Works matching DE "THERMAL shock"

Results: 1411

Enhancing Ball Grid Array (BGA) Component on Printed Circuit Board (PCB) Solder Joint Integrity with Antimony Element.

Published in:

Journal of Failure Analysis & Prevention, 2025, v. 25, n. 2, p. 813, doi. 10.1007/s11668-025-02144-4

By:

Jalar, Azman;
Lim, Ee May;
Abu Bakar, Maria;
Ismail, Adlil Aizat;
Che Ani, Fakhrozi;
Tan, Choo Par

Publication type:

Article

Modeling of Thermal Shock-Induced Fracture Propagation Based on Phase-Field Approach.

Published in:

Fluid Dynamics & Materials Processing, 2025, v. 21, n. 4, p. 851, doi. 10.32604/fdmp.2024.056729

By:

Liu, Zhuang;
Fan, Tingen;
Lu, Qianli;
Guo, Jianchun;
Yang, Renfeng;
Wang, Haifeng

Publication type:

Article

EXPLORING HEAT SHOCK PROTEIN RESPONSE IN BREAD WHEAT WITH DIVERSE HEAT SENSITIVITY.

Published in:

SABRAO Journal of Breeding & Genetics, 2025, v. 57, n. 2, p. 599, doi. 10.54910/sabrao2025.57.2.18

By:

FAZAA, M. A.;
ESMAIL, A. M.;
RASHED, M. A.;
BADR, A. M.;
IBRAHIM, K. I. M.;
MOHAMED, A. Z. A.;
AL ABOUD, N. M.;
MANSOUR, E.

Publication type:

Article

Dynamic hydro-thermo-mechanical response of the saturated cylindrical unlined tunnel based on the coupled poro-visco-thermoelastic model with new multi-dual-phase-lag heat conduction law.

Published in:

Acta Mechanica, 2025, v. 236, n. 5, p. 2943, doi. 10.1007/s00707-025-04299-5

By:

Wang, Dechen;
Li, Chenlin;
Zheng, Liangcheng

Publication type:

Article

Revival of the Escherichia coli heat shock response after two decades with a small Hsp in a critical but distinct act.

Published in:

Biological Chemistry, 2025, v. 406, n. 1/2, p. 29, doi. 10.1515/hsz-2024-0140

By:

Miwa, Tsukumi;
Taguchi, Hideki

Publication type:

Article

Hot corrosion behavior of Y3NbO7 as thermal barrier coating material.

Published in:

Surface Engineering, 2025, v. 41, n. 2, p. 176, doi. 10.1177/02670844251315284

By:

P. V., Sachin Raj;
S. P., Kumaresh Babu;
P. V., Adarsh Vijayan;
S., Manivannan

Publication type:

Article

Cyclic oxidation of slurry silicide-aluminide coatings formed on Ti-6Al-4V alloy.

Published in:

Surface Engineering, 2023, v. 39, n. 6, p. 738, doi. 10.1080/02670844.2023.2257856

By:

Kochmańska, Agnieszka;
Kochmański, Paweł

Publication type:

Article

Adhesion behaviour of borided AISI 4140 steel.

Published in:

Surface Engineering, 2022, v. 38, n. 10-12, p. 977, doi. 10.1080/02670844.2023.2180856

By:

Márquez-Cortés, R.;
Martínez-Trinidad, J.;
García-León, R. A.

Publication type:

Article

Effect of thermal conductivity on micro-arc oxidation coatings.

Published in:

Surface Engineering, 2022, v. 38, n. 1, p. 44, doi. 10.1080/02670844.2022.2026665

By:

Dai, Weibing;
Zhang, Xiulu;
Li, Changyou;
Yao, Guo

Publication type:

Article

Electroless Ni–B–MMT nanocomposite on magnesium alloy.

Published in:

Surface Engineering, 2021, v. 37, n. 9, p. 1194, doi. 10.1080/02670844.2021.1959287

By:

Miri, T.;
Seifzadeh, D.;
Rajabalizadeh, Z.

Publication type:

Article

The influence of pyrolysing Al2O3 precursor on the high temperature properties of the YSZ-Al2O3 composite coating.

