeSn Thin-Film Transistor.
- Published in:
- Nanomaterials (2079-4991), 2022, v. 12, n. 2, p. 261, doi. 10.3390/nano12020261
- By:
- Publication type:
- Article
Fabrication of Low Cost and Low Temperature Poly-Silicon Nanowire Sensor Arrays for Monolithic Three-Dimensional Integrated Circuits Applications.
- Published in:
- Nanomaterials (2079-4991), 2020, v. 10, n. 12, p. 2488, doi. 10.3390/nano10122488
- By:
- Publication type:
- Article
Electrical signal interference minimization using appropriate core material for 3D integrate circuit at high frequency applications.
- Published in:
- International Journal of Electrical & Computer Engineering (2088-8708), 2024, v. 14, n. 3, p. 2500, doi. 10.11591/ijece.v14i3.pp2500-2507
- By:
- Publication type:
- Article
Fast power density aware three‐dimensional integrated circuit floorplanning for hard macroblocks using best operator combination genetic algorithm.
- Published in:
- International Journal of Circuit Theory & Applications, 2023, v. 51, n. 10, p. 4879, doi. 10.1002/cta.3672
- By:
- Publication type:
- Article
Design and Demonstration of Glass Panel Embedding for 3D System Packages for Heterogeneous Integration Applications.
- Published in:
- Journal of Microelectronic & Electronic Packaging, 2019, v. 16, n. 3, p. 124, doi. 10.4071/imaps.930748
- By:
- Publication type:
- Article
Heterogeneous Integration of a 300-mm Silicon Photonics-CMOS Wafer Stack by Direct Oxide Bonding and Via-Last 3-D Interconnection.
- Published in:
- Journal of Microelectronic & Electronic Packaging, 2016, v. 13, n. 2, p. 71, doi. 10.4071/imaps.494
- By:
- Publication type:
- Article
High Shear Speed Characteristics of Sub-100 μm Low Alpha SAC105 Solder Bump Directly Fabricated on Cu Filled Through Si Via for 3D Integration.
- Published in:
- Journal of Microelectronic & Electronic Packaging, 2015, v. 12, n. 3, p. 161, doi. 10.4071/imaps.416
- By:
- Publication type:
- Article
Thermal Performance of 3D IC Integration with Through-Silicon Via (TSV).
- Published in:
- Journal of Microelectronic & Electronic Packaging, 2012, v. 9, n. 2, p. 97, doi. 10.4071/imaps.309
- By:
- Publication type:
- Article
TSV Manufacturing Fault Modeling and Diagnosis Based on Multi-Tone Dither.
- Published in:
- Journal of Advanced Computational Intelligence & Intelligent Informatics, 2019, v. 23, n. 1, p. 42, doi. 10.20965/jaciii.2019.p0042
- By:
- Publication type:
- Article
Magnetic Field-Directed Self-Assembly of Magnetic Nanoparticle Chains in Bulk Polymers.
- Published in:
- Particle & Particle Systems Characterization, 2013, v. 30, n. 9, p. 759, doi. 10.1002/ppsc.201300101
- By:
- Publication type:
- Article