Works matching DE "SPUTTERING (Physics)"
1
- Solid State Technology, 2001, v. 44, n. 7, p. 145
- Article
2
- Solid State Technology, 2000, v. 43, n. 11, p. 95
- Mirkarimi, P.B.;
- Baker, S.L.;
- Wall, M.A.;
- Kearney, P.A.;
- Stearns, D.G.
- Article
3
- Solid State Technology, 2000, v. 43, n. 1, p. 24
- Article
4
- Solid State Technology, 1999, v. 42, n. 9, p. 26
- Article
5
- Solid State Technology, 1999, v. 42, n. 7, p. 135
- Article
6
- Surface Engineering, 2018, v. 34, n. 1, p. 14, doi. 10.1179/1743294415Y.0000000095
- Wei, D.-B.;
- Zhang, P.-Z.;
- Yao, Z.-J.;
- Wei, X.-F.;
- Zhou, J.-T.;
- Chen, X.-H.
- Article
7
- Surface Engineering, 2017, v. 33, n. 3, p. 217, doi. 10.1080/02670844.2016.1212519
- Wang, Y.;
- Peng, Z. J.;
- Wang, Q.;
- Fu, X. L.
- Article
8
- Surface Engineering, 2016, v. 32, n. 4, p. 304, doi. 10.1179/1743294414Y.0000000399
- Choudhary, R. K.;
- Mishra, P.;
- Hubli, R. C.
- Article
9
- Surface Engineering, 2015, v. 31, n. 2, p. 103, doi. 10.1179/1743294414Y.0000000306
- Article
10
- Surface Engineering, 2013, v. 29, n. 7, p. 547, doi. 10.1179/1743294413Y.0000000155
- Article
11
- Surface Engineering, 2013, v. 29, n. 7, p. 543, doi. 10.1179/1743294413Y.0000000146
- Kumar, T;
- Kumar, M;
- Verma, S;
- Kanjilal, D
- Article
12
- Surface Engineering, 2012, v. 28, n. 9, p. 639, doi. 10.1179/1743294412Y.0000000047
- Article
13
- Surface Engineering, 2012, v. 28, n. 8, p. 620, doi. 10.1179/1743294412Y.0000000041
- Rahman, A;
- Jayaganthan, R;
- Jain, R K;
- Chandra, R;
- Ambardar, R
- Article
14
- Surface Engineering, 2012, v. 28, n. 4, p. 249, doi. 10.1179/1743294411Y.0000000030
- Rahman, A;
- Chawla, V;
- Jayaganthan, R;
- Chandra, R;
- Tewari, V K;
- Ambardar, R
- Article
15
- Surface Engineering, 2012, v. 28, n. 1, p. 24, doi. 10.1179/1743294411Y.0000000063
- Yu, Y D;
- Wei, G Y;
- Lou, J W;
- Sun, L X;
- Jiang, L;
- Ge, H L
- Article
16
- Surface Engineering, 2010, v. 26, n. 8, p. 596, doi. 10.1179/026708410X12459349720097
- Shah, H. N.;
- Jayaganthan, R.;
- Kaur, D.
- Article
17
- Surface Engineering, 2010, v. 26, n. 4, p. 293, doi. 10.1179/026708410X12550773058027
- Article
18
- Surface Engineering, 2008, v. 24, n. 5, p. 319, doi. 10.1179/174329408X3268
- Article
19
- Surface Engineering, 2008, v. 24, n. 1, p. 28, doi. 10.1179/174329408X271552
- Irudayaraj, A. A.;
- Kuppusami, P.;
- Kalainathan, S.
- Article
20
- Surface Engineering, 2008, v. 24, n. 1, p. 70, doi. 10.1179/174329408X277493
- Wang, H. B.;
- Wei, Q. F.;
- Wang, J. Y.;
- Hong, J. H.;
- Zhao, X. Y.
- Article
21
- Surface Engineering, 2007, v. 23, n. 6, p. 406, doi. 10.1179/174329407X239126
- Article
22
- Surface Engineering, 2007, v. 23, n. 1, p. 7, doi. 10.1179/174329407X161627
- Irudayaraj, A. A.;
- Kuppusami, P.;
- Thirumurugesan, R.;
- Mohandas, E.;
- Kalainathan, S.;
- Raghunathan, V. S.
- Article
23
- Surface Engineering, 2007, v. 23, n. 1, p. 23, doi. 10.1179/174329407X161645
- Anton, J. M.;
- Mishra, B.;
- Moore, J. J.
- Article
24
- Surface Engineering, 2006, v. 22, n. 6, p. 443, doi. 10.1179/174327806X124690
- Article
25
- Surface Engineering, 2006, v. 22, n. 6, p. 447, doi. 10.1179/174329406X150459
- Subramanian, B.;
- Jayachandran, M.;
- Jayakrishnan, S.
- Article
26
- Surface Engineering, 2006, v. 22, n. 2, p. 92, doi. 10.1179/174329406X98377
- Kok, Y. N.;
- Wen, J. G.;
- Petrov, I.;
- Hovsepian, P.Eh.
- Article
27
- Surface Engineering, 2006, v. 22, n. 2, p. 109, doi. 10.1179/174329406X98449
- Figueroa, U.;
- Salas, O.;
- Oseguera, J.