Published in:

Surface Engineering, 2021, v. 37, n. 8, p. 991, doi. 10.1080/02670844.2020.1840692

By:

Taghi-Ramezani, Saeid;
Valefi, Zia;
Mirjani, Masud;
Ghasemi, Reza

Publication type:

Article

Influence of mechanical properties on thermal shock resistance of TBCs.

Published in:

Surface Engineering, 2021, v. 37, n. 5, p. 572, doi. 10.1080/02670844.2020.1812478

By:

Gao, Minghao;
Xu, Na;
Zhang, Jia;
Luan, Shengjia;
Chang, Hui;
Hou, Wanliang;
Chang, Xinchun

Publication type:

Article

Thermal shock behaviours of atmospheric plasma sprayed NiCrAlY/Al2O3–20%TiO2 gradient coating on Cu–Be alloy.

Published in:

Surface Engineering, 2020, v. 36, n. 10, p. 1113, doi. 10.1080/02670844.2020.1766866

By:

Li, Min;
Wei, Kun Xia;
Wei, Wei;
Du, Qing Bo;
Zhao, Xiao Bing;
Hu, Jing

Publication type:

Article

Erosion behavior of Ni-based coating under high-speed hot airflow.

Published in:

Surface Engineering, 2019, v. 35, n. 8, p. 710, doi. 10.1080/02670844.2019.1573343

By:

Men, Xiangdong;
Tao, Fenghe;
Gan, Lin;
Zhao, Fang

Publication type:

Article

Effect of MgO micro-powder on the characteristics of micro-arc oxidation coatings.

Published in:

Surface Engineering, 2019, v. 35, n. 7, p. 627, doi. 10.1080/02670844.2018.1557996

By:

Wang, Ping;
Gong, Ze Yu;
Hu, Jie;
Pu, Jun;
Cao, Wen Jie

Publication type:

Article

Effect of cryogenic thermal cycling on SiC-modified C/C composites.

Published in:

Surface Engineering, 2017, v. 33, n. 3, p. 237, doi. 10.1080/02670844.2016.1216053

By:

Zhang, M.-Y.;
Li, K.-Z.;
Shi, X.-H.;
Liu, N.-K.

Publication type:

Article

Double layer ZrSi2-ZrC-SiC/SiC oxidation protective coating for carbon/carbon composites.

Published in:

Surface Engineering, 2015, v. 31, n. 5, p. 335, doi. 10.1179/1743294414Y.0000000428

By:

Hu, M. H.;
Li, K. Z.;
Li, H. J.;
Wang, B.;
Ma, H. L.

Publication type:

Article

Effect of microstructure and phase of nanostructured YSZ thermal barrier coatings on its thermal shock behaviour.

Published in:

Surface Engineering, 2015, v. 31, n. 1, p. 64, doi. 10.1179/1743294414Y.0000000397

By:

Pourbafrani, M.;
Razavi, R. Shoja;
Bakhshi, S. R.;
Loghman-Estarki, M. R.;
Jamali, H.

Publication type:

Article

Enhancement on thermal shock resistance of TBCs with EP interlayer.

Published in:

Surface Engineering, 2014, v. 30, n. 8, p. 579, doi. 10.1179/1743294414Y.0000000289

By:

Lu, G. X.;
Hao, L. J.;
Cheng, Z. X.;
Ye, F. X.

Publication type:

Article

Studies on thermal shock resistance of TiN and TiAlN coatings under pulsed laser irradiation.

Published in:

Surface Engineering, 2014, v. 30, n. 3, p. 195, doi. 10.1179/1743294413Y.0000000236

By:

Deng, J.;
Li, S.;
Xing, Y.;
Li, Y.

Publication type:

Article

High Tech in 5100 BC: multianalytical approach for characterisation of decorated pottery from Tappeh-Zaghe.

Published in:

Surface Engineering, 2013, v. 29, n. 2, p. 134, doi. 10.1179/1743294412Y.0000000063

By:

Emami, M-A;
Trettin, R

Publication type:

Article

Preparation, properties, and reliability of Cu/Sn composite joints with porous Cu as interlayer for high-temperature resistant packaging.

