Works matching DE "SPUTTERING (Physics)"

Results: 1508

Cluster tool sputtering for compound semiconductors.

Published in:

Solid State Technology, 2001, v. 44, n. 7, p. 145

By:

Bavin, Andy

Publication type:

Article

Defects from substrate particles depend on the sputter deposition process.

Published in:

Solid State Technology, 2000, v. 43, n. 11, p. 95

By:

Mirkarimi, P.B.;
Baker, S.L.;
Wall, M.A.;
Kearney, P.A.;
Stearns, D.G.

Publication type:

Article

Growth predicted for sputtering target and sputtered film markets.

Published in:

Solid State Technology, 2000, v. 43, n. 1, p. 24

By:

Rittner, Mindy N.

Publication type:

Article

New concept in long throw sputtering.

Published in:: Solid State Technology, 1999, v. 42, n. 9, p. 26
Publication type:: Article

Tailoring sputtered Cr films on large wafers.

Published in:

Solid State Technology, 1999, v. 42, n. 7, p. 135

By:

Felmetsger, Valery

Publication type:

Article

Oxidation behaviour of plasma surface alloying on Ti6Al4V alloy.

Published in:

Surface Engineering, 2018, v. 34, n. 1, p. 14, doi. 10.1179/1743294415Y.0000000095

By:

Wei, D.-B.;
Zhang, P.-Z.;
Yao, Z.-J.;
Wei, X.-F.;
Zhou, J.-T.;
Chen, X.-H.

Publication type:

Article

Tunable electrical resistivity of oxygen-deficient zinc oxide thin films.

Published in:

Surface Engineering, 2017, v. 33, n. 3, p. 217, doi. 10.1080/02670844.2016.1212519

By:

Wang, Y.;
Peng, Z. J.;
Wang, Q.;
Fu, X. L.

Publication type:

Article

Optical properties of cubic AlN films grown by sputtering.

Published in:

Surface Engineering, 2016, v. 32, n. 4, p. 304, doi. 10.1179/1743294414Y.0000000399

By:

Choudhary, R. K.;
Mishra, P.;
Hubli, R. C.

Publication type:

Article

Optimisation of tribological performance of sputtering Zr/ZrC coatings.

Published in:

Surface Engineering, 2015, v. 31, n. 2, p. 103, doi. 10.1179/1743294414Y.0000000306

By:

Jean, M.-D.

Publication type:

Article

Method to design stoichiometric deposition reactive sputtering without hysteresis.

Published in:

Surface Engineering, 2013, v. 29, n. 7, p. 547, doi. 10.1179/1743294413Y.0000000155

By:

Faddeeva, S;
Oseguera, J

Publication type:

Article

Fabrication of ordered ripple patterns on GaAs(100) surface using 60 keV Ar+ beam irradiation.

Published in:

Surface Engineering, 2013, v. 29, n. 7, p. 543, doi. 10.1179/1743294413Y.0000000146

By:

Kumar, T;
Kumar, M;
Verma, S;
Kanjilal, D

Publication type:

Article

Thermodynamic model of reactive sputtering process.

Published in:

Surface Engineering, 2012, v. 28, n. 9, p. 639, doi. 10.1179/1743294412Y.0000000047

By:

Faddeeva, S;
Oseguera, J

Publication type:

Article

Study of high temperature oxidation kinetics of Co-Al coating on superalloy.

Published in:

Surface Engineering, 2012, v. 28, n. 8, p. 620, doi. 10.1179/1743294412Y.0000000041

By:

Rahman, A;
Jayaganthan, R;
Jain, R K;
Chandra, R;
Ambardar, R

Publication type:

Article

High temperature oxidation behaviour of Cr/Co-Al coated superalloy.

Published in:

Surface Engineering, 2012, v. 28, n. 4, p. 249, doi. 10.1179/1743294411Y.0000000030

By:

Rahman, A;
Chawla, V;
Jayaganthan, R;
Chandra, R;
Tewari, V K;
Ambardar, R

Publication type:

Article

Preparation of NiFe films by magnetic electroplating.

