Works about THERMAL interface materials

Results: 370

Stretchable and Leakage‐Free Liquid Metal Networks for Thermal Management.

Published in:

Advanced Functional Materials, 2025, v. 35, n. 27, p. 1, doi. 10.1002/adfm.202420839

By:

Li, Xinyuan;
Lin, Jie;
Wu, Jiawei;
Liu, Mengxin;
Du, Peiyao;
Xu, Ling;
Yan, Dingxiang;
Jia, Lichuan;
Li, Zhongming

Publication type:

Article

Comparative analysis of thermal interface materials for effective thermal management of electronic devices.

Published in:

Experimental Heat Transfer, 2025, v. 38, n. 5, p. 405, doi. 10.1080/08916152.2024.2352105

By:

Husain, Saddam;
Asif, Mohammad;
Khan, Khursheed Anwar

Publication type:

Article

Preparation and molecular dynamics simulation of natural rubber thermal conductive composites reinforced with boron nitride modified by a hyperbranched coupling agent.

Published in:

Polymer Composites, 2025, v. 46, n. 10, p. 9115, doi. 10.1002/pc.29544

By:

Qin, Zhengying;
Wang, Linquan;
Lin, Xinfeng;
Huang, Lifeng;
Wang, Zhen;
Li, Zhenlu;
Li, Ziwei;
Lu, Shaorong

Publication type:

Article

Controllable Preparation of Oriented Boron Nitride Nanosheets/Polyacrylate Pressure-Sensitive Adhesive Composites with Enhanced Thermal Conductivity.

Published in:

Polymers (20734360), 2025, v. 17, n. 12, p. 1604, doi. 10.3390/polym17121604

By:

Liu, Yuan;
Cao, Chaochao;
Zheng, De;
Li, Guohua;
Qu, Xiongwei

Publication type:

Article

Oriented Boron Nitride in Calcium Alginate Matrix: A Sustainable Pathway to High-Efficiency Thermal Interface Materials.

Published in:

Materials (1996-1944), 2025, v. 18, n. 12, p. 2757, doi. 10.3390/ma18122757

By:

Sun, Jiachen;
Shu, Dengfeng;
Huang, Fei;
Qin, Wenbo;
Yue, Wen;
Wang, Chengbiao

Publication type:

Article

Covalently Bonded Graphene-Carbon Nanotube Hybrid for High-Performance Thermal Interfaces.

Published in:

Advanced Functional Materials, 2015, v. 25, n. 48, p. 7539, doi. 10.1002/adfm.201501593

By:

Chen, Jie;
Walther, Jens H.;
Koumoutsakos, Petros

Publication type:

Article

A Pyrenylpropyl Phosphonic Acid Surface Modifier for Mitigating the Thermal Resistance of Carbon Nanotube Contacts.

Published in:

Advanced Functional Materials, 2014, v. 24, n. 4, p. 465, doi. 10.1002/adfm.201301714

By:

Taphouse, John H.;
Smith, O'Neil L.;
Marder, Seth R.;
Cola, Baratunde A.

Publication type:

Article

Controllable Fe ion-anchored graphene heterostructures for robust and highly thermal conductive cellulose nanofiber composites.

Published in:

Cellulose, 2021, v. 28, n. 16, p. 10305, doi. 10.1007/s10570-021-04202-0

By:

Shan, Bo;
Xiong, Yuzhu

Publication type:

Article

Sandwich structured RGO/CNF/RGO composite films for superior mechanical and thermally conductive properties.

Published in:

Cellulose, 2020, v. 27, n. 9, p. 5055, doi. 10.1007/s10570-020-03150-5

By:

Shan, Bo;
Xiong, Yuzhu;
Li, Yihang;
Yang, Hang;
Chen, Yuanfu

Publication type:

Article

改进静电植绒法制备沥青基碳纤维垂直排列高导热热界面材料.