Published in:

Journal of Materials Science: Materials in Electronics, 2023, v. 34, n. 8, p. 1, doi. 10.1007/s10854-023-10123-4

By:

Wang, Jianqiang;
Duan, Fangcheng;
Wang, Jintao;
Zhang, Weiwei;
Zhang, Luobin;
Li, Mingyu;
Hang, Chunjin;
Chen, Hongtao;
Liu, Jiahao

Publication type:

Article

Reliable epoxy/SiC composite insulation coating for high-voltage power packaging.

Published in:

Journal of Materials Science: Materials in Electronics, 2022, v. 33, n. 26, p. 20508, doi. 10.1007/s10854-022-08865-8

By:

Liang, Yu;
Zhu, Gaojia;
Lu, Guo-Quan;
Mei, Yun-Hui

Publication type:

Article

Thermal shock reliability of micro–nano bimodal Cu–Ag sintered joints.

Published in:

Journal of Materials Science: Materials in Electronics, 2022, v. 33, n. 22, p. 17493, doi. 10.1007/s10854-022-08605-y

By:

Son, Kirak;
Oh, Aesun;
Park, Eunyoung;
Bae, Hyun-Cheol

Publication type:

Article

Influence of 0.05 wt% Pr addition on interfacial microstructure and mechanical properties of Sn–0.3Ag–0.7Cu/Cu solder joint during thermal shocking.

Published in:

Journal of Materials Science: Materials in Electronics, 2022, v. 33, n. 9, p. 7099, doi. 10.1007/s10854-022-07892-9

By:

Zhang, Peng;
Xue, Songbai;
Qian, Cheng;
Wang, Jianhao;
Liu, Lu;
Wu, Jie

Publication type:

Article

Investigating the physical, mechanical, and reliability study of high entropy alloy reinforced Sn–3.0Ag–0.5Cu solder using 1608 chip capacitor/ENIG joints.

Published in:

Journal of Materials Science: Materials in Electronics, 2022, v. 33, n. 7, p. 3687, doi. 10.1007/s10854-021-07562-2

By:

Rajendran, Sri Harini;
Jung, Do Hyun;
Jung, Jae Pil

Publication type:

Article

Modified Ni/Pd/Au-finished DBA substrate for deformation-resistant Ag–Au joint during long-term thermal shock test.

Published in:

Journal of Materials Science: Materials in Electronics, 2021, v. 32, n. 15, p. 20384, doi. 10.1007/s10854-021-06549-3

By:

Liu, Yang;
Chen, Chuantong;
Kim, Dongjin;
Zhang, Zheng;
Long, Xu;
Suganuma, Katsuaki

Publication type:

Article

Chemically integrated nickel-based resistors on printed circuits and its resistance precisely controlled.

Published in:

Journal of Materials Science: Materials in Electronics, 2021, v. 32, n. 13, p. 17143, doi. 10.1007/s10854-021-06159-z

By:

Zhou, Guoyun;
Zhang, Xiumei;
Hong, Yan;
Wang, Yuefeng;
Wang, Chong;
He, Wei;
Wang, Shouxu;
Chen, Yuanming;
Chen, Shijin;
Han, Zhiwei;
Xu, Huan

Publication type:

Article

Cu@Sn@Ag core–shell particles preform for power device packaging under harsh environments.

Published in:

Journal of Materials Science: Materials in Electronics, 2021, v. 32, n. 11, p. 14703, doi. 10.1007/s10854-021-06026-x

By:

Liu, Jiahao;
Liu, Hao;
Yu, Fuwen;
Wang, Xinjie;
Wang, Jianqiang;
Hang, Chunjin;
Chen, Hongtao;
Li, Mingyu

Publication type:

Article

Comparative study between the Sn–Ag–Cu/ENIG and Sn–Ag–Cu/ENEPIG solder joints under extreme temperature thermal shock.

Published in:

Journal of Materials Science: Materials in Electronics, 2021, v. 32, n. 6, p. 6890, doi. 10.1007/s10854-021-05395-7

By:

Tian, Ruyu;
Tian, Yanhong;
Huang, Yilong;
Yang, Dongsheng;
Chen, Cheng;
Sun, Huhao

Publication type:

Article

Effect of epoxy mold compound and package dimensions on the thermomechanical properties of a fan-out package.