Published in:

Surface Engineering, 2012, v. 28, n. 1, p. 24, doi. 10.1179/1743294411Y.0000000063

By:

Yu, Y D;
Wei, G Y;
Lou, J W;
Sun, L X;
Jiang, L;
Ge, H L

Publication type:

Article

Synthesis and microstructural characterisation of CrSiN thin films deposited on Si(100) substrate.

Published in:

Surface Engineering, 2010, v. 26, n. 8, p. 596, doi. 10.1179/026708410X12459349720097

By:

Shah, H. N.;
Jayaganthan, R.;
Kaur, D.

Publication type:

Article

Importance of surface activation for nitrided layer formation on austenitic stainless steel.

Published in:

Surface Engineering, 2010, v. 26, n. 4, p. 293, doi. 10.1179/026708410X12550773058027

By:

Baranowska, J.

Publication type:

Article

Current developments in ionised physical vapour deposition by magnetron sputtering — state of the art — prospects for the future in terms of applications.

Published in:

Surface Engineering, 2008, v. 24, n. 5, p. 319, doi. 10.1179/174329408X3268

By:

Tessier, P. Y.

Publication type:

Article

Structural properties and electrical resistivity of TiNx and Ti1-xAlxN films prepared by reactive dc magnetron sputtering: effect of nitrogen flowrate.

Published in:

Surface Engineering, 2008, v. 24, n. 1, p. 28, doi. 10.1179/174329408X271552

By:

Irudayaraj, A. A.;
Kuppusami, P.;
Kalainathan, S.

Publication type:

Article

Sputter deposition of nanostructured antibacterial silver on polypropylene non-wovens.

Published in:

Surface Engineering, 2008, v. 24, n. 1, p. 70, doi. 10.1179/174329408X277493

By:

Wang, H. B.;
Wei, Q. F.;
Wang, J. Y.;
Hong, J. H.;
Zhao, X. Y.

Publication type:

Article

Bodycote Prize 2006: Best Technical/Scientific Paper Novel ceramic Ti–Si–C nanocomposite coatings for electrical contact applications.

Published in:

Surface Engineering, 2007, v. 23, n. 6, p. 406, doi. 10.1179/174329407X239126

By:

Eklund, P.

Publication type:

Article

Influence of nitrogen flow rate on growth of TiAlN films prepared by DC magnetron sputtering.

Published in:

Surface Engineering, 2007, v. 23, n. 1, p. 7, doi. 10.1179/174329407X161627

By:

Irudayaraj, A. A.;
Kuppusami, P.;
Thirumurugesan, R.;
Mohandas, E.;
Kalainathan, S.;
Raghunathan, V. S.

Publication type:

Article

Investigation of processing parameters for pulsed closed field unbalanced magnetron sputtered titanium carbide thin films.

Published in:

Surface Engineering, 2007, v. 23, n. 1, p. 23, doi. 10.1179/174329407X161645

By:

Anton, J. M.;
Mishra, B.;
Moore, J. J.

Publication type:

Article

Characterisation of surface texture using AFM with trimmed probe tip.

Published in:

Surface Engineering, 2006, v. 22, n. 6, p. 443, doi. 10.1179/174327806X124690

By:

Ali, M. Y.;
Lim, B. H.

Publication type:

Article

Surface characterisation studies of nickel–chromium PVD: EB evaporated low carbon steel samples.

Published in:

Surface Engineering, 2006, v. 22, n. 6, p. 447, doi. 10.1179/174329406X150459

By:

Subramanian, B.;
Jayachandran, M.;
Jayakrishnan, S.

Publication type:

Article

Influence of ion bombardment on structure and tribological performance of nanoscale multilayer C/Cr PVD coatings.

Published in:

Surface Engineering, 2006, v. 22, n. 2, p. 92, doi. 10.1179/174329406X98377

By:

Kok, Y. N.;
Wen, J. G.;
Petrov, I.;
Hovsepian, P.Eh.

