Works about SOLIDIFICATION

Results: 5000

Development of a performance threshold approach for identifying the management options for stabilisation/solidification of lead polluted soils.

Published in:

Journal of Environmental Engineering & Landscape Management, 2014, v. 22, n. 2, p. 85, doi. 10.3846/16486897.2013.821070

By:

Falciglia, Pietro Paolo;
Al-Tabbaa, Abir;
Vagliasindi, Federico G. A.

Publication type:

Article

Analysis of Gate Freeze-Off Time in Injection Molding.

Published in:

Polymer Engineering & Science, 2004, v. 44, n. 1, p. 1, doi. 10.1002/pen.20000

By:

Pantani, R.;
de Santis, F.;
Brucato, V.;
Titomanlio, G.

Publication type:

Article

Industrial Solidification Processes in Polybutene-1. Part II-Influence of Shear Flow.

Published in:

Polymer Engineering & Science, 2003, v. 43, n. 1, p. 189, doi. 10.1002/pen.10016

By:

Braun, J.;
Wippel, H.;
Eder, G.;
Janeschitz-Kriegl, H.

Publication type:

Article

Numerical Simulation of Crystallization in High Density Polyethylene Extrudates.

Published in:

Polymer Engineering & Science, 2000, v. 40, n. 11, p. 2356, doi. 10.1002/pen.11368

By:

Pillai, K.M.;
Advani, S.G.

Publication type:

Article

Morphological Modeling of Polymer Solidification.

Published in:

Polymer Engineering & Science, 2000, v. 40, n. 8, p. 1796, doi. 10.1002/pen.11311

By:

Tao Huang;
Kamal, M.R.

Publication type:

Article

Viscoelastic Properties and Transitions During Thermal and UV Cure of a Methacrylate Resin.

Published in:

Polymer Engineering & Science, 1999, v. 39, n. 9, p. 1651, doi. 10.1002/pen.11559

By:

Lange, Jakob

Publication type:

Article

A multiscale model for polymer crystallization. I: Growth of individual spherulites.

Published in:

Polymer Engineering & Science, 1998, v. 38, n. 4, p. 634, doi. 10.1002/pen.10228

By:

Swaminarayan, Sriram;
Charbon, Christian

Publication type:

Article

Two-stage crystallization kinetics modeling of a miscible blend system containing crystallizable...

Published in:

Polymer Engineering & Science, 1998, v. 38, n. 4, p. 583, doi. 10.1002/pen.10221

By:

Woo, Eamor M.;
Yau, Shang N.

Publication type:

Article

Heat transfer and solidification of polymer melt flow in a channel.

Published in:

Polymer Engineering & Science, 1997, v. 37, n. 7, p. 1247, doi. 10.1002/pen.11769

By:

Lin, P.;
Jaluria, Y.

Publication type:

Article

Rietveld analysis for studying the decarburisation in HVOF WC-CO coatings.

Published in:

Surface Engineering, 2018, v. 34, n. 10, p. 747, doi. 10.1080/02670844.2017.1415737

By:

Bouaricha, Salim;
Ouchene, Amina;
Legoux, Jean-Gabriel

Publication type:

Article

Laser resurfacing of Al–Zn–Mg–Si coatings.

Published in:

Surface Engineering, 2016, v. 32, n. 12, p. 902, doi. 10.1080/02670844.2015.1104100

By:

Peng, C. T.;
Chen, Z.;
Liu, Q.;
Nolan, D.;
Li, H.

Publication type:

Article

Improving performances of microchannels in microfluidic chip using solidifiable adhesive film.

Published in:

Surface Engineering, 2015, v. 31, n. 7, p. 545, doi. 10.1179/1743294414Y.0000000436

By:

Wu, J.;
Guo, W.;
Wang, C.;
Li, Y.;
Chen, T.;
Yu, K.

Publication type:

Article

The Solidification Rheology of Amorphous Polymers − Vitrification as Compared to Gelation.

