Works matching DE "SURFACE mount technology"

Results: 209

A multimodal fusion method for soldering quality online inspection.

Published in:

Journal of Intelligent Manufacturing, 2025, v. 36, n. 5, p. 3271, doi. 10.1007/s10845-024-02413-3

By:

Xie, Jian;
Guo, Yu;
Liu, Daoyuan;
Huang, Shaohua;
Zheng, Kaiwen;
Tao, Yaning

Publication type:

Article

Soldering and Bonding in Contemporary Electronic Device Packaging.

Published in:

Materials (1996-1944), 2025, v. 18, n. 9, p. 2015, doi. 10.3390/ma18092015

By:

Li, Yuxuan;
Pan, Bei;
Ge, Zhenting;
Chen, Pengpeng;
Bi, Bo;
Yi, Xin;
Wu, Chaochao;
Wang, Ce

Publication type:

Article

Evolving gas flow, measurement, and control technologies.

Published in:

Solid State Technology, 1999, v. 42, n. 10, p. 51

By:

Snow, Jim;
Tison, Stuart;
Plante, Walter

Publication type:

Article

Characterisation of lead free solderability of immersion Sn finish on PWBs using wetting balance technique.

Published in:

Surface Engineering, 2008, v. 24, n. 5, p. 337, doi. 10.1179/174329408X281821

By:

Hong, S. J.;
Park, B-H.;
Seo, D. S.;
Ryu, C.-R.

Publication type:

Article

Multi Variant Surface Mounted Metal-Organic Frameworks.

Published in:

Advanced Functional Materials, 2013, v. 23, n. 30, p. 3790, doi. 10.1002/adfm.201202996

By:

Liu, Bo;
Tu, Min;
Zacher, Denise;
Fischer, Roland A.

Publication type:

Article

Effects of cobalt nanoparticle on microstructure of Sn58Bi solder joint.

Published in:

Journal of Materials Science: Materials in Electronics, 2023, v. 34, n. 4, p. 1, doi. 10.1007/s10854-022-09465-2

By:

Bashir, Muhammad Nasir;
Haseeb, A. S. M. A.;
Naher, Sumsun;
Ali, Muhammad Mahmood;
Ali Bashir, Mohamed Bashir;
Zaidi, Asad A.;
Jamshaid, Muhammad;
Javed, Iqra

Publication type:

Article

Rheological characterization and jet printing performance of Sn–58Bi solder pastes.

Published in:

Journal of Materials Science: Materials in Electronics, 2018, v. 29, n. 6, p. 4575, doi. 10.1007/s10854-017-8408-y

By:

Li, Saipeng;
Wei, Mingzhen;
Hao, Jian;
Tian, Shuang;
Wang, Dapeng;
Zhou, Jian;
Xue, Feng

Publication type:

Article

Wettability of SACR- xNi solder alloy on Cu leading wire with no-clean flux.

Published in:

Journal of Materials Science: Materials in Electronics, 2017, v. 28, n. 1, p. 94, doi. 10.1007/s10854-016-5496-z

By:

Wang, Yaoli;
Fang, Zonghui;
Ma, Ning;
Zhang, Keke

Publication type:

Article

Effect of pulsed voltage on electrochemical migration of tin in electronics.

Published in:

Journal of Materials Science: Materials in Electronics, 2015, v. 26, n. 10, p. 7997, doi. 10.1007/s10854-015-3454-9

By:

Verdingovas, Vadimas;
Jellesen, Morten;
Ambat, Rajan

Publication type:

Article

Detection of stencil printing direction in printed circuit boards assembly using solder paste inspection data.

Published in:

International Journal of Advanced Manufacturing Technology, 2025, v. 138, n. 1, p. 97, doi. 10.1007/s00170-024-14585-6

By:

Farrag, Abdelrahman;
Kim, Jaewoo;
Yoon, Sangwon;
Jin, Yu

Publication type:

Article

Surrogate-based optimization framework for enhancing SMT process quality and productivity in electronics manufacturing services.

Published in:

International Journal of Advanced Manufacturing Technology, 2025, v. 136, n. 11, p. 5103, doi. 10.1007/s00170-025-15032-w

By:

Lee, Ching-Hung;
Lin, Kai-Xiang;
Chou, Che-Wei

Publication type:

Article

A pick-and-place process control based on the bootstrapping method for quality enhancement in surface mount technology.

Published in:

International Journal of Advanced Manufacturing Technology, 2024, v. 133, n. 1/2, p. 745, doi. 10.1007/s00170-024-13767-6

By:

Kim, Jaewoo;
Zhang, Zhenxuan;
Won, Daehan;
Yoon, Sangwon;
Jin, Yu

Publication type:

Article

Advancing surface mount technology quality: a computer-assisted approach for enhanced X-ray inspection of solder joints.

