Clustering methods for printed and circuit board insertion problems.
- Published in:
- Journal of the Operational Research Society, 2000, v. 51, n. 10, p. 1205, doi. 10.2307/253933
- By:
- Publication type:
- Article
Works matching DE "SURFACE mount technology"
Results: 210
1
2
Heuristics approach to printed circuit board insertion problem.
- Published in:
- Journal of the Operational Research Society, 1998, v. 49, n. 10, p. 1051, doi. 10.2307/3010529
- By:
- Publication type:
- Article
3
Multi Variant Surface Mounted Metal-Organic Frameworks.
- Published in:
- Advanced Functional Materials, 2013, v. 23, n. 30, p. 3790, doi. 10.1002/adfm.201202996
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- Publication type:
- Article
4
基于 FPGA 的三维闪电探测仪电路系统设计.
- Published in:
- Journal of Jilin University (Science Edition) / Jilin Daxue Xuebao (Lixue Ban), 2022, v. 60, n. 4, p. 977, doi. 10.13413/j.cnki.jdxblxb.202141
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- Publication type:
- Article
5
Secure Circuit with Low-power On-chip Temperature Sensor for Detection of Temperature Fault Injection Attacks.
- Published in:
- Sensors & Materials, 2019, v. 31, n. 5, Part 1, p. 1375, doi. 10.18494/SAM.2019.2258
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- Publication type:
- Article
6
Application of a Non-Dominated Sorting Genetic Algorithm to Solve a Bi-Objective Scheduling Problem Regarding Printed Circuit Boards.
- Published in:
- Mathematics (2227-7390), 2022, v. 10, n. 13, p. 2305, doi. 10.3390/math10132305
- By:
- Publication type:
- Article
7
Through-Hole Buck Converters for Fast Prototyping: A Comparative Study.
- Published in:
- Electronics (2079-9292), 2025, v. 14, n. 7, p. 1273, doi. 10.3390/electronics14071273
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- Publication type:
- Article
8
Applying Machine Learning to Construct a Printed Circuit Board Gold Finger Defect Detection System.
- Published in:
- Electronics (2079-9292), 2024, v. 13, n. 6, p. 1090, doi. 10.3390/electronics13061090
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- Publication type:
- Article
9
Influence of a PCB Layout Design on the Efficiency of Heat Dissipation and Mutual Thermal Couplings between Transistors.
- Published in:
- Electronics (2079-9292), 2023, v. 12, n. 19, p. 4116, doi. 10.3390/electronics12194116
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- Publication type:
- Article
10
Experimental Implementation of a Low-Cost, Fully-Analog Self-Jamming Canceller for UHF RFID Devices.
- Published in:
- Electronics (2079-9292), 2020, v. 9, n. 5, p. 786, doi. 10.3390/electronics9050786
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- Publication type:
- Article
11
LABORATORY TEST OF SURFACE MOUNTED PERMANENT MAGNET BRUSHLESS MOTOR.
- Published in:
- Technical Transactions / Czasopismo Techniczne, 2016, v. 3-E, p. 185, doi. 10.4467/2353737XCT.16.276.6075
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- Publication type:
- Article
12
Flow characteristics of an offset jet over a surface mounted square rib.
- Published in:
- Journal of Turbulence, 2016, v. 17, n. 8, p. 727, doi. 10.1080/14685248.2016.1174779
- By:
- Publication type:
- Article
13
Strain measurement in micro-electronic packages using the digital image correlation method.
- Published in:
- Welding International, 2011, v. 25, n. 11, p. 844, doi. 10.1080/09507116.2011.590654
- By:
- Publication type:
- Article
14
Thermal Cycle Reliability of Copper Pillar Bumps in Advanced Fan-Out Packages.
- Published in:
- Journal of Electronic Materials, 2024, v. 53, n. 12, p. 8066, doi. 10.1007/s11664-024-11420-2
- By:
- Publication type:
- Article
15
Statistical Analysis of Thermal Treatment Effect of SMD Ni-RTD Batch Sensors and Its Direct Application Without Packaging for a Contact Thermometer.
- Published in:
- Journal of Electronic Materials, 2022, v. 51, n. 4, p. 1481, doi. 10.1007/s11664-022-09440-x
- By:
- Publication type:
- Article
16
Optimization of the Rapid Design System for Arts and Crafts Based on Big Data and 3D Technology.