Published in:

Macromolecular Symposia, 2017, v. 374, n. 1, p. n/a, doi. 10.1002/masy.201600113

By:

Winter, Henning H.

Publication type:

Article

Monitoring experiment and simulation on solidification of DNAN based melt‐cast explosive with FBG sensors.

Published in:

Propellants, Explosives, Pyrotechnics, 2024, v. 49, n. 2, p. 1, doi. 10.1002/prep.202300232

By:

Yuan, Junming;
Sun, Hu;
Sha, Hongbo;
Hu, Fei;
Qin, Yue;
Liu, Yan;
Cai, Xingwang

Publication type:

Article

Thermal Properties Study of Low‐Melting‐Point‐DNAN and Analysis of Solidification Behavior of High‐Melting‐Point‐DNAN.

Published in:

Propellants, Explosives, Pyrotechnics, 2021, v. 46, n. 9, p. 1415, doi. 10.1002/prep.202100091

By:

Shi, Danan;
Chen, Lizhen;
Wang, Jianlong;
Chen, Jun;
Pan, Hongxia

Publication type:

Article

Moisture Proofing of Spray Dried Particles Comprising Ammonium Nitrate/Potassium Nitrate/Polymer.

Published in:

Propellants, Explosives, Pyrotechnics, 2015, v. 40, n. 4, p. 544, doi. 10.1002/prep.201400125

By:

Nagayama, Seiichiro;
Katoh, Katsumi;
Higashi, Eiko;
Hayashi, Masahiko;
Kumagae, Kosuke;
Habu, Hiroto;
Wada, Yuji;
Nakano, Katsuyuki;
Arai, Mitsuru

Publication type:

Article

Solidification Behavior of the Hydrazine Nitrate-Nitroguanidine Eutectic System.

Published in:

Propellants, Explosives, Pyrotechnics, 2014, v. 39, n. 2, p. 217, doi. 10.1002/prep.201300030

By:

Chen, Ling;
Li, Hua ‐ Rong;
Xu, Rui ‐ Juan;
Xiong, Ying;
Xu, Tao;
Huang, Bo ‐ Yong;
Shu, Yuan ‐ Jie

Publication type:

Article

Disassembly of Crystalline Platelets of an Amphiphilic Triblock Copolymer Mediated by Varying pH and Organic Diacids.

Published in:

Macromolecular Chemistry & Physics, 2019, v. 220, n. 15, p. N.PAG, doi. 10.1002/macp.201900187

By:

Luo, Haipeng;
Lin, Yonghui;
Tang, Qiuju;
Hu, Wei;
Wang, Yaping;
Lei, Zhentao;
Tong, Zaizai

Publication type:

Article

Melting, Solidification, and Crystallization of a Thermoplastic Polyurethane as a Function of Hard Segment Content.

Published in:

Macromolecular Chemistry & Physics, 2019, v. 220, n. 11, p. N.PAG, doi. 10.1002/macp.201900074

By:

Stribeck, Almut;
Eling, Berend;
Pöselt, Elmar;
Malfois, Marc;
Schander, Edgar

Publication type:

Article

Microstructure refinement, thermodynamic characteristic, wettability and shear strength of Bi-added rapid solidification SAC305 solder.

Published in:

Journal of Materials Science: Materials in Electronics, 2022, v. 33, n. 10, p. 8016, doi. 10.1007/s10854-022-07952-0

By:

Long, Zhiyong;
Liu, Shengfa;
Liu, Li;
Tan, Yingzhen;
Wang, Zhen;
Wang, Xinbiao

Publication type:

Article

Role of graphene oxide (GO) for enhancing the solidification rate and mechanical properties of Sn–6.5Zn–0.4 wt% Cu Pb-free solder alloy.

Published in:

Journal of Materials Science: Materials in Electronics, 2022, v. 33, n. 1, p. 522, doi. 10.1007/s10854-021-07324-0

By:

Fouda, A. N.;
Eid, E. A.