Published in:

International Journal of Advanced Manufacturing Technology, 2024, v. 131, n. 12, p. 5897, doi. 10.1007/s00170-024-13343-y

By:

Terra, Nathália Mattos;
Santiago, Sandro Breval;
Vieira, Adalena Kennedy;
Vieira, Raimundo Kennedy

Publication type:

Article

A review on numerical approach of reflow soldering process for copper pillar technology.

Published in:

International Journal of Advanced Manufacturing Technology, 2022, v. 121, n. 7/8, p. 4325, doi. 10.1007/s00170-022-09724-w

By:

Lee, Jing Rou;
Aziz, Mohd Sharizal Abdul;
Ishak, Mohammad Hafifi Hafiz;
Khor, Chu Yee

Publication type:

Article

Assessing product quality from the production process logs.

Published in:

International Journal of Advanced Manufacturing Technology, 2021, v. 117, n. 5/6, p. 1615, doi. 10.1007/s00170-021-07764-2

By:

Duong, Le Toan;
Travé-Massuyès, Louise;
Subias, Audine;
Roa, Nathalie Barbosa

Publication type:

Article

A novel placement method for mini-scale passive components in surface mount technology.

Published in:

International Journal of Advanced Manufacturing Technology, 2021, v. 115, n. 5/6, p. 1475, doi. 10.1007/s00170-021-07147-7

By:

He, Jingxi;
Cen, Yuqiao;
Li, Yuanyuan;
Alelaumi, Shrouq M.;
Won, Daehan

Publication type:

Article

Three-dimensional CFD simulation of the stencil printing performance of solder paste.

Published in:

International Journal of Advanced Manufacturing Technology, 2020, v. 108, n. 9/10, p. 3351, doi. 10.1007/s00170-020-05636-9

By:

Rusdi, M. S.;
Abdullah, M. Z.;
Ishak, M. H. H.;
Aziz, M. S. Abdul;
Abdullah, M. K.;
Rethinasamy, P.;
Jalar, A.

Publication type:

Article

Supplier Selection and Competitiveness -- A Case Study on the Surface Mount Industry.

Published in:

Journal of Advanced Manufacturing Systems, 2014, v. 13, n. 3, p. 155, doi. 10.1142/S0219686714500103

By:

Gary Yu-Hsin Chen;
Hui-Ming Wee;
Chun Yao Lee

Publication type:

Article

MORFOLOGICAL AND STRUCTURAL CHARACTERISTICS OF II-VI SEMICONDUCTOR THIN FILMS (ZnTe, CdTe, ZnS).

Published in:

Integrated Ferroelectrics, 2008, v. 103, n. 1, p. 32, doi. 10.1080/10584580802558126

By:

KURBATOV, D.;
KOSYAK, V.;
KOLESNYK, M.;
OPANASYUK, A.;
DANILCHENKO, S.

Publication type:

Article

High dynamic range image acquisition method using proportion integration differentiation controller.

Published in:

Optical Engineering, 2015, v. 54, n. 2, p. 1, doi. 10.1117/1.OE.54.2.023105

By:

Xiaohui Li;
Sun Changku;
Wang Peng

Publication type:

Article

Flow characteristics of an offset jet over a surface mounted square rib.

Published in:

Journal of Turbulence, 2016, v. 17, n. 8, p. 727, doi. 10.1080/14685248.2016.1174779

By:

Nyantekyi-Kwakye, Baafour;
Tachie, Mark Francis;
Clark, Shawn Paul

Publication type:

Article

Modelling cross‐regulation in a single switched capacitor DC‐DC converter.

Published in:

International Journal of Circuit Theory & Applications, 2018, v. 46, n. 6, p. 1272, doi. 10.1002/cta.2472

By:

Kushnerov, Alexander

Publication type:

Article

Aplicação do Jidoka em um processo SMT: estudo de caso.

Published in:

Exacta, 2020, v. 18, n. 3, p. 459, doi. 10.5585/ExactaEP.v18n3.8473

By:

Retto Uhlmann, Iracyanne;
de Souza Silva, Carlos Américo;
de Oliveira Quadras, Djonathan Luiz;
Morosini Frazzon, Enzo

Publication type:

Article

A framework with revised rough-DEMATEL to capture and evaluate requirements for smart industrial product-service system of systems.

Published in:

International Journal of Production Research, 2019, v. 57, n. 22, p. 7104, doi. 10.1080/00207543.2019.1577566

By:

Liu, Zhiwen;
Ming, Xinguo

Publication type:

Article

Mechanism to minimise the assembly time with feeder assignment for a multi-headed gantry and high-speed SMT machine.

