Works matching DE "TAPE-automated bonding"

Results: 23

A comparative study on direct Cu-Cu bonding methodologies for copper pillar bumped flip-chips.

Published in:

Journal of Materials Science: Materials in Electronics, 2018, v. 29, n. 11, p. 9347, doi. 10.1007/s10854-018-8965-8

By:

Ma, Y.;
Roshanghias, A.;
Binder, A.

Publication type:

Article

Microstructure evolution during reflow and thermal aging in a Ag@Sn TLP bondline for high-temperature power devices.

Published in:

Journal of Materials Science: Materials in Electronics, 2018, v. 29, n. 4, p. 3014, doi. 10.1007/s10854-017-8232-4

By:

Guo, Qiang;
Yu, Fuwen;
Chen, Hongtao;
Li, Mingyu

Publication type:

Article

Solidification and interfacial interactions in gold–tin system during eutectic or thermo-compression bonding for 200 mm MEMS wafer level hermetic packaging.

Published in:

Journal of Materials Science: Materials in Electronics, 2013, v. 24, n. 12, p. 5000, doi. 10.1007/s10854-013-1515-5

By:

Garnier, Arnaud;
Baillin, Xavier;
Hodaj, Fiqiri

Publication type:

Article

Cu-Cu thermo compression wafer bonding techniques for micro-system integration.

Published in:

Indian Journal of Engineering & Materials Sciences, 2021, v. 28, n. 2, p. 142, doi. 10.56042/ijems.v28i2.43997

By:

Agrawal, Megha;
Manohar, Bottumanchi Morish;
Nagarajaiah, Kusuma

Publication type:

Article

Comparison of Fundamental Frequency and Sweep Resistance of Different Wire Loops Using Finite Element Model.

Published in:

International Journal of Structural Stability & Dynamics, 2015, v. 15, n. 1, p. -1, doi. 10.1142/S0219455414500321

By:

Chen, Yun;
Wang, Fuliang

Publication type:

Article

Collective Cu-Cu Thermocompression Bonding Using Pillars.

Published in:

Journal of Microelectronic & Electronic Packaging, 2019, v. 16, n. 1, p. 28, doi. 10.4071/imaps.741710

By:

Carroll, Robert;
La Tulipe, Douglas;
Coolbaugh, Douglas;
Geer, Robert

Publication type:

Article

Multichip Module Planarity Requirements Derived From Solder Surface Tension Models.

Published in:

Journal of Microelectronic & Electronic Packaging, 2018, v. 15, n. 1, p. 9, doi. 10.4071/imaps.526636

By:

Marinis, Thomas F.;
Soucy, Joseph W.

Publication type:

Article

Addressing Flux Dip Challenges for 3-D Integrated Large Die, Ultrafine Pitch Interconnect.

Published in:

Journal of Microelectronic & Electronic Packaging, 2017, v. 14, n. 1, p. 32, doi. 10.4071/imaps.348081

By:

Marsan-Loyer, C.;
Danovitch, D.;
Boyer, N.

Publication type:

Article

Challenges of Scalable 2.5D IC Assembly.

Published in:

Journal of Microelectronic & Electronic Packaging, 2015, v. 12, n. 3, p. 123, doi. 10.4071/imaps.455

By:

Liang Wang;
Woychik, Charles G.;
Guilian Gao;
Villavicencio, Grant;
McGrath, Scott;
Hong Shen;
Arkalgud, Sitaram

Publication type:

Article

Microfabrication of a high-density, non-neutral antimatter trap.

Published in:

Micro & Nano Letters (Wiley-Blackwell), 2014, v. 9, n. 10, p. 630, doi. 10.1049/mnl.2014.0239

By:

Narimannezhad, Alireza;
Jennings, Joshah;
Weber, Marc H.;
Lynn, Kelvin G.

Publication type:

Article

The pressure-volume-temperature relationship of cellulose.

Published in:

Cellulose, 2013, v. 20, n. 5, p. 2279, doi. 10.1007/s10570-013-9986-3

By:

Jallabert, Bastien;
Vaca-Medina, Guadalupe;
Cazalbou, Sophie;
Rouilly, Antoine

Publication type:

Article

Low-Temperature Al-Al Thermocompression Bonding with Sn Oxidation Protect Layer for Wafer-Level Hermetic Sealing.

Published in:

Electronics & Communications in Japan, 2017, v. 100, n. 8, p. 43, doi. 10.1002/ecj.11975

By:

SATOH, SHIRO;
FUKUSHI, HIDEYUKI;
ESASHI, MASAYOSHI;
TANAKA, SHUJI

Publication type:

Article

Adhesion of PDMS substrates assisted by Plasma Graft Polymerization.