Publication type:

Article

Effect of the cooling rate in solidification on the electrical behavior of solder.

Published in:

Journal of Materials Science: Materials in Electronics, 2021, v. 32, n. 6, p. 7867, doi. 10.1007/s10854-021-05511-7

By:

Yang, Wenyi;
Chung, D. D. L.

Publication type:

Article

Advancement solidification microstructure and mechanical properties of Sn–2.0Ag–0.5Cu alloy by applying a rotary magnetic field.

Published in:

Journal of Materials Science: Materials in Electronics, 2019, v. 30, n. 20, p. 18838, doi. 10.1007/s10854-019-02240-w

By:

Hammad, A. E.;
Ragab, M.

Publication type:

Article

Impact of Sb additives on solidification performance, microstructure enhancement and tensile characteristics of Sn-6.5Zn-0.3Cu Pb-free solder alloy.

Published in:

Journal of Materials Science: Materials in Electronics, 2019, v. 30, n. 7, p. 6507, doi. 10.1007/s10854-019-00956-3

By:

Eid, E. A.;
El-Khawas, E. H.;
Abd-Elrahman, Ashraf S.

Publication type:

Article

Dependence of grain orientation in SABI333 solder joints on solidification temperature.

Published in:

Journal of Materials Science: Materials in Electronics, 2018, v. 29, n. 14, p. 12221, doi. 10.1007/s10854-018-9333-4

By:

Han, Jing;
Sun, Jian;
Wen, Tingyu;
Guo, Fu

Publication type:

Article

Microstructure and thermoelectric properties of un-doped Mg2Si1−xSnx single crystals prepared by high temperature gradient directional solidification.

Published in:

Journal of Materials Science: Materials in Electronics, 2018, v. 29, n. 8, p. 6245, doi. 10.1007/s10854-018-8601-7

By:

Li, Xin;
Li, Shuangming;
Yang, Bin;
Feng, Songke;
Zhong, Hong

Publication type:

Article

Preparation and capacitance properties of Al-doped hierarchical TiO nanostructure by oxidation of Ti-8Al alloy.

Published in:

Journal of Materials Science: Materials in Electronics, 2017, v. 28, n. 18, p. 13770, doi. 10.1007/s10854-017-7222-x

By:

Jiang, Liyang;
Qi, Jiqiu;
Sui, Yanwei;
Liu, Xiaofeng;
He, Yezeng;
Meng, Qingkun;
Wei, Fuxiang;
Sun, Zhi;
Jin, Yunxue

Publication type:

Article

Effect of magnetic flux density on Sn crystallographic orientation in a solder joint system.

Published in:

Journal of Materials Science: Materials in Electronics, 2016, v. 27, n. 4, p. 3710, doi. 10.1007/s10854-015-4212-8

By:

Yamanaka, Kimihiro;
Nishikawa, Hiroshi;
Taguchi, Hirohisa;
Harada, Miyuki;
Ochi, Koichi

Publication type:

Article

Influence of latent heat released from solder joints on the reflow temperature profile.

Published in:

Journal of Materials Science: Materials in Electronics, 2016, v. 27, n. 1, p. 543, doi. 10.1007/s10854-015-3787-4

By:

Dušek, K.;
Rudajevová, A.;
Plaček, M.

Publication type:

Article

Fluidity of Sn-based eutectic solder alloys.

Published in:

Journal of Materials Science: Materials in Electronics, 2015, v. 26, n. 12, p. 9478, doi. 10.1007/s10854-015-3415-3

By:

Morando, Carina;
Fornaro, Osvaldo;
Garbellini, Olga;
Palacio, Hugo

Publication type:

Article

Evaluation of cooling rate on electrochemical behavior of Sn-0.3Ag-0.9Zn solder alloy in 3.5 wt% NaCl solution.

