Works matching DE "STACKING machines"


Results: 187
    1
    2
    3
    4
    5
    6
    7
    8
    9
    10
    11
    12
    13
    14
    15
    16
    17
    18
    19
    20
    21
    22

    Use of Wafer Applied Underfill for 3D Stacking.

    Published in:
    Journal of Microelectronic & Electronic Packaging, 2012, v. 9, n. 1, p. 10, doi. 10.4071/imaps.317
    By:
    • La Manna, Antonio;
    • Rebibis, K. J.;
    • Gerets, C.;
    • Beyne, E.
    Publication type:
    Article
    23
    24
    25
    26
    27
    28
    29
    30
    31
    32
    33
    34
    35
    36
    37
    38
    39
    40
    41
    42
    43
    44
    45
    46
    47
    48
    49
    50