Published in:

Journal of Shanghai University / Shanghai Daxue Xuebao, 2025, v. 31, n. 1, p. 106, doi. 10.12066/j.issn.1007-2861.2571

By:

武美霞;
欧阳江坤;
侯梦迪;
洪建婷;
丁鹏;
王金合

Publication type:

Article

Graphene and its Phononics: A Review.

Published in:

Journal of Ultra Scientist of Physical Sciences - Section B (Physics, Geology, Nano Technology Engineering, Bio Sciences, Material Science Management), 2021, v. 33, n. 5, p. 30, doi. 10.22147/jusps-B/330501

By:

AHMAD, FAREED;
SINGH, SUNDAR

Publication type:

Article

Thermomechanical Optimization of Three-Dimensional Low Heat Generation Microelectronic Packaging Using the Boundary Element Method.

Published in:

Mathematics (2227-7390), 2022, v. 10, n. 11, p. 1913, doi. 10.3390/math10111913

By:

Vallepuga-Espinosa, José;
Cifuentes-Rodríguez, Jaime;
Gutiérrez-Posada, Víctor;
Ubero-Martínez, Iván

Publication type:

Article

A Review of Advanced Thermal Interface Materials with Oriented Structures for Electronic Devices.

Published in:

Electronics (2079-9292), 2024, v. 13, n. 21, p. 4287, doi. 10.3390/electronics13214287

By:

Tu, Yuqian;
Liu, Bin;
Yao, Guanghong;
Luo, Hongjie;
Jia, Xiao;
Du, Jun;
Xu, Cui

Publication type:

Article

Fabrication of Carbon Fiber/Silicon Carbide Hybride Polypropylene Composites as Thermal Interface Material.

Published in:

Polymer Science -- Series A, 2024, v. 66, n. 4, p. 582, doi. 10.1134/S0965545X2460128X

By:

Nusret Kaya;
Demiç, Şerafettin;
Karaman, Merve

Publication type:

Article

Effect of Graphene Nanoplatelet Concentration on the Thermal Conductivity of Silicone Thermal Grease.

Published in:

Journal of Nano- & Electronic Physics, 2019, v. 11, n. 5, p. 1, doi. 10.21272/jnep.11(5).05039

By:

Phuong, M. T.;
Trinh, P. V.;
Tuyen, N. V.;
Dinh, N. N.;
Minh, P. N.;
Dung, N. D.;
Thang, B. H.

Publication type:

Article

A procedure for efficient generation and behavioral evaluation of ultra‐packed ellipsoidal particle systems.

Published in:

International Journal for Numerical Methods in Engineering, 2022, v. 123, n. 7, p. 1547, doi. 10.1002/nme.6902

By:

Liao, Huanyu;
Achar P L, Sukshitha;
Subbarayan, Ganesh

Publication type:

Article

Factors Influencing the Temperature Distribution of 200 W Light Emitting Diode Module Used in the Spotlight.

Published in:

Heat Transfer Engineering, 2018, v. 39, n. 6, p. 493, doi. 10.1080/01457632.2017.1320095

By:

Zhou, Jicheng;
Chen, Xing;
Zhou, Zhuang;
Peng, Yinqiao;
Wang, Yunyun;
Huang, Jinhui

Publication type:

Article

Effect of interface morphology on thermal contact resistance in thermal management of electronic devices.

Published in:

International Journal of Modern Physics B: Condensed Matter Physics; Statistical Physics; Applied Physics, 2022, v. 36, n. 17, p. 1, doi. 10.1142/S0217979222500928

By:

Chen, Yu-Zheng;
Feng, Shi-Wei;
Zhang, Ya-Min;
He, Xin;
Bai, Kun;
Li, Xuan

Publication type:

Article

Joint Interface Microstructure Analysis of Gallium-based Thermal Interface Material During Reflow.

Published in:

Journal of Electronic Materials, 2024, v. 53, n. 10, p. 6471, doi. 10.1007/s11664-024-11360-x

By:

Lin, Bo-Yi;
Lin, Ting-Chun;
Kao, Chin-Li;
Hsiao, Shih-Chieh;
Tseng, Pei-Hsuan;
Kuo, Jui-Chao

Publication type:

Article

Study on Thermal Reliability of Ga-Based Liquid Metal as Thermal Interface Material Encapsulated with Fluororubber.

