A Broadband GCPW to Stripline Vertical Transition in LTCC.
- Published in:
- Progress in Electromagnetics Research Letters, 2016, v. 60, p. 17, doi. 10.2528/pierl16031005
- By:
- Publication type:
- Article
Works matching DE "SYSTEM-in-a-package"
Results: 15
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2
Wide Dynamic Range CMOS Amplifier Design for RF Signal Power Detection via Electro-Thermal Coupling.
- Published in:
- Journal of Electronic Testing, 2014, v. 30, n. 1, p. 101, doi. 10.1007/s10836-013-5427-3
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- Publication type:
- Article
3
An Interdigital FSS based Dual Channel UWB-MIMO Antenna Array for System-in-Package Applications.
- Published in:
- Applied Computational Electromagnetics Society Journal, 2017, v. 32, n. 3, p. 203
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- Publication type:
- Article
4
Broadband dielectric properties of multiwalled carbon nanotube/polystyrene composites.
- Published in:
- Polymer Engineering & Science, 2015, v. 55, n. 1, p. 173, doi. 10.1002/pen.23881
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- Publication type:
- Article
5
Fully integrated 60 GHz switched-beam phased antenna array in glass-IPD technology.
- Published in:
- Electronics Letters (Wiley-Blackwell), 2015, v. 51, n. 11, p. 804, doi. 10.1049/el.2015.0891
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- Publication type:
- Article
6
Eight-element UWB-MIMO array with three distinct isolation mechanisms.
- Published in:
- Electronics Letters (Wiley-Blackwell), 2015, v. 51, n. 4, p. 311, doi. 10.1049/el.2014.4199
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- Publication type:
- Article
7
Table of Content and Editorial Board.
- Published in:
- International Journal of RF & Microwave Computer-Aided Engineering, 2016, v. 26, n. 9, p. 747, doi. 10.1002/mmce.20935
- Publication type:
- Article
8
LTCC-based monolithic system-in-package (SiP) module for millimeter-wave applications.
- Published in:
- International Journal of RF & Microwave Computer-Aided Engineering, 2016, v. 26, n. 9, p. 803, doi. 10.1002/mmce.21032
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- Publication type:
- Article
9
A Digital Lock-In Amplifier for Use at Temperatures of up to 200 °C.
- Published in:
- Sensors (14248220), 2016, v. 16, n. 11, p. 1899, doi. 10.3390/s16111899
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- Publication type:
- Article
10
Interoperability Enables a Complete RFIC/Package/Board Co-Design Flow.
- Published in:
- Microwave Journal, 2014, v. 57, n. 7, p. 66
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- Publication type:
- Article
11
Decomposition analysis of the multidisciplinary coupling in LED System-in-Package design using a DSM and a specification language.
- Published in:
- Structural & Multidisciplinary Optimization, 2016, v. 53, n. 6, p. 1395, doi. 10.1007/s00158-016-1397-2
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- Publication type:
- Article
12
Ferrites in Transfer-Molded Power SiPs: Challenges in Packaging.
- Published in:
- Journal of Microelectronic & Electronic Packaging, 2020, v. 17, n. 2, p. 35, doi. 10.4071/imaps.1064487
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- Publication type:
- Article
13
Head-on-Pillow Defect Detection: X-Ray Inspection Limitations.
- Published in:
- Journal of Microelectronic & Electronic Packaging, 2019, v. 16, n. 2, p. 91, doi. 10.4071/imaps.871613
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- Publication type:
- Article
14
Recent Advances and Trends in Heterogeneous Integrations.
- Published in:
- Journal of Microelectronic & Electronic Packaging, 2019, v. 16, n. 2, p. 45, doi. 10.4071/imaps.780287
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- Publication type:
- Article
15
Reliability of Fan-Out Wafer-Level Heterogeneous Integration.
- Published in:
- Journal of Microelectronic & Electronic Packaging, 2018, v. 15, n. 4, p. 148, doi. 10.4071/imaps.728940
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- Publication type:
- Article