Found: 25
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Transparent Solder guard.
- Published in:
- 1990
- Publication type:
- Product Review
Silver and Gold Solders -- Analysis Due to Corrosion.
- Published in:
- Quintessence International, 1981, v. 12, n. 3, p. 327
- By:
- Publication type:
- Article
DAMAGE MECHANISM ANALYSIS OF DEVICE FOR THE WAVE SOLDERING.
- Published in:
- Annals of DAAAM & Proceedings, 2011, p. 1019
- By:
- Publication type:
- Article
Lead-free solders: Still learning, adapting, and working out the kinks.
- Published in:
- JOM: The Journal of The Minerals, Metals & Materials Society (TMS), 2010, v. 62, n. 7, p. 15, doi. 10.1007/s11837-010-0101-z
- By:
- Publication type:
- Article
Improved microstructure, thermal and tensile properties of Zn and graphine oxide nano sheets (GONSs) doped Sn-1 wt%Ag-0.5 wt%Cu for electronic assemblies.
- Published in:
- Journal of Materials Science: Materials in Electronics, 2017, v. 28, n. 24, p. 19181, doi. 10.1007/s10854-017-7877-3
- By:
- Publication type:
- Article
Innovative parametric design for environmentally conscious adhesive dispensing process.
- Published in:
- Journal of Intelligent Manufacturing, 2015, v. 26, n. 1, p. 1, doi. 10.1007/s10845-013-0755-9
- By:
- Publication type:
- Article
Somont.
- Published in:
- 2011
- Publication type:
- Product Review
2BG offers complete automation of string bussing soldering process.
- Published in:
- 2011
- Publication type:
- Product Review
Working in Tight Places.
- Published in:
- Nautical Research Journal, 2019, v. 64, n. 3, p. 281
- By:
- Publication type:
- Article
Jewelry Makers Tools for the Model Maker.
- Published in:
- Nautical Research Journal, 2017, v. 62, n. 3, p. 227
- By:
- Publication type:
- Article
Reducing the Cost of the Production Process. Selective Soldering -- Continuous Improvement.
- Published in:
- Journal of Computer Science & Control Systems, 2015, v. 8, n. 1, p. 11
- By:
- Publication type:
- Article
Getting a head start on device design and manufacturing.
- Published in:
- 2016
- By:
- Publication type:
- Product Review
Evolution of the Microstructure of Sn58Bi Solder Paste with Sn-3.0Ag-0.5Cu Addition During Isothermal Aging.
- Published in:
- Journal of Electronic Materials, 2019, v. 48, n. 3, p. 1758, doi. 10.1007/s11664-018-06865-1
- By:
- Publication type:
- Article
Effects of Forming Processes on the Microstructure and Solderability of Sn-3.5Ag Eutectic Solder Ribbons as well as the Mechanical Properties of Solder Joints.
- Published in:
- Journal of Electronic Materials, 2017, v. 46, n. 11, p. 6373, doi. 10.1007/s11664-017-5672-9
- By:
- Publication type:
- Article
High-Speed Cyclic Bend Tests and Board-Level Drop Tests for Evaluating the Robustness of Solder Joints in Printed Circuit Board Assemblies.
- Published in:
- Journal of Electronic Materials, 2009, v. 38, n. 6, p. 884, doi. 10.1007/s11664-008-0610-5
- By:
- Publication type:
- Article
Intermetallic Compound Formation and Evolution in Solid-State Sn/Immersion-Ag/Cu Trilayer Interfacial Reactions on a Flexible Polymer Board.
- Published in:
- Journal of Electronic Materials, 2009, v. 38, n. 6, p. 908, doi. 10.1007/s11664-009-0778-3
- By:
- Publication type:
- Article
An Assessment of Immersion Silver Surface Finish for Lead-Free Electronics.
- Published in:
- Journal of Electronic Materials, 2009, v. 38, n. 6, p. 815, doi. 10.1007/s11664-009-0761-z
- By:
- Publication type:
- Article
Thermal Fatigue Endurance of Lead-Free Composite Solder Joints over a Temperature Range of −55°C to 150°C.
- Published in:
- Journal of Electronic Materials, 2009, v. 38, n. 6, p. 843, doi. 10.1007/s11664-009-0772-9
- By:
- Publication type:
- Article
The Influence of an Imposed Current on the Creep of Sn-Ag-Cu Solder.
- Published in:
- Journal of Electronic Materials, 2009, v. 38, n. 2, p. 221, doi. 10.1007/s11664-008-0568-3
- By:
- Publication type:
- Article
Effects of Ag and Al Additions on the Structure and Creep Properties of Sn-9Zn Solder Alloy.
- Published in:
- Journal of Electronic Materials, 2009, v. 38, n. 2, p. 330, doi. 10.1007/s11664-008-0576-3
- By:
- Publication type:
- Article
Di Paul, Inc.: Transitioning in Measured Steps.
- Published in:
- Entrepreneurship: Theory & Practice, 2014, v. 38, n. 2, p. 427, doi. 10.1111/etap.12010
- By:
- Publication type:
- Article
Nitrogen Inerting Technology Can Lower Costs for Electronics Packaging and Assembly.
- Published in:
- Advanced Materials & Processes, 2011, v. 169, n. 6, p. 32
- By:
- Publication type:
- Article
Occupational asthma to gel flux containing dodecanedioic acid.
- Published in:
- 2009
- By:
- Publication type:
- Other
Smartes Trio zur Oberflächenbeschichtung.
- Published in:
- Praktiker, 2020, n. 1/2, p. 26
- By:
- Publication type:
- Article
Study on improving silicone losses in the process of mixing components of soldering machines.
- Published in:
- Annals of the University of Oradea: Facsicle of Management & Technological Engineering, 2018, v. 27, n. 2, p. 155, doi. 10.15660/auofmte.2018-2.3377
- By:
- Publication type:
- Article