Published in:

International Journal of Production Research, 2017, v. 55, n. 10, p. 2930, doi. 10.1080/00207543.2016.1229071

By:

Han, Jihee;
Seo, Yoonho

Publication type:

Article

Development and assembly of Radio Frequency Module using components with SMD technology for educational purposes.

Published in:

Latin-American Journal of Physics Education, 2017, v. 11, n. 1, p. 1

By:

Ximenes, Rodrigo Luiz;
Meceneiro, Gabriel Duarte;
Tavares de Souza Conrado, Bruno;
Bravo Roger, Leonardo Lorenzo;
Simões dos Santos, Talía

Publication type:

Article

Analytical Model on Real Geometries of Magnet Bars of Surface Permanent Magnet Slotless Machine.

Published in:

Progress in Electromagnetics Research B, 2016, v. 66, p. 31, doi. 10.2528/pierb15121503

By:

Boutora, Youcef;
Takorabet, Noureddine;
Ibtiouen, Rachid

Publication type:

Article

Orthogonal Fuzzy Rule-Based Systems: Selection of Optimum Rules.

Published in:

Neural Computing & Applications, 2000, v. 9, n. 1, p. 4, doi. 10.1007/s005210070029

By:

Lotfi, A.;
Howarth, M.;
Hull, J. B.

Publication type:

Article

Using Grey Control Charts in Surface Mounting Technology.

Published in:

Journal of Grey System, 2010, v. 22, n. 2, p. 167

By:

Lin Chin-Tsai;
Wu Wen-Hsiang;
Peng Hsin-Chuan

Publication type:

Article

STAGING PROBLEM OF A DUAL DELIVERY PICK-AND-PLACE MACHINE IN PRINTED CIRCUIT CARD ASSEMBLY.

Published in:

Operations Research, 1994, v. 42, n. 1, p. 81, doi. 10.1287/opre.42.1.81

By:

Ahmadi, Reza H.;
Kouvelis, Panagiotis

Publication type:

Article

Re-calibration of Engelmaier's Model for Leadless, Lead-free Solder Attachments.

Published in:

Quality & Reliability Engineering International, 2007, v. 23, n. 4, p. 415, doi. 10.1002/qre.810

By:

Salmela, Olli;
Andersson, Klas;
Perttula, Altti;
Särkkauml;, Jussi;
Tammenmaa, Markku

Publication type:

Article

Determining the RF resistance and Q-factor of air-core inductors.

Published in:

Microwave & Optical Technology Letters, 2001, v. 29, n. 2, p. 89, doi. 10.1002/mop.1093

By:

Gross, Shay;
Weller, Thomas

Publication type:

Article

Broadband array using surface-mounted monopole concept.

Published in:

Microwave & Optical Technology Letters, 1998, v. 19, n. 6, p. 455, doi. 10.1002/(SICI)1098-2760(19981220)19:6<455::AID-MOP19>3.0.CO;2-W

By:

Desclos, L.;
Floc'h, J. M.

Publication type:

Article

Surface-mounted monopole antenna.

Published in:

Microwave & Optical Technology Letters, 1997, v. 16, n. 6, p. 349, doi. 10.1002/(SICI)1098-2760(19971220)16:6<349::AID-MOP8>3.0.CO;2-K

By:

Floc'h, J. M.;
Desclos, L.

Publication type:

Article

Multi-Organs-on-Chips: Towards Long-Term Biomedical Investigations.

Published in:

Molecules, 2019, v. 24, n. 4, p. 675, doi. 10.3390/molecules24040675

By:

Zhao, Yi;
Kankala, Ranjith Kumar;
Wang, Shi-Bin;
Chen, Ai-Zheng;
Park, Sungsu

Publication type:

Article

Crosstalk reduction between RF input channels of coherent-driver-modulator package by introducing enhanced ground lead structure.

Published in:

Electronics Letters (Wiley-Blackwell), 2020, v. 56, n. 17, p. 893, doi. 10.1049/el.2020.1318

By:

Ozaki, J.;
Tanobe, H.;
Ishikawa, M.

Publication type:

Article

基于 FPGA 的三维闪电探测仪电路系统设计.

Published in:

Journal of Jilin University (Science Edition) / Jilin Daxue Xuebao (Lixue Ban), 2022, v. 60, n. 4, p. 977, doi. 10.13413/j.cnki.jdxblxb.202141

By:

李力;
彭军;
蓝天飞;
甘少明

Publication type:

Article

Chip Appearance Inspection Method for High-Precision SMT Equipment.

