Works matching DE "SOLDERING equipment %26 supplies manufacturing"
Results: 10
Ecologically clean solder based on Sn-Ag-Cu.
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- Welding International, 2011, v. 25, n. 7, p. 531, doi. 10.1080/09507116.2011.554256
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- Article
Development of a push–pull ventilation system to control solder fume.
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- Annals of Occupational Hygiene, 2001, v. 45, n. 8, p. 669, doi. 10.1093/annhyg/45.8.669
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- Article
Constraining Effects of Lead-Free Solder Joints During Stress Relaxation.
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- Journal of Electronic Materials, 2009, v. 38, n. 3, p. 392, doi. 10.1007/s11664-008-0604-3
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- Article
Wetting Kinetics of Eutectic Lead and Lead-Free Solders: Spreading over the Cu Surface.
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- Journal of Electronic Materials, 2009, v. 38, n. 2, p. 284, doi. 10.1007/s11664-008-0590-5
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- Article
DAMAGE MECHANISM ANALYSIS OF DEVICE FOR THE WAVE SOLDERING.
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- Annals of DAAAM & Proceedings, 2011, p. 1019
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- Article
Corrosion behaviour of soldered joints of magnesium alloys and dissimilar materials.
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- Microchimica Acta, 2006, v. 156, n. 1/2, p. 151, doi. 10.1007/s00604-006-0611-0
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- Article
Thermophysical structure-sensitive properties of Tin-Zinc alloys.
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- Journal of Materials Science: Materials in Electronics, 2017, v. 28, n. 1, p. 750, doi. 10.1007/s10854-016-5586-y
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- Article
Reflection-area-based feature descriptor for solder joint inspection.
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- Machine Vision & Applications, 2007, v. 18, n. 2, p. 95, doi. 10.1007/s00138-006-0051-1
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- Article
Micro-impact testing system evaluates microelectronic parts.
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- Advanced Materials & Processes, 2008, v. 166, n. 1, p. 20
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- Article
Noncontact laser soldering joins arrays of solar cells.
- Published in:
- Advanced Materials & Processes, 2007, v. 165, n. 12, p. 9
- Publication type:
- Article