Published in:

Journal of Electronic Materials, 2022, v. 51, n. 12, p. 6975, doi. 10.1007/s11664-022-09927-7

By:

Ma, Chaofan;
Shen, Jun;
Tan, Liming;
Deng, Jinzhao;
Zeng, Chengzong

Publication type:

Article

Investigation of Thermal Greases with Hybrid Fillers and Its Operational Bench Test.

Published in:

Journal of Electronic Materials, 2022, v. 51, n. 3, p. 1189, doi. 10.1007/s11664-021-09385-7

By:

Shishkin, Roman A.

Publication type:

Article

Investigating the Reliability of SnAgCu Solder Alloys at Elevated Temperatures in Microelectronic Applications.

Published in:

Journal of Electronic Materials, 2021, v. 50, n. 8, p. 4433, doi. 10.1007/s11664-021-08968-8

By:

Ekpu, Mathias

Publication type:

Article

Interfacially engineered liquid-phase-sintered Cu-In composite solders for thermal interface material applications.

Published in:

Journal of Materials Science, 2014, v. 49, n. 22, p. 7844, doi. 10.1007/s10853-014-8495-6

By:

Liu, J.;
Sahaym, U.;
Dutta, I.;
Raj, R.;
Renavikar, M.;
Sidhu, R.;
Mahajan, R.

Publication type:

Article

Freestanding foils of nanotube arrays fused with metals.

Published in:

Journal of Materials Science, 2014, v. 49, n. 20, p. 7080, doi. 10.1007/s10853-014-8414-x

By:

Poenitzsch, Vasiliki;
Slinker, Keith;
Miles, Dustin;
Miller, Michael;
Wei, Ronghua;
Coulter, Kent;
Gardner, Slade

Publication type:

Article

Carbon black/graphite nanoplatelet/rubbery epoxy hybrid composites for thermal interface applications.

Published in:

Journal of Materials Science, 2012, v. 47, n. 2, p. 1059, doi. 10.1007/s10853-011-5895-8

By:

Raza, Mohsin;
Westwood, Aidan;
Stirling, Chris

Publication type:

Article

Liquid phase sintered Cu-In composite solders for thermal interface material and interconnect applications.

Published in:

Journal of Materials Science, 2011, v. 46, n. 21, p. 7012, doi. 10.1007/s10853-011-5670-x

By:

Liu, J.;
Kumar, P.;
Dutta, I.;
Raj, R.;
Sidhu, R.;
Renavikar, M.;
Mahajan, R.

Publication type:

Article

Integrated Thermal Management in System-on-Package Devices.

Published in:

Periodica Polytechnica: Electrical Engineering & Computer Science, 2020, v. 64, n. 2, p. 200, doi. 10.3311/PPee.14986

By:

Bognár, György;
Takács, Gábor;
Szabó, Péter G.;
Rózsás, Gábor;
Pohl, László;
Plesz, Balázs

Publication type:

Article

Using Graphene-powder-based Thermal Interface Material for High Lumen LED Array Chip: An Experimental Study of Heat Dissipation.

Published in:

Sensors & Materials, 2020, v. 32, n. 12, Part 3, p. 4277, doi. 10.18494/SAM.2020.3137

By:

Chih-Neng Hsu;
Chun-Chih Chen;
Chen-Hui Chang;
Cheng-Chi Wang

Publication type:

Article

Thermohydraulic Design Analysis of the Target Assembly in the Material Plasma Exposure eXperiment Facility.

Published in:

Fusion Science & Technology, 2023, v. 79, n. 8, p. 1149, doi. 10.1080/15361055.2023.2192838

By:

Sabau, Adrian S.;
Hussain, Aftab;
Gallo, Federico;
Aaron, Adam M.

Publication type:

Article

Synthesis and analysis of a novel thermal interface material for DC-DC boost converter.