Published in:

Journal of Materials Science: Materials in Electronics, 2020, v. 31, n. 9, p. 6835, doi. 10.1007/s10854-020-03243-8

By:

Jeong, Haksan;
Jung, Kwang-Ho;
Lee, Choong-Jae;
Min, Kyung Deuk;
Myung, Woo-Ram;
Jung, Seung-Boo

Publication type:

Article

Comparative study on the reliability of SnPbSb solder joint under common thermal cycling and extreme thermal shocking.

Published in:

Journal of Materials Science: Materials in Electronics, 2020, v. 31, n. 7, p. 5731, doi. 10.1007/s10854-020-03141-z

By:

Wang, Jianhao;
Xue, Songbai;
Wang, Jianxin;
Zhang, Peng;
Tao, Yu;
Wang, Ziyi

Publication type:

Article

Strengthening of DBA substrate with Ni/Ti/Ag metallization for thermal fatigue-resistant Ag sinter joining in GaN power modules.

Published in:

Journal of Materials Science: Materials in Electronics, 2020, v. 31, n. 4, p. 3715, doi. 10.1007/s10854-020-02930-w

By:

Kim, Dongjin;
Chen, Chuantong;
Lee, Seung-Joon;
Nagao, Shijo;
Suganuma, Katsuaki

Publication type:

Article

Effect of extreme thermal shocking on the reliability of Sn50Pb49Sb1/Cu solder joint.

Published in:

Journal of Materials Science: Materials in Electronics, 2020, v. 31, n. 2, p. 1421, doi. 10.1007/s10854-019-02656-4

By:

Wang, Jianhao;
Xue, Songbai;
Zhang, Peng;
Wang, Ziyi;
Zhai, Peizhuo

Publication type:

Article

Void fraction of a Sn–Ag–Cu solder joint underneath a chip resistor and its effect on joint strength and thermomechanical reliability.

Published in:

Journal of Materials Science: Materials in Electronics, 2019, v. 30, n. 17, p. 15889, doi. 10.1007/s10854-019-01935-4

By:

Seo, Wonil;
Ko, Yong-Ho;
Kim, Young-Ho;
Yoo, Sehoon

Publication type:

Article

Ag microflake-reinforced nano-Ag paste with high mechanical reliability for high-temperature applications.

Published in:

Journal of Materials Science: Materials in Electronics, 2019, v. 30, n. 6, p. 5526, doi. 10.1007/s10854-019-00846-8

By:

Yang, Fan;
Hu, Bo;
Peng, Ye;
Hang, Chunjin;
Chen, Hongtao;
Lee, Changwoo;
Wei, Jun;
Li, Mingyu

Publication type:

Article

Improving thermal shock response of interfacial IMCs in Sn-Ag-Cu joints by using ultrathin-Ni/Pd/Au metallization in 3D-IC packages.

Published in:

Journal of Materials Science: Materials in Electronics, 2019, v. 30, n. 3, p. 2342, doi. 10.1007/s10854-018-0507-x

By:

Chou, Tzu-Ting;
Fleshman, Collin Jordon;
Chen, Hao;
Duh, Jenq-Gong

Publication type:

Article

High color rendering index of warm WLED based on LuAG: Ce3+ PiG coated CaAlSiN3: Eu2+ phosphor film for residential lighting applications.

Published in:

Journal of Materials Science: Materials in Electronics, 2018, v. 29, n. 10, p. 8767, doi. 10.1007/s10854-018-8893-7

By:

Wang, Ziming;
Zou, Jun;
Zhang, Canyun;
Shi, Mingming;
Yang, Bobo;
Li, Yang;
Zhou, Heyu;
Liu, Yiming;
Li, Mengtian;
Qian, Xinglu

Publication type:

Article

Reliability performance of tin-bismuth-silver (Sn57.6Bi0.4Ag) solder joints with different content of carbon nano-tubes (CNTs) or nickel (Ni)-modified CNTs.

Published in:

Journal of Materials Science: Materials in Electronics, 2018, v. 29, n. 10, p. 8584, doi. 10.1007/s10854-018-8872-z

By:

Sun, Huayu;
Chan, Y. C.;
Wu, Fengshun

Publication type:

Article

Effect of high temperature high humidity and thermal shock test on interfacial intermetallic compounds (IMCs) growth of low alpha solders.