Published in:

Journal of Materials Science: Materials in Electronics, 2015, v. 26, n. 1, p. 11, doi. 10.1007/s10854-014-2356-6

By:

Wang, Huan;
Gao, Zhiming;
Liu, Yongchang;
Li, Chong;
Ma, Zongqing;
Yu, Liming

Publication type:

Article

In situ study on growth behavior of CuSn during solidification with an applied DC in RE-doped Sn-Cu solder alloys.

Published in:

Journal of Materials Science: Materials in Electronics, 2014, v. 25, n. 10, p. 4538, doi. 10.1007/s10854-014-2201-y

By:

Zhou, Peng;
Kang, Huijun;
Cao, Fei;
Fu, Yanan;
Xiao, Tiqiao;
Wang, Tongmin

Publication type:

Article

Thermal properties of Sn-based solder alloys.

Published in:

Journal of Materials Science: Materials in Electronics, 2014, v. 25, n. 8, p. 3440, doi. 10.1007/s10854-014-2036-6

By:

Morando, Carina;
Fornaro, Osvaldo;
Garbellini, Olga;
Palacio, Hugo

Publication type:

Article

Development of solidification microstructure and tensile mechanical properties of Sn-0.7Cu and Sn-0.7Cu-2.0Ag solders.

Published in:

Journal of Materials Science: Materials in Electronics, 2014, v. 25, n. 1, p. 478, doi. 10.1007/s10854-013-1612-5

By:

Spinelli, José;
Garcia, Amauri

Publication type:

Article

Effects of 0.1 wt% Ni addition and rapid solidification process on Sn–9Zn solder.

Published in:

Journal of Materials Science: Materials in Electronics, 2013, v. 24, n. 12, p. 4868, doi. 10.1007/s10854-013-1490-x

By:

Jing, Yanxia;
Sheng, Guangmin;
Huang, Zhenhua;
Zhao, Guoji

Publication type:

Article

Solidification and interfacial interactions in gold–tin system during eutectic or thermo-compression bonding for 200 mm MEMS wafer level hermetic packaging.

Published in:

Journal of Materials Science: Materials in Electronics, 2013, v. 24, n. 12, p. 5000, doi. 10.1007/s10854-013-1515-5

By:

Garnier, Arnaud;
Baillin, Xavier;
Hodaj, Fiqiri

Publication type:

Article

Observation of the solidification microstructure of Sn3.5Ag droplets prepared by CDCA technique.

Published in:

Journal of Materials Science: Materials in Electronics, 2012, v. 23, n. 12, p. 2221, doi. 10.1007/s10854-012-0766-x

By:

Zhao, Jin;
Gao, Yulai;
Zhang, Weipeng;
Song, Tingting;
Zhai, Qijie

Publication type:

Article

The effects of temperature gradient and growth rate on the microstructure of directionally solidified Sn-3.5Ag eutectic solder.

Published in:

Journal of Materials Science: Materials in Electronics, 2012, v. 23, n. 2, p. 484, doi. 10.1007/s10854-011-0422-x

By:

Şahin, Mevlüt;
Çadirli, Emin

Publication type:

Article

The effect of composition on microhardness and determination of electrical and thermal properties in the Sn-Cu alloys.

Published in:

Journal of Materials Science: Materials in Electronics, 2011, v. 22, n. 9, p. 1378, doi. 10.1007/s10854-011-0317-x

By:

Çadırlı, E.;
Kaya, H.

Publication type:

Article

Recent advances on Sn-Cu solders with alloying elements: review.

Published in:

Journal of Materials Science: Materials in Electronics, 2011, v. 22, n. 6, p. 565, doi. 10.1007/s10854-011-0291-3

By:

Guang Zeng;
Songbai Xue;
Liang Zhang;
Lili Gao

Publication type:

Article

Effects of glass components on crystallization and dielectric properties of BST glass–ceramics.

Published in:

Journal of Materials Science: Materials in Electronics, 2008, v. 19, n. 12, p. 1233, doi. 10.1007/s10854-008-9566-8

By:

Isaka, Nobuyuki;
Ohkawa, Kensuke;
Kiyono, Hajime;
Itoh, Hidenobu;
Takahashi, Junichi

Publication type:

Article

Growth and characterization of III-N bulk crystals.