Published in:

Scientific Reports, 2024, v. 14, n. 1, p. 1, doi. 10.1038/s41598-024-73181-6

By:

Hamza, Ali;
Mahmood, Mariam;
Ulasyar, Abasin;
Kazmi, Syed Najeeb Ali;
Iqbal, Sheeraz;
Ghadi, Yazeed Yasin;
Almuflih, Ali Saeed;
Elbarbary, Z. M. S.

Publication type:

Article

BUSINESS & INDUSTRY.

Published in:: CoatingsTech, 2023, v. 20, n. 6, p. 10
Publication type:: Article

Arkema Acquires Polytec PT.

Published in:: CoatingsTech, 2023, v. 20, n. 4, p. 14
Publication type:: Article

WACKER INAUGURATES GLOBAL COMPETENCE CENTER FOR THERMAL INTERFACE MATERIALS IN SHANGHAI.

Published in:: CoatingsTech, 2020, v. 17, n. 10, p. 10
Publication type:: Article

AKZONOBEL RECEIVES BOEING APPROVAL FOR COLOR BLENDING IN CHINA.

Published in:: CoatingsTech, 2020, v. 17, n. 10, p. 9
Publication type:: Article

Thermally conductive and electrically insulated DGEBA-epoxy nano-composite fabricated by integrating GO/h-BN and rGO/h-BN hybrid for thermal management applications: a comparative analysis.

Published in:

Journal of Polymer Engineering, 2024, v. 44, n. 10, p. 787, doi. 10.1515/polyeng-2023-0300

By:

Nayak, Sagar Kumar;
Mohanty, Debabrata;
Sahu, Manas R.

Publication type:

Article

Promoting Thermal Conductivity of Alumina-Based Composite Materials by Systematically Incorporating Modified Graphene Oxide.

Published in:

Crystals (2073-4352), 2024, v. 14, n. 6, p. 490, doi. 10.3390/cryst14060490

By:

Lee, Nawon;
Park, Jinsol;
Jang, Nayeon;
Lee, Sehui;
Kim, Dayeon;
Yun, Sanggin;
Park, Tae Woo;
Kim, Jun-Hyun;
Park, Hyun-Ho

Publication type:

Article

Acrylic Pressure-Sensitive Adhesive Reinforced with Aluminum Nitride and Its Thermal Properties: Effect of Surface Treatment and Particle Size.

Published in:

Coatings (2079-6412), 2020, v. 10, n. 2, p. 188, doi. 10.3390/coatings10020188

By:

Mittal, Garima;
Park, Soo Jin;
Rhee, Kyong Yop

Publication type:

Article

Thermal Optimization Design for a Small Flat-Panel Synthetic Aperture Radar Satellite.

Published in:

Aerospace (MDPI Publishing), 2024, v. 11, n. 12, p. 982, doi. 10.3390/aerospace11120982

By:

Bai, Tian;
Zhang, Yuanbo;
Kong, Lin;
Ao, Hongrui;
Yu, Jisong;
Zhang, Lei

Publication type:

Article

High-performance thermal interface materials enabled by vertical alignment of lightweight and soft graphene foams.

Published in:

Nano Research, 2024, v. 17, n. 11, p. 9293, doi. 10.1007/s12274-024-6985-7

By:

Fu, Huaqiang;
Fang, Renqiang;
Tian, Chao;
Qian, Wei;
Cao, Shiya;
Zhang, Ziran;
Xu, Xiaoxi;
Yao, Chuang;
Wang, Zhe;
He, Daping

Publication type:

Article

Preparation technologies for polymer composites with high-directional thermal conductivity: A review.

Published in:

Nano Research, 2024, v. 17, n. 11, p. 9796, doi. 10.1007/s12274-024-6920-y

By:

Duan, Yanshuai;
Yu, Huitao;
Zhang, Fei;
Qin, Mengmeng;
Feng, Wei

Publication type:

Article

Extraordinary thermal conductivity of polyvinyl alcohol composite by aligning densified carbon fiber via magnetic field.