Published in:

Journal of Materials Science: Materials in Electronics, 2017, v. 28, n. 11, p. 8116, doi. 10.1007/s10854-017-6518-1

By:

Sharma, Ashutosh;
Kumar, Santosh;
Jung, Do-Hyun;
Jung, Jae

Publication type:

Article

Effect of multi-walled carbon nanotube (MWCNT) concentration on thermomechanical reliability of MWCNT-reinforced solderable isotropic polymer nanocomposites.

Published in:

Journal of Materials Science: Materials in Electronics, 2016, v. 27, n. 9, p. 9159, doi. 10.1007/s10854-016-4952-0

By:

Yim, Byung-Seung;
Kim, Jong-Min

Publication type:

Article

Subgrain rotation at twin grain boundaries of a lead-free solder joint during thermal shock.

Published in:

Journal of Materials Science: Materials in Electronics, 2016, v. 27, n. 9, p. 9642, doi. 10.1007/s10854-016-5022-3

By:

Tan, Shihai;
Han, Jing;
Guo, Fu

Publication type:

Article

Intermetallic growth study at Sn-3.0Ag-0.5Cu/Cu solder joint interface during different thermal conditions.

Published in:

Journal of Materials Science: Materials in Electronics, 2015, v. 26, n. 12, p. 9470, doi. 10.1007/s10854-015-3406-4

By:

Li, Shuai;
Yan, Yan-fu

Publication type:

Article

Heel crack propagation mechanism of cold-rolled Cu/Al clad ribbon bonding in harsh environment.

Published in:

Journal of Materials Science: Materials in Electronics, 2015, v. 26, n. 9, p. 7277, doi. 10.1007/s10854-015-3355-y

By:

Park, Semin;
Nagao, Shijo;
Sugahara, Tohru;
Suganuma, Katsuaki

Publication type:

Article

Cutting condition effects on microstructure and mechanical characteristics of Ni-based superalloys—a review.

Published in:

International Journal of Advanced Manufacturing Technology, 2024, v. 130, n. 7/8, p. 3179, doi. 10.1007/s00170-023-12910-z

By:

Mustafa, Ghulam;
Li, Binxun;
Zhang, Song

Publication type:

Article

Experimental study of surface integrity in ultrasonic vibration–assisted milling of GH4169 nickel-based superalloy.

Published in:

International Journal of Advanced Manufacturing Technology, 2023, v. 129, n. 11/12, p. 5047, doi. 10.1007/s00170-023-12578-5

By:

Sun, Jian;
Li, Pengyang;
Zhang, Shen;
Chen, Yunshuai;
Lu, Han;
Chen, Guoqing;
Shao, Ding

Publication type:

Article

Microstructural damage during electrical discharge machining of a high silicon aluminum alloy for space applications.

Published in:

International Journal of Advanced Manufacturing Technology, 2023, v. 128, n. 5/6, p. 2311, doi. 10.1007/s00170-023-12084-8

By:

Bédard, Frédéric;
Loucif, Abdelhalim;
Jahazi, Mohammad;
Songmene, Victor

Publication type:

Article

High-temperature gripper for collaborative robots in additive manufacturing.

Published in:

International Journal of Advanced Manufacturing Technology, 2023, v. 128, n. 3/4, p. 1291, doi. 10.1007/s00170-023-11975-0

By:

Schorr, Logan;
Johnson, Bradley;
McFall, Jesse;
Shepherd, David;
Hadimani, Ravi L.

Publication type:

Article

A methodology to predict thermal crack initiation region of tool for high-speed milling compacted graphite iron based on three-dimensional transient thermal stress field model.

Published in:

International Journal of Advanced Manufacturing Technology, 2023, v. 125, n. 5/6, p. 2065, doi. 10.1007/s00170-023-10832-4

By:

Wang, Limei;
Liu, Hanlian;
Huang, Chuanzhen;
Yuan, Yulan;
Yao, Peng;
Huang, Jun;
Han, Quanquan

Publication type:

Article

Material removal mechanism of RB-SiC ceramics in dry impulse electrical discharge machining.

Published in:

International Journal of Advanced Manufacturing Technology, 2022, v. 122, n. 5/6, p. 2407, doi. 10.1007/s00170-022-10023-7

By:

Lu, Yanjun;
Rao, Xiaoshuang;
Du, Jiaxuan;
Guan, Weifeng

Publication type:

Article