Publication type:

Article

Process–microstructure–properties relationship during formation of AlN layers by physical vapour deposition.

Published in:

Surface Engineering, 2006, v. 22, n. 2, p. 109, doi. 10.1179/174329406X98449

By:

Figueroa, U.;
Salas, O.;
Oseguera, J.

Publication type:

Article

High deposition rate magnetrons: key elements and advantages.

Published in:

Surface Engineering, 2006, v. 22, n. 1, p. 5, doi. 10.1179/174329406X85038

By:

Mitin, V. S.;
Sharipov, E. I.;
Mitin, A. V.

Publication type:

Article

Characterisation of PVD TiCN layers by physical and electrochemical methods.

Published in:

Surface Engineering, 2005, v. 21, n. 2, p. 144, doi. 10.1179/174329405X40876

By:

Sienna, L. F.;
Achete, C. A.;
Hirsch, T.;
Mattos, O.

Publication type:

Article

Studies on nickel electrodeposits on dc magnetron sputtered copper substrates.

Published in:

Surface Engineering, 2005, v. 21, n. 2, p. 151, doi. 10.1179/174329405X40858

By:

Subramanian, B.;
Jayakumar, S.;
Jayachandran, M.;
Jayakrishnan, S.

Publication type:

Article

Abstracts.

Published in:: Surface Engineering, 2004, v. 20, n. 5, p. 396, doi. 10.1179/sur.2004.20.5.396
Publication type:: Article

Erratum.

Published in:: 2004
Publication type:: Correction Notice

Industrial Application of Pulsed Dc Bias Power Supplies in Closed Field Unbalanced Magnetron Sputter Ion Plating.

Published in:

Surface Engineering, 2004, v. 20, n. 3, p. 189, doi. 10.1179/026708404225016373

By:

Cooke, K. E.;
Hampshire, J.;
Southall, W.;
Teer, D. G.

Publication type:

Article

Effect of Pulsed Plasma Processing on Controlling Nanostructure And Properties of Thin Film/Coatings.

Published in:

Surface Engineering, 2004, v. 20, n. 3, p. 196, doi. 10.1179/026708404225016382

By:

Zhong, D.;
Mishra, B.;
Moore, J. J.;
Madan, A.

Publication type:

Article

Novel Enhanced Magnetron Sputtering System.

Published in:

Surface Engineering, 2004, v. 20, n. 3, p. 177, doi. 10.1179/026708404225016364

By:

Yehya, M.;
Kelly, P. J.

Publication type:

Article

Advanced Coatings Through Pulsed Magnetron Sputtering.

Published in:

Surface Engineering, 2004, v. 20, n. 3, p. 157, doi. 10.1179/026708404225010702

By:

Kelly, P. J.;
Hisek, J.;
Zhou, Y.;
Pilkington, R. D.;
Arnell, R. D.

Publication type:

Article

Guest Editorial.

Published in:

Surface Engineering, 2004, v. 20, n. 3, p. 153, doi. 10.1179/026708404225015059

By:

Kelly, Peter

Publication type:

Article

Time Resolved Langmuir Probe Characterisation of Reactive Pulse Magnetron Sputtering of MgO Thin Films.

Published in:

Surface Engineering, 2004, v. 20, n. 3, p. 163, doi. 10.1179/026708404225015013

By:

Richter, F.;
Welzel, T.;
Dunger, T.;
Kupfer, H.

Publication type:

Article

Pulsed Plasmas For Sputtering Applications.

Published in:

Surface Engineering, 2004, v. 20, n. 3, p. 174, doi. 10.1179/026708404225010711

By:

Sproul, W. D.;
Christie, D. J.;
Carter, D. C.;
Tomasel, F.;
Linz, T.

Publication type:

Article

Corrigendum.

Published in:: 2004
Publication type:: Erratum

Effect of Presputtering on Plasma Ion Nitriding of Aluminium Substrates.