Published in:

Surface & Interface Analysis: SIA, 2016, v. 48, n. 7, p. 597, doi. 10.1002/sia.5985

By:

Jung, Kwang Ho;
Kim, Dae Gon;
Jung, Seung Boo

Publication type:

Article

Thermo-compression-aligned functional graphene showing anisotropic response to in-plane stretching and out-of-plane bending.

Published in:

Journal of Materials Science, 2018, v. 53, n. 9, p. 6574, doi. 10.1007/s10853-018-2021-1

By:

Bohao Xu;
Huige Yang;
Kun Dai;
Xuying Liu;
Li Zhang;
Meng Wang;
Mingjun Niu;
Ruixia Duan;
Xing Wang;
Jinzhou Chen

Publication type:

Article

Optimization and reliability evaluation of COG bonding process.

Published in:

Journal of Mechanical Science & Technology, 2016, v. 30, n. 3, p. 1305, doi. 10.1007/s12206-016-0235-1

By:

Jeong, Young;
Jung, Seung-Won;
Jin, Songwan;
Kim, Kyung-Soo;
Yun, Won-Soo

Publication type:

Article

Some thoughts on bondability and strength of gold wire bonding.

Published in:

Gold Bulletin, 2012, v. 45, n. 3, p. 115, doi. 10.1007/s13404-012-0060-y

By:

Zulkifli, Muhammad;
Abdullah, Shahrum;
Othman, Norinsan;
Jalar, Azman

Publication type:

Article

Experimental study of steered fibre composite production.

Published in:

Proceedings of the Estonian Academy of Sciences, 2017, v. 66, n. 3, p. 295, doi. 10.3176/proc.2017.3.09

By:

Haavajõe, Anti;
Mikola, Madis;
Osali, Hadi;
Pohlak, Meelis;
Herranen, Henrik

Publication type:

Article

Efficient heat dissipation in AlGaN/GaN high electron mobility transistors by substrate-transfer technique.

Published in:

Physica Status Solidi. A: Applications & Materials Science, 2017, v. 214, n. 8, p. n/a, doi. 10.1002/pssa.201600845

By:

Hiroki, Masanobu;
Kumakura, Kazuhide;
Yamamoto, Hideki

Publication type:

Article

Fabrication of a terahertz quantum-cascade laser with a double metal waveguide based on multilayer GaAs/AlGaAs heterostructures.

Published in:

Semiconductors, 2016, v. 50, n. 10, p. 1377, doi. 10.1134/S1063782616100134

By:

Khabibullin, R.;
Shchavruk, N.;
Pavlov, A.;
Ponomarev, D.;
Tomosh, K.;
Galiev, R.;
Maltsev, P.;
Zhukov, A.;
Cirlin, G.;
Zubov, F.;
Alferov, Zh.

Publication type:

Article

Electroless Silver Coating on Copper Microcones for Low-Temperature Solid-State Bonding.

Published in:

Journal of Electronic Materials, 2015, v. 44, n. 11, p. 4516, doi. 10.1007/s11664-015-3930-2

By:

Hu, Fengtian;
Yang, Shan;
Wang, Haozhe;
Hu, Anmin;
Li, Ming

Publication type:

Article

Flat dual-frequency sweeping ultrasound enhances the inactivation of polyphenol oxidase in strawberry juice.

Published in:

Journal of Food Measurement & Characterization, 2022, v. 16, n. 1, p. 762, doi. 10.1007/s11694-021-01202-3

By:

Xu, Baoguo;
Chen, Jianan;
Azam, S. M. Roknul;
Feng, Min;
Wei, Benxi;
Yan, Weiqiang;
Zhou, Cunshan;
Ma, Haile;
Bhandari, Bhesh;
Ren, Guangyue;
Duan, Xu

Publication type:

Article

Comprehensive Die Shear Test of Silicon Packages Bonded by Thermocompression of Al Layers with Thin Sn Capping or Insertions.

Published in:

Micromachines, 2018, v. 9, n. 4, p. 174, doi. 10.3390/mi9040174

By:

Satoh, Shiro;
Fukushi, Hideyuki;
Esashi, Masayoshi;
Tanaka, Shuji

Publication type:

Article

Oxide-Oxide Thermocompression Direct Bonding Technologies with Capillary Self-Assembly for Multichip-to-Wafer Heterogeneous 3D System Integration.

Published in:

Micromachines, 2016, v. 7, n. 10, p. 184, doi. 10.3390/mi7100184

By:

Hideto Hashiguchi;
Takafumi Fukushima;
Tetsu Tanaka;
Mariappan Murugesan;
Ji-Chel Bea;
Kang-Wook Lee;
Mitsumasa Koyanagi;
Hiroshi Yonekura;
Hisashi Kino

Publication type:

Article