Published in:

Machines, 2021, v. 9, n. 2, p. 34, doi. 10.3390/machines9020034

By:

Zhang, Huiyan;
Sun, Hao;
Shi, Peng

Publication type:

Article

Integrated graphene oxide resistive element in tunable RF filters.

Published in:

Scientific Reports, 2020, v. 10, n. 1, p. N.PAG, doi. 10.1038/s41598-020-70041-x

By:

Abunahla, Heba;
Gadhafi, Rida;
Mohammad, Baker;
Alazzam, Anas;
Kebe, Mamady;
Sanduleanu, Mihai

Publication type:

Article

EXPERIMENTAL STUDY OF LOW SPEED SENSORLESS CONTROL OF PMSM DRIVE USING HIGH FREQUENCY SIGNAL INJECTION.

Published in:

Advances in Electrical & Electronic Engineering, 2016, v. 14, n. 1, p. 29, doi. 10.15598/aeee.v14i1.1564

By:

AGRAWAL, Jyoti;
BODKHE, Sanjay

Publication type:

Article

A Drop-In High-Temperature Pb-Free Solder Paste That Outperforms High-Pb Pastes in Power Discrete Applications.

Published in:

Journal of Microelectronic & Electronic Packaging, 2023, v. 20, n. 2, p. 82, doi. 10.4071/001c.81981

By:

Hongwen Zhang;
Richmond, Tyler;
Aserian, Kyle;
Lytwynec, Samuel;
Harter, Tybarius;
Prado, Diego

Publication type:

Article

Design of Solder Connections for Self-Assembly of Optoelectronic Devices.

Published in:

Journal of Microelectronic & Electronic Packaging, 2019, v. 16, n. 1, p. 1, doi. 10.4071/imaps.739404

By:

Marinis, Thomas F.;
Soucy, Joseph W.

Publication type:

Article

Elektronik kart üretiminde hat atama problemi için süreç akışını dikkate alan bütünleşik bir yaklaşım.

Published in:

Journal of the Faculty of Engineering & Architecture of Gazi University / Gazi Üniversitesi Mühendislik Mimarlık Fakültesi Dergisi,, 2024, v. 39, n. 4, p. 2409, doi. 10.17341/gazimmfd.1340123

By:

Ünal, Ömer Faruk;
Serdarasan, Şeyda

Publication type:

Article

Tunability of bulk acoustic wave solidly mounted resonators using passive elements: Concept, design and implementation.

Published in:

International Journal of RF & Microwave Computer-Aided Engineering, 2011, v. 21, n. 5, p. 496, doi. 10.1002/mmce.20554

By:

Hassan, M. El;
Kerherve, E.;
Deval, Y.;
David, J.B.;
Belot, D.;
Shirakawa, A.A.

Publication type:

Article

Surface mount adhesive: in search of a perfect dot.

Published in:

International Journal of Advanced Manufacturing Technology, 2017, v. 90, n. 5-8, p. 2083, doi. 10.1007/s00170-016-9549-5

By:

Toh, Beng;
Yeoh, Hak;
Teoh, Wen;
Chin, Loy

Publication type:

Article

PCB assembly optimization in a single gantry high-speed rotary-head collect-and-place machine.

Published in:

International Journal of Advanced Manufacturing Technology, 2017, v. 88, n. 9-12, p. 2819, doi. 10.1007/s00170-016-8942-4

By:

Li, Debiao;
Yoon, Sang

Publication type:

Article

An efficient genetic algorithm for setup time minimization in PCB assembly.

Published in:

International Journal of Advanced Manufacturing Technology, 2015, v. 77, n. 5-8, p. 973, doi. 10.1007/s00170-014-6510-3

By:

García-Nájera, Abel;
Brizuela, Carlos;
Martínez-Pérez, Israel

Publication type:

Article

A genetic-based algorithm for the operational sequence of a high speed chip placement machine.

Published in:

International Journal of Advanced Manufacturing Technology, 2008, v. 36, n. 9/10, p. 918, doi. 10.1007/s00170-006-0918-3

By:

Chyu, Chiuh-Cheng;
Chang, Wei-Shung

Publication type:

Article

Design and control of a novel linear wire bonding head.

Published in:

International Journal of Advanced Manufacturing Technology, 2008, v. 35, n. 11/12, p. 1136, doi. 10.1007/s00170-006-0795-9

By:

Li Fang;
Yue Hong Yin;
Chen, Zhao Neng

Publication type:

Article

Automated inspection of PCB components using a genetic algorithm template-matching approach.

Published in:

International Journal of Advanced Manufacturing Technology, 2007, v. 35, n. 3/4, p. 293, doi. 10.1007/s00170-006-0730-0

By:

Crispin, A. J.;
Rankov, V.

Publication type:

Article