- Published in:
- Complexity, 2021, p. 1, doi. 10.1155/2021/7906047
- By:
- Publication type:
- Article
17
Re-calibration of Engelmaier's Model for Leadless, Lead-free Solder Attachments.
- Published in:
- Quality & Reliability Engineering International, 2007, v. 23, n. 4, p. 415, doi. 10.1002/qre.810
- By:
- Publication type:
- Article
18
Comments on the IPC Surface Mount Attachment Reliability Guidelines.
- Published in:
- Quality & Reliability Engineering International, 2005, v. 21, n. 4, p. 345, doi. 10.1002/qre.667
- By:
- Publication type:
- Article
19
TOTAL QUALITY CONTROL FOR A SURFACE MOUNT TECHNOLOGY PROCESS FOR THE MANUFACTURE OF PRINTED CIRCUIT BOARD ASSEMBLIES.
- Published in:
- Quality & Reliability Engineering International, 1995, v. 11, n. 5, p. 325, doi. 10.1002/qre.4680110503
- By:
- Publication type:
- Article
20
MIL-HDBK-217 Status.
- Published in:
- Quality & Reliability Engineering International, 1992, v. 8, n. 5, p. 511
- Publication type:
- Article
21
Surface Mount Technology Guidelines.
- Published in:
- Quality & Reliability Engineering International, 1991, v. 7, n. 6, p. 514
- Publication type:
- Article
22
Surface Mount Technology.
- Published in:
- Quality & Reliability Engineering International, 1991, v. 7, n. 4, p. 351
- Publication type:
- Article
23
Scientific Guide to Surface Mount Technology (Book).
- Published in:
- 1989
- By:
- Publication type:
- Book Review
24
Surface Mount Technology.
- Published in:
- Quality & Reliability Engineering International, 1988, v. 4, n. 4, p. 367
- Publication type:
- Article
25
THE EFFECT OF PRETINNING ON THE STRENGTH OF A CHIP CARRIER SOLDER JOINT.
- Published in:
- Quality & Reliability Engineering International, 1988, v. 4, n. 3, p. 215, doi. 10.1002/qre.4680040304
- By:
- Publication type:
- Article
26
APPLICATION OF TAGUCHI METHODS TO SURFACE MOUNT PROCESSES.
- Published in:
- Quality & Reliability Engineering International, 1988, v. 4, n. 2, p. 171, doi. 10.1002/qre.4680040212
- By:
- Publication type:
- Article
27
News Digest.
- Published in:
- Quality & Reliability Engineering International, 1987, v. 3, n. 3, p. 203, doi. 10.1002/qre.4680030311
- Publication type:
- Article
28
SURFACE MOUNT DIGITAL PACKAGE RELIABILITY.
- Published in:
- Quality & Reliability Engineering International, 1986, v. 2, n. 4, p. 229, doi. 10.1002/qre.4680020404
- By:
- Publication type:
- Article
29
An efficient genetic algorithm for setup time minimization in PCB assembly.
- Published in:
- International Journal of Advanced Manufacturing Technology, 2015, v. 77, n. 5-8, p. 973, doi. 10.1007/s00170-014-6510-3
- By:
- Publication type:
- Article
30
A genetic-based algorithm for the operational sequence of a high speed chip placement machine.
- Published in:
- International Journal of Advanced Manufacturing Technology, 2008, v. 36, n. 9/10, p. 918, doi. 10.1007/s00170-006-0918-3
- By:
- Publication type:
- Article
31
Design and control of a novel linear wire bonding head.
- Published in:
- International Journal of Advanced Manufacturing Technology, 2008, v. 35, n. 11/12, p. 1136, doi. 10.1007/s00170-006-0795-9
- By:
- Publication type:
- Article
32
Automated inspection of PCB components using a genetic algorithm template-matching approach.
- Published in:
- International Journal of Advanced Manufacturing Technology, 2007, v. 35, n. 3/4, p. 293, doi. 10.1007/s00170-006-0730-0
- By:
- Publication type:
- Article
33
Printed circuit board scheduling in an openshop manufacturing environment.
- Published in:
- International Journal of Advanced Manufacturing Technology, 2006, v. 29, n. 9-10, p. 980, doi. 10.1007/s00170-005-2584-2
- By:
- Publication type:
- Article
34
Internet-based electronics manufacturing troubleshooting tool for surface mount PCB assembly.
- Published in:
- International Journal of Advanced Manufacturing Technology, 2006, v. 27, n. 5/6, p. 561, doi. 10.1007/s00170-004-2233-1
- By:
- Publication type:
- Article
35
Locating and checking of BGA pins’ position using gray level.