Published in:

Surface Engineering, 2003, v. 19, n. 5, p. 337, doi. 10.1179/026708403225007527

By:

Figueroa, U.;
Salas, O.;
Oseguera, J.;
Rodríguez, S.;
Ruiz, B.

Publication type:

Article

Influence of Bias Voltage on Copper Nitride Films Deposited by Reactive Sputtering.

Published in:

Surface Engineering, 2003, v. 19, n. 1, p. 67, doi. 10.1179/026708403225002441

By:

Pierson, J. F.

Publication type:

Article

Co-sputtering Co–Ti alloy as a single barrier/liner for Co interconnects and thermal stability enhancement using TiN metal capping.

Published in:

Journal of Materials Science: Materials in Electronics, 2019, v. 30, n. 11, p. 10579, doi. 10.1007/s10854-019-01402-0

By:

Zhang, Dan;
Xu, Jing;
Mao, Shujuan;
Zhao, Chao;
Wang, Guilei;
Luo, Xue;
Li, Junfeng;
Li, Yongliang;
Wang, Wenwu;
Chen, Dapeng;
Ye, Tianchun;
Luo, Jun

Publication type:

Article

Fabrication, characterization and electrochemical simulation of AlN-gate ISFET pH sensor.

Published in:

Journal of Materials Science: Materials in Electronics, 2019, v. 30, n. 7, p. 7163, doi. 10.1007/s10854-019-01033-5

By:

Sinha, Soumendu;
Mukhiya, Ravindra;
Sharma, Rishi;
Khanna, P. K.;
Khanna, V. K.

Publication type:

Article

Electrical properties of thin silicon oxides grown at room temperature by ion beam sputtering technique.

Published in:

Journal of Materials Science: Materials in Electronics, 2019, v. 30, n. 5, p. 4880, doi. 10.1007/s10854-019-00782-7

By:

Ferrandis, Philippe;
Kanoun, Mehdi;
André, Bernard

Publication type:

Article

Structure and optoelectronic properties of AZO/Al/AZO tri-layer films grown on flexible substrates.

Published in:

Journal of Materials Science: Materials in Electronics, 2019, v. 30, n. 4, p. 3495, doi. 10.1007/s10854-018-00626-w

By:

Li, Xiuyan;
Lin, Chuanjin;
Xu, Chunyao

Publication type:

Article

Optimization of sulfurization time for properties of Cu2ZnSnS4 films and cells by sputtering method.

Published in:

Journal of Materials Science: Materials in Electronics, 2018, v. 29, n. 22, p. 19137, doi. 10.1007/s10854-018-0040-y

By:

Xu, Xin;
Wang, Shurong;
Ma, Xun;
Yang, Shuai;
Li, Yaobin;
Tang, Zhen

Publication type:

Article

Effect of substrate temperature on the structural, morphological and optical properties of copper bismuth sulfide thin films deposited by electron beam evaporation method.

Published in:

Journal of Materials Science: Materials in Electronics, 2018, v. 29, n. 20, p. 17201, doi. 10.1007/s10854-018-9812-7

By:

Bhuvaneswari, P. V.;
Ramamurthi, K.;
Babu, R. Ramesh

Publication type:

Article

Cu, Mo-doped and pristine-BiVO4 thin films prepared by rf sputtering process for photocatalytic applications.

Published in:

Journal of Materials Science: Materials in Electronics, 2018, v. 29, n. 18, p. 15770, doi. 10.1007/s10854-018-9241-7

By:

Merupo, V. I.;
Velumani, S.;
Abramova, A.;
Ordon, K.;
Makowska-Janusik, M.;
Kassiba, A.

Publication type:

Article

Electrical, structural, and topographical properties of direct current (DC) sputtered bilayer molybdenum thin films.

Published in:

Journal of Materials Science: Materials in Electronics, 2018, v. 29, n. 18, p. 15671, doi. 10.1007/s10854-018-9165-2

By:

Nwakanma, O.;
Reyes, P.;
Velumani, S.

Publication type:

Article