Published in:

Journal of Materials Science: Materials in Electronics, 2008, v. 19, n. 8/9, p. 845, doi. 10.1007/s10854-007-9500-5

By:

Frazier, R. M.;
Feigelson, B. N.;
Twigg, M. E.;
Murthy, M.;
Freitas, J. A.

Publication type:

Article

Sol-gel nanocomposites as metamaterials: preparation and optical measurements.

Published in:

Journal of Materials Science: Materials in Electronics, 2007, v. 18, p. 435, doi. 10.1007/s10854-007-9254-0

By:

Kielbasa, J. E.;
Liu, J.;
Ucer, K. B.;
Carroll, D. L.;
Williams, R. T.

Publication type:

Article

Fabrication of room temperature-stable 12CaO · 7Al2O3 electride: a review.

Published in:

Journal of Materials Science: Materials in Electronics, 2007, v. 18, p. 5, doi. 10.1007/s10854-007-9183-y

By:

Sung-Wng Kim;
Matsuishi, Satoru;
Miyakawa, Masashi;
Hayashi, Katsuro;
Hirano, Masahiro;
Hosono, Hideo

Publication type:

Article

Characterization of threonine side chain dynamics in an antifreeze protein using natural abundance 13C NMR spectroscopy.

Published in:

Journal of Biomolecular NMR, 2004, v. 29, n. 2, p. 139, doi. 10.1023/B:JNMR.0000019250.02229.a8

By:

Daley, Margaret E.;
Sykes, Brian D.

Publication type:

Article

Thermal effect on microstructure and mechanical properties in directed energy deposition of AISI 316L.

Published in:

International Journal of Advanced Manufacturing Technology, 2024, v. 134, n. 7/8, p. 3337, doi. 10.1007/s00170-024-14274-4

By:

Liu, Weiwei;
Hu, Guangda;
Yan, Zhaorui;
Liu, Bingjun;
Wang, Tandong;
Lyu, Zhenxin

Publication type:

Article

Analysis of melting-to-solidification flow patterns with changes in depositional position during the wire–arc direct energy deposition process.

Published in:

International Journal of Advanced Manufacturing Technology, 2024, v. 134, n. 5/6, p. 2179, doi. 10.1007/s00170-024-14236-w

By:

Ahn, Sang-Hyun;
Bae, Jun Sung;
Cho, Dae-Won;
Park, Young Whan

Publication type:

Article

Efficient identification of a flow-induced crystallization model for injection molding simulation.

Published in:

International Journal of Advanced Manufacturing Technology, 2024, v. 133, n. 11/12, p. 5243, doi. 10.1007/s00170-024-13961-6

By:

Saad, Sandra;
Cruz, Camilo;
Régnier, Gilles;
Ammar, Amine

Publication type:

Article

Size and build strategy effects for the L-PBF process applied to Inconel 625 vertical struts: a combined numerical and experimental approach.

Published in:

International Journal of Advanced Manufacturing Technology, 2024, v. 132, n. 9/10, p. 5063, doi. 10.1007/s00170-024-13634-4

By:

Peyre, Patrice;
Da Silva, Julien Rodrigues;
Hamouche, Zehoua;
Helbert, Anne-Laure;
Daligault, Julien;
Dal, Morgan;
Coste, Frédéric;
Baudin, Thierry

Publication type:

Article

Effects of Fe-6.5wt.%Si alloys prepared by different cooling methods on ordered structure and mechanical properties.

Published in:

International Journal of Advanced Manufacturing Technology, 2024, v. 131, n. 11, p. 5679, doi. 10.1007/s00170-022-09761-5

By:

Xuan, Dongpo;
Zhou, Cheng;
Zhou, You;
Jiang, Tianliang;
Zhu, Biji;
Fan, Wenhao

Publication type:

Article