- Article
28
- Surface Engineering, 2006, v. 22, n. 1, p. 5, doi. 10.1179/174329406X85038
- Mitin, V. S.;
- Sharipov, E. I.;
- Mitin, A. V.
- Article
29
- Surface Engineering, 2005, v. 21, n. 2, p. 144, doi. 10.1179/174329405X40876
- Sienna, L. F.;
- Achete, C. A.;
- Hirsch, T.;
- Mattos, O.
- Article
30
- Surface Engineering, 2005, v. 21, n. 2, p. 151, doi. 10.1179/174329405X40858
- Subramanian, B.;
- Jayakumar, S.;
- Jayachandran, M.;
- Jayakrishnan, S.
- Article
31
- Surface Engineering, 2004, v. 20, n. 5, p. 396, doi. 10.1179/sur.2004.20.5.396
- Article
33
- Surface Engineering, 2004, v. 20, n. 3, p. 189, doi. 10.1179/026708404225016373
- Cooke, K. E.;
- Hampshire, J.;
- Southall, W.;
- Teer, D. G.
- Article
34
- Surface Engineering, 2004, v. 20, n. 3, p. 196, doi. 10.1179/026708404225016382
- Zhong, D.;
- Mishra, B.;
- Moore, J. J.;
- Madan, A.
- Article
35
- Surface Engineering, 2004, v. 20, n. 3, p. 177, doi. 10.1179/026708404225016364
- Article
36
- Surface Engineering, 2004, v. 20, n. 3, p. 157, doi. 10.1179/026708404225010702
- Kelly, P. J.;
- Hisek, J.;
- Zhou, Y.;
- Pilkington, R. D.;
- Arnell, R. D.
- Article
37
- Surface Engineering, 2004, v. 20, n. 3, p. 153, doi. 10.1179/026708404225015059
- Article
38
- Surface Engineering, 2004, v. 20, n. 3, p. 163, doi. 10.1179/026708404225015013
- Richter, F.;
- Welzel, T.;
- Dunger, T.;
- Kupfer, H.
- Article
39
- Surface Engineering, 2004, v. 20, n. 3, p. 174, doi. 10.1179/026708404225010711
- Sproul, W. D.;
- Christie, D. J.;
- Carter, D. C.;
- Tomasel, F.;
- Linz, T.
- Article
41
- Surface Engineering, 2003, v. 19, n. 5, p. 337, doi. 10.1179/026708403225007527
- Figueroa, U.;
- Salas, O.;
- Oseguera, J.;
- Rodríguez, S.;
- Ruiz, B.
- Article
42
- Surface Engineering, 2003, v. 19, n. 1, p. 67, doi. 10.1179/026708403225002441
- Article
43
- Journal of Materials Science: Materials in Electronics, 2019, v. 30, n. 11, p. 10579, doi. 10.1007/s10854-019-01402-0
- Zhang, Dan;
- Xu, Jing;
- Mao, Shujuan;
- Zhao, Chao;
- Wang, Guilei;
- Luo, Xue;
- Li, Junfeng;
- Li, Yongliang;
- Wang, Wenwu;
- Chen, Dapeng;
- Ye, Tianchun;
- Luo, Jun
- Article
44
- Journal of Materials Science: Materials in Electronics, 2019, v. 30, n. 7, p. 7163, doi. 10.1007/s10854-019-01033-5
- Sinha, Soumendu;
- Mukhiya, Ravindra;
- Sharma, Rishi;
- Khanna, P. K.;
- Khanna, V. K.
- Article
45
- Journal of Materials Science: Materials in Electronics, 2019, v. 30, n. 5, p. 4880, doi. 10.1007/s10854-019-00782-7
- Ferrandis, Philippe;
- Kanoun, Mehdi;
- André, Bernard
- Article
46
- Journal of Materials Science: Materials in Electronics, 2019, v. 30, n. 4, p. 3495, doi. 10.1007/s10854-018-00626-w
- Li, Xiuyan;
- Lin, Chuanjin;
- Xu, Chunyao
- Article
47
- Journal of Materials Science: Materials in Electronics, 2018, v. 29, n. 22, p. 19137, doi. 10.1007/s10854-018-0040-y
- Xu, Xin;
- Wang, Shurong;
- Ma, Xun;
- Yang, Shuai;
- Li, Yaobin;
- Tang, Zhen
- Article
48
- Journal of Materials Science: Materials in Electronics, 2018, v. 29, n. 20, p. 17201, doi. 10.1007/s10854-018-9812-7
- Bhuvaneswari, P. V.;
- Ramamurthi, K.;
- Babu, R. Ramesh
- Article
49
- Journal of Materials Science: Materials in Electronics, 2018, v. 29, n. 18, p. 15770, doi. 10.1007/s10854-018-9241-7
- Merupo, V. I.;
- Velumani, S.;
- Abramova, A.;
- Ordon, K.;
- Makowska-Janusik, M.;
- Kassiba, A.
- Article
50
- Journal of Materials Science: Materials in Electronics, 2018, v. 29, n. 18, p. 15671, doi. 10.1007/s10854-018-9165-2
- Nwakanma, O.;
- Reyes, P.;
- Velumani, S.
- Article