- Published in:
- International Journal of Advanced Manufacturing Technology, 2005, v. 26, n. 5/6, p. 491, doi. 10.1007/s00170-003-1617-y
- By:
- Publication type:
- Article
36
Optimal parameter design for chip-on-film technology using the Taguchi method.
- Published in:
- International Journal of Advanced Manufacturing Technology, 2005, v. 25, n. 1/2, p. 145, doi. 10.1007/s00170-003-1824-6
- By:
- Publication type:
- Article
37
Crosstalk reduction between RF input channels of coherent-driver-modulator package by introducing enhanced ground lead structure.
- Published in:
- Electronics Letters (Wiley-Blackwell), 2020, v. 56, n. 17, p. 893, doi. 10.1049/el.2020.1318
- By:
- Publication type:
- Article
38
Chip Appearance Inspection Method for High-Precision SMT Equipment.
- Published in:
- Machines, 2021, v. 9, n. 2, p. 34, doi. 10.3390/machines9020034
- By:
- Publication type:
- Article
39
Effect of Conformal Coating on Electrochemical Migration Behavior of Multi-Layer Ceramic Capacitor for Automotives Based on Water Drop Test.
- Published in:
- Coatings (2079-6412), 2024, v. 14, n. 3, p. 359, doi. 10.3390/coatings14030359
- By:
- Publication type:
- Article
40
Low-Profile Interconnects via Laser-Induced Forward Transfer.
- Published in:
- Journal of Laser Micro / Nanoengineering, 2018, v. 13, n. 2, p. 63, doi. 10.2961/jlmn.2018.02.0003
- By:
- Publication type:
- Article
41
Rapid fault cause identification in surface mount technology processes based on factory-wide data analysis.
- Published in:
- International Journal of Distributed Sensor Networks, 2019, v. 15, n. 2, p. 1, doi. 10.1177/1550147719832802
- By:
- Publication type:
- Article
42
THE DEVELOPMENT OF A BPN DATA MINING CALIBRATION SYSTEM IN A SMT PCB ASSEMBLY LINE.
- Published in:
- International Journal of Electronic Business Management, 2009, v. 7, n. 4, p. 286
- By:
- Publication type:
- Article
43
Process under control for automotive applications.
- Published in:
- EE: Evaluation Engineering, 2016, v. 55, n. 11, p. 20
- By:
- Publication type:
- Article
44
Zeroing in on Component Reliability.
- Published in:
- EE: Evaluation Engineering, 2008, v. 47, n. 9, p. 40
- By:
- Publication type:
- Article
45
Effect of Strain Rate on Joint Strength and Failure Mode of Lead-Free Solder Joints.
- Published in:
- Journal of Electronic Materials, 2018, v. 47, n. 3, p. 2073, doi. 10.1007/s11664-017-6014-7
- By:
- Publication type:
- Article
46
Microstructure and Reliability Comparison of Different Pb-Free Alloys Used for Wave Soldering and Rework.
- Published in:
- Journal of Electronic Materials, 2009, v. 38, n. 12, p. 2628, doi. 10.1007/s11664-009-0923-z
- By:
- Publication type:
- Article
47
The Effect of Ag Content on the Formation of Ag<sub>3</sub>Sn Plates in Sn-Ag-Cu Lead-Free Solder.
- Published in:
- Journal of Electronic Materials, 2006, v. 35, n. 12, p. 2074, doi. 10.1007/s11664-006-0316-5
- By:
- Publication type:
- Article
48
Reliability Testing of WLCSP Lead-Free Solder Joints.
- Published in:
- Journal of Electronic Materials, 2006, v. 35, n. 5, p. 1032, doi. 10.1007/BF02692564
- By:
- Publication type:
- Article
49
Interfacial Reaction Study on a Solder Joint with Sn-4Ag-0.5Cu Solder Ball and Sn-7Zn-Al (30 ppm) Solder Paste in a Lead-Free Wafer Level Chip Scale Package.
- Published in:
- Journal of Electronic Materials, 2004, v. 33, n. 12, p. 1550, doi. 10.1007/s11664-004-0097-7
- By:
- Publication type:
- Article
50
Minimizing the number of pickups on a multi-head placement machine.
- Published in:
- Journal of the Operational Research Society, 2007, v. 58, n. 1, p. 115, doi. 10.1057/palgrave.jors.2602136
- By:
- Publication type:
- Article