Published in:

Nano Research, 2023, v. 16, n. 2, p. 2572, doi. 10.1007/s12274-022-5023-x

By:

Guo, Xiaoxiao;
Cheng, Shujian;
Yan, Bo;
Li, Yile;
Zhou, Yinghui;
Cai, Weiwei;
Zhang, Yufeng;
Zhang, Xue-ao

Publication type:

Article

Cooling benefit evaluation of a central processing unit using thermal interface materials with hybrid additives.

Published in:

Journal of Mechanical Science & Technology, 2024, v. 38, n. 9, p. 5135, doi. 10.1007/s12206-024-0846-x

By:

Cheng, Chia;
Teng, Tun-Ping;
Yang, Chii-Rong

Publication type:

Article

Durable, Low-Cost, and Efficient Heat Spreader Design from Scrap Aramid Fibers and Hexagonal Boron Nitride.

Published in:

Symmetry (20738994), 2022, v. 14, n. 12, p. 2597, doi. 10.3390/sym14122597

By:

Yoo, Jung-Hun;
Yi, Sung Chul

Publication type:

Article

EXPERIMENTAL STUDIES ON SELECTED THERMAL INTERFACE MATERIALS.

Published in:

Thermal Science, 2024, v. 28, n. 4A, p. 2857, doi. 10.2298/TSCI230911284A

By:

ASIF, Mohammad;
HUSAIN, Saddam;
REHMAN, Sanaur;
HUSSAIN, Taliv;
MOHD, Rafiuddin

Publication type:

Article

PREDICTION OF THE CONTACT THERMAL RESISTANCE OF VERTICAL CARBON NANOTUBE ARRAYS.

Published in:

Thermal Science, 2020, v. 24, n. 2A, p. 745, doi. 10.2298/TSCI180625289S

By:

Bo SHI;
Han ZHANG;
Jin ZHANG

Publication type:

Article

Atomic Layer Deposition of Buffer Layers for the Growth of Vertically Aligned Carbon Nanotube Arrays.

Published in:

Nanoscale Research Letters, 2019, v. 14, n. 1, p. N.PAG, doi. 10.1186/s11671-019-2947-5

By:

Li, Hao-Hao;
Yuan, Guang-Jie;
Shan, Bo;
Zhang, Xiao-Xin;
Ma, Hong-Ping;
Tian, Ying-Zhong;
Lu, Hong-Liang;
Liu, Johan

Publication type:

Article

Graphene-Assisted Thermal Interface Materials with a Satisfied Interface Contact Level Between the Matrix and Fillers.

Published in:

Nanoscale Research Letters, 2018, v. 13, n. 1, p. 1, doi. 10.1186/s11671-018-2704-1

By:

Tang, Bo;
Li, Xufei;
Huang, Weiqiu;
Yu, Haogang;
Ling, Xiang

Publication type:

Article

RGO and Three-Dimensional Graphene Networks Co-modified TIMs with High Performances.

Published in:

Nanoscale Research Letters, 2017, v. 12, n. 1, p. 1, doi. 10.1186/s11671-017-2298-z

By:

Bo, Tang;
Zhengwei, Wang;
Huang, Weiqiu;
Sen, Li;
Tingting, Ma;
Haogang, Yu;
Xufei, Li

Publication type:

Article

Influence of Temperature and Aging on the Thermal Contact Resistance in Thermoelectric Devices.

Published in:

Journal of Electronic Materials, 2020, v. 49, n. 5, p. 2943, doi. 10.1007/s11664-020-08015-y

By:

Rodríguez, A.;
Pérez-Artieda, G.;
Beisti, I.;
Astrain, D.;
Martínez, A.

Publication type:

Article

Rheological Behavior and Thermal Conductivities of Emulsion-Based Thermal Pastes.

Published in:

Journal of Electronic Materials, 2020, v. 49, n. 3, p. 2100, doi. 10.1007/s11664-019-07907-y

By:

Yazdan, Ali;
Wang, Jizhe;
Nan, Ce-Wen;
Li, Liangliang

Publication type:

Article